Patents by Inventor Takaharu Hashimoto
Takaharu Hashimoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8118591Abstract: A heat shield plate for a substrate annealing apparatus is provided with a horizontally supported flat-plate-like substrate 1, a heater 5 positioned above the substrate to heat the upper surface of the substrate with radiation heat, and a heat shield plate 10 horizontally movable between a shielding position where the substrate is shielded from heater and an open position out of the shielding position. The heat shield plate 10 is composed of a structural member 12 made of a low thermal expansion material (carbon composite material) which is hardly deformed due to a temperature difference in the shielding position, and a heat insulating member 14 which covers the upper surface of the structural member and keeps the surface at an allowable temperature or below.Type: GrantFiled: March 15, 2007Date of Patent: February 21, 2012Assignee: IHI CorporationInventors: Terumasa Ishihara, Takaharu Hashimoto, Masayuki Mizuno, Masaru Morita
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Patent number: 7712303Abstract: A degradation estimating apparatus for an unburned fuel component adsorption catalyst, which is connected with an internal combustion engine and has an unburned fuel component adsorbent and an oxygen storage component is provided. The apparatus includes a degradation estimating unit for making estimation for a degradation of the unburned fuel component adsorption catalyst on the basis of a first term and a second term. The first term is from the cancellation of the fuel supply to detecting a variation of an upstream side air-fuel ratio occurring due to the increase of the reductant quantity in the exhaust gas. The second term is from the cancellation of the fuel supply to detecting of a variation of the downstream side air-fuel ratio due to an increase of the reductant quantity.Type: GrantFiled: April 20, 2006Date of Patent: May 11, 2010Assignee: Mitsubishi Jidosha Kogyo Kabushiki KaishaInventors: Hiroshi Tanada, Yasuyuki Hatsuda, Takehisa Fujita, Takaharu Hashimoto, Keisuke Tashiro, Mizuki Anai, Mitsutaka Kojima, Masayuki Yamashita, Katsuhiko Miyamoto
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Publication number: 20090029308Abstract: A heat shield plate for a substrate annealing apparatus is provided with a horizontally supported flat-plate-like substrate 1, a heater 5 positioned above the substrate to heat the upper surface of the substrate with radiation heat, and a heat shield plate 10 horizontally movable between a shielding position where the substrate is shielded from heater and an open position out of the shielding position. The heat shield plate 10 is composed of a structural member 12 made of a low thermal expansion material (carbon composite material) which is hardly deformed due to a temperature difference in the shielding position, and a heat insulating member 14 which covers the upper surface of the structural member and keeps the surface at an allowable temperature or below.Type: ApplicationFiled: March 15, 2007Publication date: January 29, 2009Applicant: IHI CORPORATIONInventors: Terumasa Ishihara, Takaharu Hashimoto, Masayuki Mizuno, Masaru Morita
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Publication number: 20060236678Abstract: The present invention relates to a degradation estimating apparatus for an unburned fuel component adsorption catalyst, which is connected with an internal combustion engine and has an unburned fuel component adsorbent and an oxygen storage component. The apparatus includes a degradation estimating unit for making estimation for a degradation of the unburned fuel component adsorption catalyst on the basis of a first term and a second term. The first term that is from the cancellation of the fuel supply to detecting a variation of an upstream side air-fuel ratio occurring due to the increase of the reductant quantity in the exhaust gas. The second term that is from the cancellation of the fuel supply to detecting of a variation of the downstream side air-fuel ratio due to an increase of the reductant quantity.Type: ApplicationFiled: April 20, 2006Publication date: October 26, 2006Inventors: Hiroshi Tanada, Yasuyuki Hatsuda, Takehisa Fujita, Takaharu Hashimoto, Keisuke Tashiro, Mizuki Anai, Mitsutaka Kojima, Masayuki Yamashita, Katsuhiko Miyamoto
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Patent number: 7059122Abstract: The exhaust gas purification apparatus for an engine comprises, a catalytic converter provided in an exhaust path of the engine and including a carrier, an HC absorbent, an HC purifying catalyst, and a transition metal, and a control apparatus for controlling operation of the engine, the control apparatus including an HC desorption timing estimation section for estimating a timing at which the HC is desorbed from the HC absorbent and a control section for controlling an air fuel ratio upon starting of the engine to a ratio richer than a stoichiometric air fuel ratio to start operation of the engine and changing over the air fuel ratio to a ratio leaner than the stoichiometric air fuel ratio at the timing at which the HC is desorbed based on an output of the HC desorption timing estimation section.Type: GrantFiled: August 29, 2003Date of Patent: June 13, 2006Assignee: Mitsubishi Jidosha Kogyo Kabushiki KaishaInventors: Hiroshi Tanada, Takaharu Hashimoto
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Publication number: 20050011182Abstract: The invention provides an exhaust gas purification apparatus which can efficiently purify HC in exhaust gas of an engine upon cold starting of the engine. The exhaust gas purification apparatus for an engine comprises a catalytic converter provided in an exhaust path of the engine and including a carrier, an HC absorbent, an HC purifying catalyst, and a transition metal, and a control apparatus for controlling operation of the engine, the control apparatus including an HC desorption timing estimation section for estimating a timing at which the HC is desorbed from the HC absorbent and a control section for controlling an air fuel ratio upon starting of the engine to a ratio richer than a stoichiometric air fuel ratio to start operation of the engine and changing over the air fuel ratio to a ratio leaner than the stoichiometric air fuel ratio at the timing at which the HC is desorbed based on an output of the HC desorption timing estimation section.Type: ApplicationFiled: August 29, 2003Publication date: January 20, 2005Inventors: Hiroshi Tanada, Takaharu Hashimoto
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Patent number: 6798032Abstract: A SnO2 film having a prescribed pattern feature is formed on a substrate by a wet film-formation technology (e.g., sol-gel method). A Ni film is formed on the SnO2 film by an electroless plating method. The electroless plating method is conducted in the presence of at least one sulfur-containing compound selected from the group consisting of thiosulfates, thiocyanates and sulfur-containing organic compounds.Type: GrantFiled: June 5, 2003Date of Patent: September 28, 2004Assignees: Sharp Kabushiki Kaisha, Meltex Inc., Sumitomo Osaka Cemento Co., Ltd.Inventors: Yoshihiro Izumi, Yoshimasa Chikama, Satoshi Kawashima, Takaharu Hashimoto, Itsuji Yoshikawa, Masaaki Ishikawa
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Patent number: 6770978Abstract: There is provided is a metal line structure in which no defect of blistering occurs on a surface of a Cu/Ni film or a Cu/Au/Ni film even if an Ni plating thickness is reduced. According to this metal line 1, in a Cu/Au/Ni film structure in which an Au film 13 and a Cu film 15 are successively laminated by electroless plating on an Ni film 12 formed by electroless plating, the Ni film 12 has a phosphorus content x of 10 wt %≦x≦15 wt %. It was discovered through experiments that the so-called high phosphorus content type Ni film 12 having a phosphorus content x of 10 to 15 percent by weight became a fine smooth film under a condition of a film thickness of 0.1 &mgr;m or greater.Type: GrantFiled: February 28, 2001Date of Patent: August 3, 2004Assignee: Sharp Kabushiki KaishaInventors: Yoshihiro Izumi, Yoshimasa Chikama, Satoshi Kawashima, Takaharu Hashimoto
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Publication number: 20030207567Abstract: A SnO2 film having a prescribed pattern feature is formed on a substrate by a wet film-formation technology (e.g., sol-gel method). A Ni film is formed on the SnO2 film by an electroless plating method. The electroless plating method is conducted in the presence of at least one sulfur-containing compound selected from the group consisting of thiosulfates, thiocyanates and sulfur-containing organic compounds.Type: ApplicationFiled: June 5, 2003Publication date: November 6, 2003Applicants: Sharp Kabushiki Kaisha, Meltex, Inc., Sumitomo Osaka Cemento Co., Ltd.Inventors: Yoshihiro Izumi, Yoshimasa Chikama, Satoshi Kawashima, Takaharu Hashimoto, Itsuji Yoshikawa, Masaaki Ishikawa
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Patent number: 6627544Abstract: A SnO2 film having a prescribed pattern feature is formed on a substrate by a wet film-formation technology (e.g., sol-gel method). A Ni film is formed on the SnO2 film by an electroless plating method. The electroless plating method is conducted in the presence of at least one sulfur-containing compound selected from the group consisting of thiosulfates, thiocyanates and sulfur-containing organic compounds.Type: GrantFiled: May 22, 2002Date of Patent: September 30, 2003Assignees: Sharp Kabushiki Kaisha, Meltex Inc., Sumitomo Osaka Cemento Co., Ltd.Inventors: Yoshihiro Izumi, Yoshimasa Chikama, Satoshi Kawashima, Takaharu Hashimoto, Itsuji Yoshikawa, Masaaki Ishikawa
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Publication number: 20020187266Abstract: A SnO2 film having a prescribed pattern feature is formed on a substrate by a wet film-formation technology (e.g., sol-gel method). A Ni film is formed on the SnO2 film by an electroless plating method. The electroless plating method is conducted in the presence of at least one sulfur-containing compound selected from the group consisting of thiosulfates, thiocyanates and sulfur-containing organic compounds.Type: ApplicationFiled: May 22, 2002Publication date: December 12, 2002Inventors: Yoshihiro Izumi, Yoshimasa Chikama, Satoshi Kawashima, Takaharu Hashimoto, Itsuji Yoshikawa, Masaaki Ishikawa
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Publication number: 20010023771Abstract: There is provided is a metal line structure in which no defect of blistering occurs on a surface of a Cu/Ni film or a Cu/Au/Ni film even if an Ni plating thickness is reduced. According to this metal line 1, in a Cu/Au/Ni film structure in which an Au film 13 and a Cu film 15 are successively laminated by electroless plating on an Ni film 12 formed by electroless plating, the Ni film 12 has a phosphorus content x of 10 wt %≦x≦15 wt %. It was discovered through experiments that the so-called high phosphorus content type Ni film 12 having a phosphorus content x of 10 to 15 percent by weight became a fine smooth film under a condition of a film thickness of 0.1 &mgr;m or greater.Type: ApplicationFiled: February 28, 2001Publication date: September 27, 2001Inventors: Yoshihiro Izumi, Yoshimasa Chikama, Satoshi Kawashima, Takaharu Hashimoto