Patents by Inventor Takafumi Imai

Takafumi Imai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5489662
    Abstract: A process for the preparation of an organosilicon polymer, which comprises reacting one equivalent of a bis(alkoxysilyl) compound represented by the following general formula:R.sup.1 R.sup.2 R.sup.3 Si--(A).sub.p --SiR.sup.1 R.sup.2 R.sup.3wherein R.sup.1, R.sup.2 and R.sup.3 each represents the same or different substituted or unsubstituted monovalent hydrocarbon group or an alkoxy group, with the proviso that at least one of R.sup.1, R.sup.2 and R.sup.3 is an alkoxy group; A represents a divalent aromatic group, a divalent conjugated or nonconjugated unsaturated aliphatic group, or a divalent saturated aliphatic group; and p represents an integer of 1 or more, with one or more equivalents of an alkoxydisilane represented by the following general formula:(OR.sup.4).sub.6-n Si.sub.2 (R.sup.5).sub.nwherein R.sup.4 and R.sup.
    Type: Grant
    Filed: August 31, 1994
    Date of Patent: February 6, 1996
    Assignee: Toshiba Silicone Co., Ltd.
    Inventors: Shigeru Wakamatsu, Keiji Kabeta, Takafumi Imai
  • Patent number: 4760123
    Abstract: Room temperature curing polyorganosiloxane compositions comprising:(A) 100 parts by weight of a composition containing(1) a polyorganosiloxaneR.sup.1.sub.a (R.sup.2 O).sub.3-a SiO[R.sup.2 SiO].sub.n Si(OR.sup.2).sub.3-a R.sup.1.sub.awherein R represents a substituted or unsubstituted monovalent hydrocarbon group; which the viscosity of (A) at 25.degree. C. may be 100 to 500,000 cP,which is reactive at the terminal groups and(2) a silane of the formula:R.sup.3.sub.b Si(OR.sup.4).sub.4-bwherein R represents substituted or unsubstituted monovalent hydrocarbon groups; b is a numeral of 0 or 1,or a hydrolyzate thereof,wherein (A)(1) is 85 to 100% by weight of the total of (A)(1) and (A)(2);(B) 0.01 to 10 parts by weight of a curing catalyst;(C) 0.5 to 10 parts by weight of a nitrogen containing silicon compound, wherein a nitrogen atom is bonded to a silicon atom via one or more carbon atoms and the nitrogen atom is also bonded directly to the same silicon atom or another silicon atom; and(D) 0.
    Type: Grant
    Filed: September 9, 1986
    Date of Patent: July 26, 1988
    Assignee: Toshiba Silicone Co., Ltd
    Inventors: Takafumi Imai, Fumihiko Kobayashi
  • Patent number: 4725648
    Abstract: The present invention relates to a polyorganosiloxane composition and, more particularly, to a polyorganosiloxane composition having good curing properties at room temperature and producing cured materials having good water absorption properties. The polyorganosiloxane composition comprises:(A) a curable silicone rubber composition containing polysiloxane which is liquid at room temperature as a base polymer; and(B) a polymer containing acrylic acid or an alkali metal salt of acrylic acid as a monomer unit.
    Type: Grant
    Filed: October 7, 1986
    Date of Patent: February 16, 1988
    Assignee: Toshiba Silicone Co., Ltd.
    Inventors: Tetsuo Fujimoto, Hideaki Takaoka, Takafumi Imai
  • Patent number: 4537944
    Abstract: The present invention provides a room temperature curable polyorganosiloxane composition comprising:(A) 100 parts by weight in total of:(1) a polydiorganosiloxane of the general formula: ##STR1## (2) a silane of the general formula:R.sub.b.sup.3 Si(OR.sup.4).sub.4-b(B) 0.01 to 10 parts by weight of a curing catalyst;(C) 0.5 to 10 parts by weight of a nitrogen-containing silicon compound in which the nitrogen atom is bonded with a silicon atom through one or more carbon atoms and said nitrogen atom is further bonded directly with said silicon atom or another silicon atom; and(D) 0.05 to 50 parts by weight of a polyoxyalkylene chain-containing compound.
    Type: Grant
    Filed: June 21, 1984
    Date of Patent: August 27, 1985
    Assignee: Toshiba Silicone Co., Ltd.
    Inventors: Takafumi Imai, Fumihiko Kobayashi