Abstract: A support pin arrangement determination assisting apparatus includes: a display unit which displays a board image indicating an already mounted component; a position input unit through which an arrangement position of a support pin is input to the displayed image; and a pin image display processing unit which causes the display unit to display a composite image in which a pin arrangement image indicating the input arrangement position is superimposed on the board image. A planar image of the support pin in the pin arrangement image includes an image of a top portion of a shaft erected in a board holding unit and an image of a contact portion which is located on a tip side of the top portion, which has a sectional shape smaller than that of the top portion, and which contacts and supports a lower surface of the board.

Abstract: A support pin arrangement determination assisting apparatus includes: a display unit which displays a first board image indicating an already mounted component on the already mounted surface and a second board image indicating a component to be mounted on a mounting subject surface; a position input unit through which an arrangement position of a support pin is input to the displayed images; and a pin image display processing unit which causes the display unit to display a composite image in which a pin arrangement image indicating the input arrangement positions is superimposed on the first board image or the second board image. The pin image display processing unit can cause display of a composite image based on the first board image and a composite image based on the second board image in a switched manner.

Abstract: An integrated circuit device comprises a first integrated circuit chip; and a plurality of second integrated circuit chips each stacked on the first integrated circuit chip, wherein the first integrated circuit chip includes a plurality of first connection portions for respectively connecting to the second integrated circuit chips, the second integrated circuit chips each includes a second connection portion that is connected to one of the first connection portions of the first integrated circuit chip, and the second integrated circuit chips are arranged on the same surface of the first integrated circuit chip, such that the same signal is output from the first connection portions of the first integrated circuit chip to the respective second connection portions of the plurality of second integrated circuit chips.

Abstract: A storage battery includes a power storage element, a battery case, an internal insulating member, a second electrode terminal, an external insulating member. The power storage element has a stacked structure of a positive plate, a negative plate, and a separator. The battery case includes a first case and a second case that create a space to house the power storage element. The battery case is electrically connected with one electrode of the power storage element and includes a first electrode terminal. The internal insulating member is disposed in the space. The second electrode terminal is connected with the other electrode via the internal insulating member and disposed on a periphery of the battery case at a position different from the connecting part. The external insulating member insulates the second electrode terminal from the battery case.

Abstract: A data processing apparatus has: a generation unit for generating a sync signal related to a frame period of moving image data; a plurality of processing units each for executing a processing in accordance with the sync signal; a memory; and a memory control unit for accepting access requests to the memory from the plurality of processing units and control a data transfer between each of the plurality of processing units and the memory in accordance with the access request. The memory control unit sets a first period to mask the access request from a predetermined processing unit among the plurality of processing units in accordance with the sync signal and does not accept the access request from the predetermined processing unit in the first period.

Abstract: It is intended to provide an electronic component mounting device and an operation performing method for mounting electronic components so that both the operation quality and the productivity can be improved. In operation performing procedures, when an electronic component belongs to the first division, an operating head is made to move up and down based on an approximate operation position height derived from an approximate curved surface of the top surface of a board which is calculated by using the height measurement result obtained by measuring a plurality of height measuring points on the surface of the board, and when the electronic component belongs to the second division, the operating head is made to move up and down based on an individual operation position height obtained by individually measuring the board height at the operation position.

Abstract: Rectangular battery cells 30A and 30B are used for the battery stack 10. Each of the battery cells 30A and 30B includes: a batter casing 32 having: a reference surface 32a defined by a first direction and a second direction orthogonal to each other; and a terminal support surface 32b extended from an end of the reference surface 32a toward a third direction orthogonal to both the first direction and the second direction; and a positive electrode terminal 34p and a negative electrode terminal 34n protruded from the terminal support surface 32b and arranged at a predetermined distance from each other in the first direction. The positive electrode terminal 34p and the negative electrode terminal 34n are located at positions of different distances in the first direction from the center of the terminal support surface 32b.

Abstract: An image pickup apparatus capable of performing favorable focusing operation when image signals are read out from an image pickup device at a high speed while flickers are occurring. Flickers are detected from image signals outputted from the image pickup device, while the image signals outputted from the image pickup device is stored. The image signals outputted from the image pickup device and the image signals stored in a first memory are synthesized depending on the flicker detection result. A position of a focus lens is adjusted by selectively using any one of the image signals outputted from the image pickup device and the synthesized image signal. When the image pickup device performs reading images in a cycle shorter than a flicker cycle, image synthesis is performed depending on the brightness of the image signals outputted from the image pickup device.

Abstract: It is intended to provide an electronic component mounting device and an operation performing method for mounting electronic components so that both the operation quality and the productivity can be improved. Height precision division information that divide the height precision required for up and down movements of operating heads into the first division which indicates a normal height precision and the second division which indicates that a high height precision is required based on the type of electronic components are stored as operation data beforehand.

Abstract: An image pickup apparatus capable of performing favorable focusing operation when image signals are read out from an image pickup device at a high speed while flickers are occurring. Flickers are detected from image signals outputted from the image pickup device, while the image signals outputted from the image pickup device is stored. The image signals outputted from the image pickup device and the image signals stored in a first memory are synthesized depending on the flicker detection result. A position of a focus lens is adjusted by selectively using any one of the image signals outputted from the image pickup device and the synthesized image signal. When the image pickup device performs reading images in a cycle longer than a flicker cycle, image synthesis is performed depending on the brightness of the image signals outputted from the image pickup device.

Abstract: According to the present invention, mounting conditions are determined to become closer to a setting value of a parameter regarding electricity consumption. The present invention provides a method of determining mounting conditions under which a piece of equipment mounts a component onto a substrate. The method includes: obtaining a setting value of a parameter regarding electricity consumption required to mount the component; obtaining an actual value of the parameter based on current mounting conditions; and determining new mounting conditions based on a result of comparing the setting value with the actual value.

Abstract: The present invention allows a parts remaining number to be efficiently controlled using adaptability check result of an electronic part added during operation, and allows the electronic part to be mounted without mistake.

Abstract: The present invention allows a parts remaining number to be efficiently controlled using adaptability check result of an electronic part added during operation, and allows the electronic part to be mounted without mistake.