Abstract: A composition for the cleaning of residues from substrates from about 0.01 percent by weight to about 5 percent by weight of one or more fluoride compounds, from about 20 percent by weight to about 50 percent by weight water, from about 20 percent by weight to about 80 percent by weight of an organic amide solvent and from 0 to about 50 weight percent of an organic sulfoxide solvent. The composition has a pH between about 7 and about 10. Additionally, the composition optionally contains corrosion inhibitors, chelating agents, surfactants, acids and bases. In use of the composition, a substrate is contacted with the composition for a time and at a temperature that permits cleaning of the substrate.

Abstract: A non-corrosive cleaning composition for removing plasma etching residues comprising water, at least one quaternary ammonium hydroxide, and at least one corrosion inhibitor selected from (i) quaternary ammonium silicates and (ii) catechol nucleus-containing oligomers having a molecular weight in the range of about 220 to about 5,000.

Abstract: A non-corrosive cleaning composition for removing plasma etching residues comprising water, at least one quaternary ammonium hydroxide, and at least one corrosion inhibitor selected from (i) quaternary ammonium silicates and (ii) catechol nucleus-containing oligomers having a molecular weight in the range of about 220 to about 5,000.

Abstract: A stripping and cleaning composition comprising water, at least one amine compound, and at least one corrosion inhibitor selected from (a) quaternary ammonium silicate and (b) a catechol nucleus-containing oligomer having a molecular weight of about 220 to about 5,000, and optionally a polar organic solvent.

Abstract: A photoresist stripping composition containing:(a) 20-70% by weight of an organic polar solvent having a dipole moment of more than 3.5;(b) 70-20% by weight of alkanolamine compounds; and(c) 0.1-10% by weight of 6,6',6"-(1,3,5-triazine-2,4,6-triyltriimino) tris(hexanoic acid).

Abstract: A photoresist stripping composition containing:(a) 20-70% by weight of an organic polar solvent having a dipole moment of more than 3.5;(b) 70-20% by weight of alkanolamine compounds; and(c) 0.1-10% by weight of 2,2'[[methyl-1H-benzothiazol-1-yl)methyl]imino]bis-ethanol.

Abstract: A non-corrosive positive photoresist stripper composition comprising:(a) a solvent selected from N-methyl-2-pyrrolidone, N-hydroxyethyl-2-pyrrolidone, 1,3-dimethyl-2-imidazolidinone dimethylsulfoxide, and admixtures thereof;(b) a corrosion inhibitor selected form tricine, bicine, (2-benzothiozolythio)succinic acid, and admixtures thereof;(c) optionally, an alkanolamine selected from diethyleneglycolamine, monoethanolamine, diethanolamine, triethanolamine, and admixtures thereof;(d) optionally, water; and(e) optionally, a water-soluble surface active compound.

Abstract: A non-corrosive photoresist composition containing:(a) 20-70% by weight of an organic polar solvent having a dipole moment of more than 3.5;(b) 70-20% by weight of selected amine compounds;(c) 0.1-10% by weight of (2-benzothiozolylthio)succinic acid.

Abstract: The advanced polymaleimide reaction product and solutions thereof resulting from the reaction of polymaleimides with alkenylphenols or alkenyl phenol ethers in the presence of specified molar amounts of an amine catalyst at elevated temperatures, the desired degree of resin advancement being reflected in solution stability and melt viscosity values.