Patents by Inventor Takaharu Hashimoto

Takaharu Hashimoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8118591
    Abstract: A heat shield plate for a substrate annealing apparatus is provided with a horizontally supported flat-plate-like substrate 1, a heater 5 positioned above the substrate to heat the upper surface of the substrate with radiation heat, and a heat shield plate 10 horizontally movable between a shielding position where the substrate is shielded from heater and an open position out of the shielding position. The heat shield plate 10 is composed of a structural member 12 made of a low thermal expansion material (carbon composite material) which is hardly deformed due to a temperature difference in the shielding position, and a heat insulating member 14 which covers the upper surface of the structural member and keeps the surface at an allowable temperature or below.
    Type: Grant
    Filed: March 15, 2007
    Date of Patent: February 21, 2012
    Assignee: IHI Corporation
    Inventors: Terumasa Ishihara, Takaharu Hashimoto, Masayuki Mizuno, Masaru Morita
  • Patent number: 7712303
    Abstract: A degradation estimating apparatus for an unburned fuel component adsorption catalyst, which is connected with an internal combustion engine and has an unburned fuel component adsorbent and an oxygen storage component is provided. The apparatus includes a degradation estimating unit for making estimation for a degradation of the unburned fuel component adsorption catalyst on the basis of a first term and a second term. The first term is from the cancellation of the fuel supply to detecting a variation of an upstream side air-fuel ratio occurring due to the increase of the reductant quantity in the exhaust gas. The second term is from the cancellation of the fuel supply to detecting of a variation of the downstream side air-fuel ratio due to an increase of the reductant quantity.
    Type: Grant
    Filed: April 20, 2006
    Date of Patent: May 11, 2010
    Assignee: Mitsubishi Jidosha Kogyo Kabushiki Kaisha
    Inventors: Hiroshi Tanada, Yasuyuki Hatsuda, Takehisa Fujita, Takaharu Hashimoto, Keisuke Tashiro, Mizuki Anai, Mitsutaka Kojima, Masayuki Yamashita, Katsuhiko Miyamoto
  • Publication number: 20090029308
    Abstract: A heat shield plate for a substrate annealing apparatus is provided with a horizontally supported flat-plate-like substrate 1, a heater 5 positioned above the substrate to heat the upper surface of the substrate with radiation heat, and a heat shield plate 10 horizontally movable between a shielding position where the substrate is shielded from heater and an open position out of the shielding position. The heat shield plate 10 is composed of a structural member 12 made of a low thermal expansion material (carbon composite material) which is hardly deformed due to a temperature difference in the shielding position, and a heat insulating member 14 which covers the upper surface of the structural member and keeps the surface at an allowable temperature or below.
    Type: Application
    Filed: March 15, 2007
    Publication date: January 29, 2009
    Applicant: IHI CORPORATION
    Inventors: Terumasa Ishihara, Takaharu Hashimoto, Masayuki Mizuno, Masaru Morita
  • Publication number: 20060236678
    Abstract: The present invention relates to a degradation estimating apparatus for an unburned fuel component adsorption catalyst, which is connected with an internal combustion engine and has an unburned fuel component adsorbent and an oxygen storage component. The apparatus includes a degradation estimating unit for making estimation for a degradation of the unburned fuel component adsorption catalyst on the basis of a first term and a second term. The first term that is from the cancellation of the fuel supply to detecting a variation of an upstream side air-fuel ratio occurring due to the increase of the reductant quantity in the exhaust gas. The second term that is from the cancellation of the fuel supply to detecting of a variation of the downstream side air-fuel ratio due to an increase of the reductant quantity.
    Type: Application
    Filed: April 20, 2006
    Publication date: October 26, 2006
    Inventors: Hiroshi Tanada, Yasuyuki Hatsuda, Takehisa Fujita, Takaharu Hashimoto, Keisuke Tashiro, Mizuki Anai, Mitsutaka Kojima, Masayuki Yamashita, Katsuhiko Miyamoto
  • Patent number: 7059122
    Abstract: The exhaust gas purification apparatus for an engine comprises, a catalytic converter provided in an exhaust path of the engine and including a carrier, an HC absorbent, an HC purifying catalyst, and a transition metal, and a control apparatus for controlling operation of the engine, the control apparatus including an HC desorption timing estimation section for estimating a timing at which the HC is desorbed from the HC absorbent and a control section for controlling an air fuel ratio upon starting of the engine to a ratio richer than a stoichiometric air fuel ratio to start operation of the engine and changing over the air fuel ratio to a ratio leaner than the stoichiometric air fuel ratio at the timing at which the HC is desorbed based on an output of the HC desorption timing estimation section.
    Type: Grant
    Filed: August 29, 2003
    Date of Patent: June 13, 2006
    Assignee: Mitsubishi Jidosha Kogyo Kabushiki Kaisha
    Inventors: Hiroshi Tanada, Takaharu Hashimoto
  • Publication number: 20050011182
    Abstract: The invention provides an exhaust gas purification apparatus which can efficiently purify HC in exhaust gas of an engine upon cold starting of the engine. The exhaust gas purification apparatus for an engine comprises a catalytic converter provided in an exhaust path of the engine and including a carrier, an HC absorbent, an HC purifying catalyst, and a transition metal, and a control apparatus for controlling operation of the engine, the control apparatus including an HC desorption timing estimation section for estimating a timing at which the HC is desorbed from the HC absorbent and a control section for controlling an air fuel ratio upon starting of the engine to a ratio richer than a stoichiometric air fuel ratio to start operation of the engine and changing over the air fuel ratio to a ratio leaner than the stoichiometric air fuel ratio at the timing at which the HC is desorbed based on an output of the HC desorption timing estimation section.
    Type: Application
    Filed: August 29, 2003
    Publication date: January 20, 2005
    Inventors: Hiroshi Tanada, Takaharu Hashimoto
  • Patent number: 6798032
    Abstract: A SnO2 film having a prescribed pattern feature is formed on a substrate by a wet film-formation technology (e.g., sol-gel method). A Ni film is formed on the SnO2 film by an electroless plating method. The electroless plating method is conducted in the presence of at least one sulfur-containing compound selected from the group consisting of thiosulfates, thiocyanates and sulfur-containing organic compounds.
    Type: Grant
    Filed: June 5, 2003
    Date of Patent: September 28, 2004
    Assignees: Sharp Kabushiki Kaisha, Meltex Inc., Sumitomo Osaka Cemento Co., Ltd.
    Inventors: Yoshihiro Izumi, Yoshimasa Chikama, Satoshi Kawashima, Takaharu Hashimoto, Itsuji Yoshikawa, Masaaki Ishikawa
  • Patent number: 6770978
    Abstract: There is provided is a metal line structure in which no defect of blistering occurs on a surface of a Cu/Ni film or a Cu/Au/Ni film even if an Ni plating thickness is reduced. According to this metal line 1, in a Cu/Au/Ni film structure in which an Au film 13 and a Cu film 15 are successively laminated by electroless plating on an Ni film 12 formed by electroless plating, the Ni film 12 has a phosphorus content x of 10 wt %≦x≦15 wt %. It was discovered through experiments that the so-called high phosphorus content type Ni film 12 having a phosphorus content x of 10 to 15 percent by weight became a fine smooth film under a condition of a film thickness of 0.1 &mgr;m or greater.
    Type: Grant
    Filed: February 28, 2001
    Date of Patent: August 3, 2004
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Yoshihiro Izumi, Yoshimasa Chikama, Satoshi Kawashima, Takaharu Hashimoto
  • Publication number: 20030207567
    Abstract: A SnO2 film having a prescribed pattern feature is formed on a substrate by a wet film-formation technology (e.g., sol-gel method). A Ni film is formed on the SnO2 film by an electroless plating method. The electroless plating method is conducted in the presence of at least one sulfur-containing compound selected from the group consisting of thiosulfates, thiocyanates and sulfur-containing organic compounds.
    Type: Application
    Filed: June 5, 2003
    Publication date: November 6, 2003
    Applicants: Sharp Kabushiki Kaisha, Meltex, Inc., Sumitomo Osaka Cemento Co., Ltd.
    Inventors: Yoshihiro Izumi, Yoshimasa Chikama, Satoshi Kawashima, Takaharu Hashimoto, Itsuji Yoshikawa, Masaaki Ishikawa
  • Patent number: 6627544
    Abstract: A SnO2 film having a prescribed pattern feature is formed on a substrate by a wet film-formation technology (e.g., sol-gel method). A Ni film is formed on the SnO2 film by an electroless plating method. The electroless plating method is conducted in the presence of at least one sulfur-containing compound selected from the group consisting of thiosulfates, thiocyanates and sulfur-containing organic compounds.
    Type: Grant
    Filed: May 22, 2002
    Date of Patent: September 30, 2003
    Assignees: Sharp Kabushiki Kaisha, Meltex Inc., Sumitomo Osaka Cemento Co., Ltd.
    Inventors: Yoshihiro Izumi, Yoshimasa Chikama, Satoshi Kawashima, Takaharu Hashimoto, Itsuji Yoshikawa, Masaaki Ishikawa
  • Publication number: 20020187266
    Abstract: A SnO2 film having a prescribed pattern feature is formed on a substrate by a wet film-formation technology (e.g., sol-gel method). A Ni film is formed on the SnO2 film by an electroless plating method. The electroless plating method is conducted in the presence of at least one sulfur-containing compound selected from the group consisting of thiosulfates, thiocyanates and sulfur-containing organic compounds.
    Type: Application
    Filed: May 22, 2002
    Publication date: December 12, 2002
    Inventors: Yoshihiro Izumi, Yoshimasa Chikama, Satoshi Kawashima, Takaharu Hashimoto, Itsuji Yoshikawa, Masaaki Ishikawa
  • Publication number: 20010023771
    Abstract: There is provided is a metal line structure in which no defect of blistering occurs on a surface of a Cu/Ni film or a Cu/Au/Ni film even if an Ni plating thickness is reduced. According to this metal line 1, in a Cu/Au/Ni film structure in which an Au film 13 and a Cu film 15 are successively laminated by electroless plating on an Ni film 12 formed by electroless plating, the Ni film 12 has a phosphorus content x of 10 wt %≦x≦15 wt %. It was discovered through experiments that the so-called high phosphorus content type Ni film 12 having a phosphorus content x of 10 to 15 percent by weight became a fine smooth film under a condition of a film thickness of 0.1 &mgr;m or greater.
    Type: Application
    Filed: February 28, 2001
    Publication date: September 27, 2001
    Inventors: Yoshihiro Izumi, Yoshimasa Chikama, Satoshi Kawashima, Takaharu Hashimoto