Patents by Inventor Takafumi Nomura

Takafumi Nomura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240161330
    Abstract: According to one embodiment, an information processor includes a gaze area registration unit, an object registration unit, a learning unit, a work process registration unit, and an output unit. The gaze area registration unit receives registration of a gaze area. The object registration unit receives registration of an object used in work. The learning unit learns a transition in the presence or absence of the object in the gaze area or a transition in the state of the object according to the progress of the work based on a training image that contains the object. The work process registration unit receives registration of information related to work processes, which are obtained by breaking down the work into elements and defined based on the transition. The output unit outputs a verification result regarding the work processes included in the work captured, which is obtained based on learning in the learning unit.
    Type: Application
    Filed: April 18, 2023
    Publication date: May 16, 2024
    Applicant: RUTILEA, Inc.
    Inventors: Takafumi YANO, Kyosuke SHIBATA, Shabani FARHAD, Kotaro NOMURA
  • Patent number: 11969575
    Abstract: A medical infusion pump includes: a reader configured to read identification information stored in an RF tag by wireless communication; and a control unit configured to set information about administration of a drug based on the identification information read from the RF tag. In a case in which the reader reads two different pieces of the identification information, the control unit selects only one piece of the identification information out of the two different pieces of the identification information and sets the information about administration based on said one piece of the identification information.
    Type: Grant
    Filed: April 20, 2022
    Date of Patent: April 30, 2024
    Assignee: TERUMO KABUSHIKI KAISHA
    Inventors: Takayuki Katsunuma, Takafumi Nomura
  • Publication number: 20220241496
    Abstract: A medical infusion pump includes: a reader configured to read identification information stored in an RF tag by wireless communication; and a control unit configured to set information about administration of a drug based on the identification information read from the RF tag. In a case in which the reader reads two different pieces of the identification information, the control unit selects only one piece of the identification information out of the two different pieces of the identification information and sets the information about administration based on said one piece of the identification information.
    Type: Application
    Filed: April 20, 2022
    Publication date: August 4, 2022
    Applicant: TERUMO KABUSHIKI KAISHA
    Inventors: Takayuki Katsunuma, Takafumi Nomura
  • Patent number: 8992834
    Abstract: A blood glucose level measuring apparatus and measurement data management apparatus are provided which can carry out measurement of the blood glucose level of a plurality of patients relatively rapidly and reliably, while also addressing emergency situations. The blood glucose level measuring apparatus includes a patient identifier, blood glucose level measuring device, a date/time counter, a display, and a controller. The controller controls in a normal measurement mode the cross-checking of patient identification information and a patient data table, and then, if patient identification information is not found, measurement of the blood glucose level is inhibited. The controller also controls in an emergency measurement mode in which carrying out of measurement of the blood glucose level is permitted without acquiring the patient identification information by the patient identifier.
    Type: Grant
    Filed: March 30, 2011
    Date of Patent: March 31, 2015
    Assignee: Terumo Kabushiki Kaisha
    Inventors: Takafumi Nomura, Kou Ishikawa, Masayoshi Suda, Toshihisa Nakamura, Hideyuki Momoki
  • Publication number: 20140206971
    Abstract: An analyte monitoring system, which can be used to monitor blood sugar, is provided with a sensor which detects a plurality of blood sugar levels in blood on the basis of a sampling interval, a meal data setting unit which sets information based on meal contents, and a sampling interval setting unit which sets the sampling interval of the sensor using the information based on meal contents set by the meal data setting unit. By predicting a fluctuation curve of the blood sugar level after a meal by information based on meal contents to thereby change the sampling interval, a fluctuation state of the blood sugar level can be efficiently monitored.
    Type: Application
    Filed: March 25, 2014
    Publication date: July 24, 2014
    Applicant: TERUMO KABUSHIKI KAISHA
    Inventors: Yu Torai, Takafumi Nomura
  • Publication number: 20110196218
    Abstract: A blood glucose level measuring apparatus and measurement data management apparatus are provided which can carry out measurement of the blood glucose level of a plurality of patients relatively rapidly and reliably, while also addressing emergency situations. The blood glucose level measuring apparatus includes a patient identifier, blood glucose level measuring device, a date/time counter, a display, and a controller. The controller controls in a normal measurement mode the cross-checking of patient identification information and a patient data table, and then, if patient identification information is not found, measurement of the blood glucose level is inhibited. The controller also controls in an emergency measurement mode in which carrying out of measurement of the blood glucose level is permitted without acquiring the patient identification information by the patient identifier.
    Type: Application
    Filed: March 30, 2011
    Publication date: August 11, 2011
    Applicant: Terumo Kabushiki Kaisha
    Inventors: Takafumi Nomura, Kou Ishikawa, Masayoshi Suda, Toshihisa Nakamura, Hideyuki Momoki
  • Patent number: 6929169
    Abstract: A method for soldering an electronic component is provided. A first solder land containing copper and a second solder land are formed on a surface of a circuit board. A first solder section composed of a Sn—Ag—Cu solder material is formed on each of the first and the second solder lands, and a terminal of an electronic component chip is mounted on the first solder land. The first solder land and the terminal are fusion-bonded. A second solder section composed of a Sn—Zn solder material is formed on the first solder section disposed on the second solder land. A lead terminal of another electronic component is inserted into a terminal hole formed near the second solder land; and the second solder section and the lead terminal are heated at a temperature lower than the previous temperature to connect the lead terminal to the second solder section by fusion bonding.
    Type: Grant
    Filed: October 1, 2003
    Date of Patent: August 16, 2005
    Assignee: Alps Electric Co., Ltd.
    Inventors: Teruyoshi Kubokawa, Kunio Kosaka, Takafumi Nomura
  • Publication number: 20050127143
    Abstract: A method for soldering an electronic component is provided. A first solder land containing copper and a second solder land are formed on a surface of a circuit board. A first solder section composed of a Sn—Ag—Cu solder material is formed on each of the first and the second solder lands, and a terminal of an electronic component chip is mounted on the first solder land. The first solder land and the terminal are fusion-bonded. A second solder section composed of a Sn—Zn solder material is formed on the first solder section disposed on the second solder land. A lead terminal of another electronic component is inserted into a terminal hole formed near the second solder land; and the second solder section and the lead terminal are heated at a temperature lower than the temperature in step (d) to connect the lead terminal to the second solder section by fusion bonding.
    Type: Application
    Filed: January 27, 2005
    Publication date: June 16, 2005
    Inventors: Teruyoshi Kubokawa, Kunio Kosaka, Takafumi Nomura
  • Publication number: 20040065718
    Abstract: A method for soldering an electronic component is provided. A first solder land containing copper and a second solder land are formed on a surface of a circuit board. A first solder section composed of a Sn—Ag—Cu solder material is formed on each of the first and the second solder lands, and a terminal of an electronic component chip is mounted on the first solder land. The first solder land and the terminal are fusion-bonded. A second solder section composed of a Sn—Zn solder material is formed on the first solder section disposed on the second solder land. A lead terminal of another electronic component is inserted into a terminal hole formed near the second solder land; and the second solder section and the lead terminal are heated at a temperature lower than the temperature in step (d) to connect the lead terminal to the second solder section by fusion bonding.
    Type: Application
    Filed: October 1, 2003
    Publication date: April 8, 2004
    Applicant: Alps Electric Co., Ltd.
    Inventors: Teruyoshi Kubokawa, Kunio Kosaka, Takafumi Nomura