Patents by Inventor Takaaki Funakoshi

Takaaki Funakoshi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device
    Patent number: 8664765
    Abstract: A semiconductor device includes a substrate, an insulating substrate mounted on the substrate, a metal pattern formed on the insulating substrate, an electronic part mounted on the metal pattern across a bond, and a wire member, separate from a wiring wire, which contains a material repellent to the bond and is formed on the metal pattern and around the electronic part.
    Type: Grant
    Filed: September 8, 2011
    Date of Patent: March 4, 2014
    Assignee: Fuji Electric Co., Ltd.
    Inventors: Kazunaga Onishi, Yoshikazu Takamiya, Takaaki Funakoshi, Yoshihiro Kodaira
  • SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
    Publication number: 20130020725
    Abstract: A semiconductor device includes a substrate, an insulating substrate mounted on the substrate, a metal pattern formed on the insulating substrate, an electronic part mounted on the metal pattern across a bond, and a wire member, separate from a wiring wire, which contains a material repellent to the bond and is formed on the metal pattern and around the electronic part.
    Type: Application
    Filed: September 8, 2011
    Publication date: January 24, 2013
    Applicant: FUJI ELECTRIC CO., LTD.
    Inventors: Kazunaga Onishi, Yoshikazu Takamiya, Takaaki Funakoshi, Yoshihiro Kodaira