Abstract: The present disclosure provides a substrate processing method including: a preparation process of placing a target substrate on a stage within a processing container; a first heating process of supplying a first gas into the processing container and heating the target substrate with a heater; a second heating process of stopping the supply of the first gas, supplying a second gas different from the first gas, and heating the target substrate with the heater; and a processing process of processing the target substrate by supplying the second gas and a third gas.

Abstract: A plasma processing apparatus includes: a stage on which a substrate is placed; a chamber in which the stage is provided; a plasma source configured to introduce a microwave into the chamber from a ceiling wall of the chamber so as to generate surface wave plasma inside the chamber; and at least one gas discharger configured to discharge a gas toward the stage. The at least one gas discharger is configured to adjust a gas discharge position in a predetermined plane and a distance from a center of the stage to the gas discharge position by changing a gas supply path existing inside the at least one gas discharger.

Abstract: A substrate processing method includes: a step of preparing a substrate in a chamber of a substrate processing apparatus; a step of correcting a set power value based on a correction value Y from Equation (1), coefficients A, B, C, and D, and a variable X indicating a processed amount of the substrates having been subjected to continuous film formation processes, referring to a storage in which the coefficients A, B, C, and D of the Equation (1) used to calculate the correction value Y for the set power value are stored; and a step of processing the prepared substrate by applying power with the corrected power value into the chamber, the Equation (1) is expressed as Y=Aexp(BX)+CX+D, where at least one of the coefficients A, C, and D is not zero, and when the coefficient A is not zero, the coefficient B is also not zero.

Abstract: A method for cleaning a microwave plasma processing apparatus which has a processing container and a microwave radiation part, and which has a window part provided at a position where the microwave radiation part is disposed in the processing container, includes a cleaning step of adjusting a pressure to a pressure corresponding to a size of a cleaning target part, among parts within the processing container including a wall surface of the processing container, the microwave radiation part, and the window part, while supplying a cleaning gas, and performing a cleaning process using plasma of the cleaning gas.

Abstract: Provided is a method for cleaning a microwave plasma processing apparatus which has a processing container and a microwave radiation part, and which has a window part provided at a position where the microwave radiation part is disposed in the processing container. The method includes a cleaning step of adjusting a pressure to a pressure corresponding to a size of a cleaning target part, among parts within the processing container including a wall surface of the processing container, the microwave radiation part, and the window part, while supplying a cleaning gas, and performing a cleaning process using plasma of the cleaning gas.

Abstract: A plasma processing apparatus for performing a plasma process on a workpiece inside a processing container by radiating microwaves from an antenna into the processing container through a top plate of the processing container to generate plasma, which includes: a pressing member having grooves formed in a surface facing the top plate, and configured to press the antenna against the top plate; and elastic members respectively disposed in the grooves and deformed while being sandwiched between the pressing member and the antenna, and configured to apply a pressing force to the antenna toward the processing container. The grooves and the elastic members are respectively provided in concentric annular regions each having a center coinciding with a predetermined axis perpendicular to the top plate, and the elastic members are disposed only in a portion of the annular regions.

Abstract: A plasma processing apparatus for performing a plasma process on a workpiece inside a processing container by radiating microwaves from an antenna into the processing container through a top plate of the processing container to generate plasma, which includes: a pressing member having grooves formed in a surface facing the top plate, and configured to press the antenna against the top plate; and elastic members respectively disposed in the grooves and deformed while being sandwiched between the pressing member and the antenna, and configured to apply a pressing force to the antenna toward the processing container. The grooves and the elastic members are respectively provided in concentric annular regions each having a center coinciding with a predetermined axis perpendicular to the top plate, and the elastic members are disposed only in a portion of the annular regions.

Abstract: A support apparatus for plasma adjustment includes a storage part storing index value estimation data including data defining an amount of change in an index value between adjustment positions for each of the adjustment parts, the index value corresponding to electron density of plasma, an input part for inputting a measurement result of the index value obtained when plasma is generated and the adjustment positions of the adjustment parts, and a data processing part configured to estimate the index value for each of adjustment positions of the adjustment parts based on input items input to the input part and the estimation data and configured to select proper combinations of the adjustment positions of the adjustment parts based on combinations of the adjustment positions of the adjustment parts and estimated values of a plurality of index values in the circumferential direction corresponding to the respective combinations.

Abstract: Disclosed is a microwave plasma processing apparatus including: a chamber that accommodates a workpiece; a microwave generating source that generates microwaves; a waveguide unit that guides the microwaves toward the chamber; a planar antenna made of a conductor having a plurality of slots that radiate the microwaves toward the chamber; a microwave-transmitting plate made of a dielectric material that constitutes a top wall of the chamber and transmits the microwaves radiated from the plurality of slots; a gas supply mechanism that supplies a gas into the chamber; and an exhaust mechanism that exhausts an atmosphere in the chamber. The planar antenna includes a plurality of slot groups each forming one unit including one or more of the slots, and the slots are formed so as to form an odd number of the slot groups equal to or more than three in a circumferential direction.

Abstract: A computer network comprising a monitoring apparatus and a plurality of servers, wherein the servers respectively have a plurality of software programs, and a data file for storing error analysis information to be utilized for analysis of the cause of an error upon occurrence of error, for each software program. Further, the servers respectively have a function to transmit an error notifying message including a software identifier of a software program executed upon occurrence of error to the monitoring apparatus. The monitoring terminal apparatus has a function to instruct at least one server, specified based on the software identifier included in the error notifying message, to save error analysis information, in response to the error notifying message received from any one of the servers.

Abstract: A computer network comprising a monitoring apparatus and a plurality of servers, wherein the servers respectively have a plurality of software programs, and a data file for storing error analysis information to be utilized for analysis of the cause of an error upon occurrence of error, for each software program. Further, the servers respectively have a function to transmit an error notifying message including a software identifier of a software program executed upon occurrence of error to the monitoring apparatus. The monitoring terminal apparatus has a function to instruct at least one server, specified based on the software identifier included in the error notifying message, to save error analysis information, in response to the error notifying message received from any one of the servers.

Abstract: A computer network comprising a monitoring apparatus and a plurality of servers, wherein the servers respectively have a plurality of software programs, and a data file for storing error analysis information to be utilized for analysis of the cause of an error upon occurrence of error, for each software program. Further, the servers respectively have a function to transmit an error notifying message including a software identifier of a software program executed upon occurrence of error to the monitoring apparatus. The monitoring terminal apparatus has a function to instruct at least one server, specified based on the software identifier included in the error notifying message, to save error analysis information, in response to the error notifying message received from any one of the servers.

Abstract: A method and a system for analyzing the operation of a parallel data system are disclosed. The history information of the access executed by a specific processor that has received a request for access to a plurality of data bases connected to a plurality of processors, the ID of the specific processor and the accessed data amount are collected and stored in a memory. The history information is compared with the time assumed from a predetermined time specified for the access to a unit amount of data in data bases, deciding whether the former is reasonable or longer than the latter. The transfer history information for the processor that has transferred an access request to the specific processor executing the access is compared with a predetermined transfer time specified for a unit amount of data, deciding whether the transfer time between the two processors is longer than an assumed transfer time.