Abstract: According to the present disclosure, a manufacturing method of a fine wiring pattern is disclosed. The manufacturing method includes preparing a support member, forming a first layer on the support member by thick-film printing, and forming a second layer including Ag on the first layer by the thick-film printing. The method also includes forming a predetermined fine wiring pattern by performing an etching process upon the first layer and the second layer.

Abstract: According to the present disclosure, a manufacturing method of a fine wiring pattern is disclosed. The manufacturing method includes preparing a support member, forming a first layer on the support member by thick-film printing, and forming a second layer including Ag on the first layer by the thick-film printing. The method also includes forming a predetermined fine wiring pattern by performing an etching process upon the first layer and the second layer.

Abstract: According to the present disclosure, a manufacturing method of a fine wiring pattern is disclosed. The manufacturing method includes preparing a support member, forming a first layer on the support member by thick-film printing, and forming a second layer including Ag on the first layer by the thick-film printing. The method also includes forming a predetermined fine wiring pattern by performing an etching process upon the first layer and the second layer.

Abstract: A chip resistor is provided which comprises an insulating chip substrate, a resistor element formed on the chip substrate, a first pair of electrode terminals branching out from one end of the resistor element, and a second pair of electrode terminals branching out from the other end of the resistor element. One of the first pair electrode terminals is a current terminal while the other of the first pair electrode terminals is a voltage terminal. Similarly, one of the second pair electrode terminals is a current terminal, and the other of the second pair electrode terminals is a voltage terminal.

Abstract: A square chip resistor in which, when the protective glass layers are fired, a powder of an inorganic material such as alumina or the like having a greater thermal expansion coefficient than glass is mixed into glass paste to thereby adjust the thermal expansion coefficient of the protective glass layers. This makes it possible to prevent generation of any crack on the glass surface due to a stress produced by a difference between the thermal expansion coefficients of the glass layer and an alumina substrate.