Patents by Inventor Takaaki Osaka

Takaaki Osaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing an interboard connection terminal
    Patent number: 4897918
    Abstract: A stack layer structure is formed wherein solderable metal layers are provided at least at two ends thereof, and at least a metal layer for preventing the diffusion of solder is inserted between the two metal layers. In an interboard connection terminal and a method of manufacturing the same, a pair of solder bumps are fixed to be in contact with the two surfaces of the resultant stack layer structure.
    Type: Grant
    Filed: March 25, 1988
    Date of Patent: February 6, 1990
    Assignee: Nippon Telegraph and Telephone
    Inventors: Takaaki Osaka, Norio Matsui, Shinichi Susaki, Yutaka Egawa