Patents by Inventor Taishin Yoshida
Taishin Yoshida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11770639Abstract: The present disclosure relates to a solid-state imaging device, a signal processing method therefor, and an electronic apparatus enabling sensitivity correction in which a sensitivity difference between solid-state imaging devices is suppressed. The solid-state imaging device includes a pixel unit in which one microlens is formed for a plurality of pixels in a manner such that a boundary of the microlens coincides with boundaries of the pixels. The correction circuit corrects a sensitivity difference between the pixels inside the pixel unit based on a correction coefficient. The present disclosure is applicable to, for example, a solid-state imaging device and the like.Type: GrantFiled: August 10, 2021Date of Patent: September 26, 2023Assignee: SONY GROUP CORPORATIONInventors: Youji Sakioka, Masayuki Tachi, Hisashi Nishimaki, Taishin Yoshida
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Publication number: 20230283926Abstract: There is provided an imaging device including a pixel array section including pixel units two-dimensionally arranged in a matrix pattern, each pixel unit including a photoelectric converter, and a plurality of column signal lines disposed according to a first column of the pixel units. The imaging device further includes an analog to digital converter that is shared by the plurality of column signal lines.Type: ApplicationFiled: May 16, 2023Publication date: September 7, 2023Applicant: SONY GROUP CORPORATIONInventors: Atsumi NIWA, Yosuke UENO, Shimon TESHIMA, Daijiro ANAI, Yoshinobu FURUSAWA, Taishin YOSHIDA, Takahiro UCHIMURA, Eiji HIRATA
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Patent number: 11743603Abstract: A solid-state imaging device adapted to encrypt data is described. The solid-state imaging device may include a sensor die comprising an array of imaging pixels formed on a first side of the sensor die and first wiring layers formed on a second side of the sensor die, wherein at least one of the imaging pixels is configured to generate specific signals; a logic die comprising second wiring layers formed on a first side of the logic die; and an encryption processor on the logic die configured to generate encrypted data using the specific signals. The first side of the logic die may be mounted adjacent to the second side of the sensor die and the first wiring layers electrically connect to the second wiring layers, wherein the at least one of the imaging pixels, the encryption processor, and a connecting conductor in which the specific signals pass through from the at least one of the imaging pixels to the encryption processor are located interior to the solid-state imaging device.Type: GrantFiled: November 29, 2017Date of Patent: August 29, 2023Assignee: Sony Semiconductor Solutions CorporationInventors: Yusuke Minagawa, Taishin Yoshida, Marie Toyoshima, Toru Akishita, Tomohiro Morimoto, Masafumi Kusakawa, Ikuhiro Tamura, Takahiro Akahane, Eiji Hirata, Yoshinobu Furusawa
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Patent number: 11696053Abstract: There is provided an imaging device including a pixel array section including pixel units two-dimensionally arranged in a matrix pattern, each pixel unit including a photoelectric converter, and a plurality of column signal lines disposed according to a first column of the pixel units. The imaging device further includes an analog to digital converter that is shared by the plurality of column signal lines.Type: GrantFiled: September 20, 2022Date of Patent: July 4, 2023Assignee: SONY GROUP CORPORATIONInventors: Atsumi Niwa, Yosuke Ueno, Shimon Teshima, Daijiro Anai, Yoshinobu Furusawa, Taishin Yoshida, Takahiro Uchimura, Eiji Hirata
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Publication number: 20230013673Abstract: There is provided an imaging device including a pixel array section including pixel units two-dimensionally arranged in a matrix pattern, each pixel unit including a photoelectric converter, and a plurality of column signal lines disposed according to a first column of the pixel units. The imaging device further includes an analog to digital converter that is shared by the plurality of column signal lines.Type: ApplicationFiled: September 20, 2022Publication date: January 19, 2023Applicant: SONY GROUP CORPORATIONInventors: Atsumi NIWA, Yosuke UENO, Shimon TESHIMA, Daijiro ANAI, Yoshinobu FURUSAWA, Taishin YOSHIDA, Takahiro UCHIMURA, Eiji HIRATA
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Patent number: 11556657Abstract: A solid-state imaging device capable of performing encryption processing with enhanced security by quite extremely safely generating unique information and performing encryption processing based on the generated unique information.Type: GrantFiled: December 10, 2018Date of Patent: January 17, 2023Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Marie Toyoshima, Taishin Yoshida
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Patent number: 11495550Abstract: To generate a value unique to a device in a more preferable mode. A solid-state image sensor includes a plurality of unit pixels disposed in a two-dimensional array, and a drive control unit that controls a first drive to output signals from the unit pixels included in a first unit pixel group of the plurality of unit pixels as an image signal, and a second drive to detect variations in respective signals from two or more of the unit pixels included in a second unit pixel group of the plurality of unit pixels, in which the first unit pixel group and the second unit pixel group have different structures from each other.Type: GrantFiled: November 15, 2018Date of Patent: November 8, 2022Assignee: Sony Semiconductor Solutions CorporationInventors: Marie Toyoshima, Taishin Yoshida
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Patent number: 11483509Abstract: There is provided an imaging device including a pixel array section including pixel units two-dimensionally arranged in a matrix pattern, each pixel unit including a photoelectric converter, and a plurality of column signal lines disposed according to a first column of the pixel units. The imaging device further includes an analog to digital converter that is shared by the plurality of column signal lines.Type: GrantFiled: December 11, 2020Date of Patent: October 25, 2022Assignee: SONY CORPORATIONInventors: Atsumi Niwa, Yosuke Ueno, Shimon Teshima, Daijiro Anai, Yoshinobu Furusawa, Taishin Yoshida, Takahiro Uchimura, Eiji Hirata
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Publication number: 20210377482Abstract: The present disclosure relates to a solid-state imaging device, a signal processing method therefor, and an electronic apparatus enabling sensitivity correction in which a sensitivity difference between solid-state imaging devices is suppressed. The solid-state imaging device includes a pixel unit in which one microlens is formed for a plurality of pixels in a manner such that a boundary of the microlens coincides with boundaries of the pixels. The correction circuit corrects a sensitivity difference between the pixels inside the pixel unit based on a correction coefficient. The present disclosure is applicable to, for example, a solid-state imaging device and the like.Type: ApplicationFiled: August 10, 2021Publication date: December 2, 2021Applicant: SONY GROUP CORPORATIONInventors: Youji SAKIOKA, Masayuki TACHI, Hisashi NISHIMAKI, Taishin YOSHIDA
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Patent number: 11122229Abstract: The present disclosure relates to a solid-state imaging device, a signal processing method therefor, and an electronic apparatus enabling sensitivity correction in which a sensitivity difference between solid-state imaging devices is suppressed. The solid-state imaging device includes a pixel unit in which one microlens is formed for a plurality of pixels in a manner such that a boundary of the microlens coincides with boundaries of the pixels. The correction circuit corrects a sensitivity difference between the pixels inside the pixel unit based on a correction coefficient. The present disclosure is applicable to, for example, a solid-state imaging device and the like.Type: GrantFiled: October 1, 2019Date of Patent: September 14, 2021Assignee: SONY CORPORATIONInventors: Youji Sakioka, Masayuki Tachi, Hisashi Nishimaki, Taishin Yoshida
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Publication number: 20210099660Abstract: There is provided an imaging device including a pixel array section including pixel units two-dimensionally arranged in a matrix pattern, each pixel unit including a photoelectric converter, and a plurality of column signal lines disposed according to a first column of the pixel units. The imaging device further includes an analog to digital converter that is shared by the plurality of column signal lines.Type: ApplicationFiled: December 11, 2020Publication date: April 1, 2021Applicant: SONY CORPORATIONInventors: Atsumi NIWA, Yosuke UENO, Shimon TESHIMA, Daijiro ANAI, Yoshinobu FURUSAWA, Taishin YOSHIDA, Takahiro UCHIMURA, Eiji HIRATA
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Patent number: 10911707Abstract: There is provided an imaging device including a pixel array section including pixel units two-dimensionally arranged in a matrix pattern, each pixel unit including a photoelectric converter, and a plurality of column signal lines disposed according to a first column of the pixel units. The imaging device further includes an analog to digital converter that is shared by the plurality of column signal lines.Type: GrantFiled: April 3, 2020Date of Patent: February 2, 2021Assignee: Sony CorporationInventors: Atsumi Niwa, Yosuke Ueno, Shimon Teshima, Daijiro Anai, Yoshinobu Furusawa, Taishin Yoshida, Takahiro Uchimura, Eiji Hirata
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Publication number: 20200357754Abstract: To generate a value unique to a device in a more preferable mode. A solid-state image sensor includes a plurality of unit pixels disposed in a two-dimensional array, and a drive control unit that controls a first drive to output signals from the unit pixels included in a first unit pixel group of the plurality of unit pixels as an image signal, and a second drive to detect variations in respective signals from two or more of the unit pixels included in a second unit pixel group of the plurality of unit pixels, in which the first unit pixel group and the second unit pixel group have different structures from each other.Type: ApplicationFiled: November 15, 2018Publication date: November 12, 2020Inventors: Marie Toyoshima, Taishin Yoshida
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Publication number: 20200342122Abstract: A solid-state imaging device capable of performing encryption processing with enhanced security by quite extremely safely generating unique information and performing encryption processing based on the generated unique information.Type: ApplicationFiled: December 10, 2018Publication date: October 29, 2020Inventors: MARIE TOYOSHIMA, TAISHIN YOSHIDA
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Publication number: 20200236319Abstract: There is provided an imaging device including a pixel array section including pixel units two-dimensionally arranged in a matrix pattern, each pixel unit including a photoelectric converter, and a plurality of column signal lines disposed according to a first column of the pixel units. The imaging device further includes an analog to digital converter that is shared by the plurality of column signal lines.Type: ApplicationFiled: April 3, 2020Publication date: July 23, 2020Applicant: SONY CORPORATIONInventors: Atsumi NIWA, Yosuke UENO, Shimon TESHIMA, Daijiro ANAI, Yoshinobu FURUSAWA, Taishin YOSHIDA, Takahiro UCHIMURA, Eiji HIRATA
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Patent number: 10659716Abstract: There is provided an imaging device including a pixel array section including pixel units two-dimensionally arranged in a matrix pattern, each pixel unit including a photoelectric converter, and a plurality of column signal lines disposed according to a first column of the pixel units. The imaging device further includes an analog to digital converter that is shared by the plurality of column signal lines.Type: GrantFiled: September 4, 2019Date of Patent: May 19, 2020Assignee: Sony CorporationInventors: Atsumi Niwa, Yosuke Ueno, Shimon Teshima, Daijiro Anai, Yoshinobu Furusawa, Taishin Yoshida, Takahiro Uchimura, Eiji Hirata
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Publication number: 20200029046Abstract: The present disclosure relates to a solid-state imaging device, a signal processing method therefor, and an electronic apparatus enabling sensitivity correction in which a sensitivity difference between solid-state imaging devices is suppressed. The solid-state imaging device includes a pixel unit in which one microlens is formed for a plurality of pixels in a manner such that a boundary of the microlens coincides with boundaries of the pixels. The correction circuit corrects a sensitivity difference between the pixels inside the pixel unit based on a correction coefficient. The present disclosure is applicable to, for example, a solid-state imaging device and the like.Type: ApplicationFiled: October 1, 2019Publication date: January 23, 2020Applicant: SONY CORPORATIONInventors: Youji SAKIOKA, Masayuki TACHI, Hisashi NISHIMAKI, Taishin YOSHIDA
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Patent number: 10542229Abstract: The present disclosure relates to a solid-state imaging device, a signal processing method therefor, and an electronic apparatus enabling sensitivity correction in which a sensitivity difference between solid-state imaging devices is suppressed. The solid-state imaging device includes a pixel unit in which one microlens is formed for a plurality of pixels in a manner such that a boundary of the microlens coincides with boundaries of the pixels. The correction circuit corrects a sensitivity difference between the pixels inside the pixel unit based on a correction coefficient. The present disclosure is applicable to, for example, a solid-state imaging device and the like.Type: GrantFiled: January 17, 2018Date of Patent: January 21, 2020Assignee: Sony CorporationInventors: Youji Sakioka, Masayuki Tachi, Hisashi Nishimaki, Taishin Yoshida
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Publication number: 20200007806Abstract: There is provided an imaging device including a pixel array section including pixel units two-dimensionally arranged in a matrix pattern, each pixel unit including a photoelectric converter, and a plurality of column signal lines disposed according to a first column of the pixel units. The imaging device further includes an analog to digital converter that is shared by the plurality of column signal lines.Type: ApplicationFiled: September 4, 2019Publication date: January 2, 2020Applicant: SONY CORPORATIONInventors: Atsumi NIWA, Yosuke UENO, Shimon TESHIMA, Daijiro ANAI, Yoshinobu FURUSAWA, Taishin YOSHIDA, Takahiro UCHIMURA, Eiji HIRATA
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Publication number: 20190347963Abstract: A solid-state imaging device adapted to encrypt data is described. The solid-state imaging device may include a sensor die comprising an array of imaging pixels formed on a first side of the sensor die and first wiring layers formed on a second side of the sensor die, wherein at least one of the imaging pixels is configured to generate specific signals; a logic die comprising second wiring layers formed on a first side of the logic die; and an encryption processor on the logic die configured to generate encrypted data using the specific signals. The first side of the logic die may be mounted adjacent to the second side of the sensor die and the first wiring layers electrically connect to the second wiring layers, wherein the at least one of the imaging pixels, the encryption processor, and a connecting conductor in which the specific signals pass through from the at least one of the imaging pixels to the encryption processor are located interior to the solid-state imaging device.Type: ApplicationFiled: November 29, 2017Publication date: November 14, 2019Applicant: Sony Semiconductor Solutions CorporationInventors: Yusuke Minagawa, Taishin Yoshida, Marie Toyoshima, Toru Akishita, Tomohiro Morimoto, Masafumi Kusakawa, Ikuhiro Tamura, Takahiro Akahane, Eiji Hirata, Yoshinobu Furusawa