Patents by Inventor Takaharu Mae
Takaharu Mae has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7861908Abstract: A component mounting apparatus includes a component feeder that feeds a component with its bump electrodes facing down, a mounting head that mounts the component onto a substrate, a supporting base that secures the substrate, and a positioning device that aligns the component with the substrate. The mounting head includes an ultrasonic vibration generator, an ultrasonic vibration propagation member that conveys the ultrasonic vibration provided by the ultrasonic vibration generator to a working face holding the component as vibration parallel thereto, a pressure loader that applies a pressure load to the working face from a position immediately thereabove in the direction perpendicular thereto, and a heater that heats the vicinity of the working face. Thereby, ultrasonic bonding is carried out with high reliability even if the component has a number of bump electrodes on its face.Type: GrantFiled: March 30, 2007Date of Patent: January 4, 2011Assignee: Panasonic CorporationInventors: Shozo Minamitani, Takaharu Mae, Yasuharu Ueno, Akira Yamada, Shinji Kanayama, Makoto Akita, Nobuhisa Watanabe, Akira Mori, Hiroyuki Naito, Shinya Marumo, Makoto Morikawa
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Patent number: 7516878Abstract: A bump formation method and a bump forming apparatus for a semiconductor wafer are provided in which productivity when bumps are formed onto the semiconductor wafer is improved as compared with the conventional art. There are provided a bump forming head, a recognition device, and a control device. ICs formed on the semiconductor wafer are divided into basic blocks. Bump formation is performed continuously for the ICs included in one basic block. Positional recognition for the other basic blocks is performed only when the bump formation operation is shifted from one basic block to another basic block. Thus, in comparison with the conventional art whereby a positional recognition operation is performed every time bumps are formed on each IC, the number of times of performing positional recognition is greatly reduced, so that productivity can be improved.Type: GrantFiled: December 27, 2005Date of Patent: April 14, 2009Assignee: Panasonic CorporationInventors: Shoriki Narita, Masahiko Ikeya, Yasutaka Tsuboi, Takaharu Mae, Shinji Kanayama
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Publication number: 20080179378Abstract: A bump forming apparatus which carries out a temperature control of a type different from the conventional art in forming bumps to a semiconductor wafer, and a bump formation method executed by the bump forming apparatus are provided. A bonding stage, a load and transfer device and a control device are provided. A wafer, after having bumps formed thereon, is held by the load and transfer device and arranged above the bonding stage through control by the control device, so that a temperature drop of the wafer is controlled. Accordingly, generation of troubles such as a crack because of thermal stress and the like can be prevented to even compound semiconductor wafers sensitive to a temperature change.Type: ApplicationFiled: October 31, 2007Publication date: July 31, 2008Inventors: Makoto Imanishi, Shoriki Narita, Masahiko Ikeya, Shinji Kanayama, Takaharu Mae
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Patent number: 7387229Abstract: A bump forming apparatus which carries out a temperature control of a type different from the conventional art in forming bumps to a semiconductor wafer, and a bump formation method executed by the bump forming apparatus are provided. A bonding stage, a load and transfer device and a control device are provided. A wafer, after having bumps formed thereon, is held by the load and transfer device and arranged above the bonding stage through control by the control device, so that a temperature drop of the wafer is controlled. Accordingly, generation of troubles such as a crack because of thermal stress and the like can be prevented to even compound semiconductor wafers sensitive to a temperature change.Type: GrantFiled: January 22, 2004Date of Patent: June 17, 2008Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Makoto Imanishi, Shoriki Narita, Masahiko Ikeya, Shinji Kanayama, Takaharu Mae
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Patent number: 7350684Abstract: A preheat device (160) is provided to execute, before forming bumps (16) to electrode parts (15), a pre-formation temperature control for bonding promotion to promote bonding between the electrode parts and the bumps during bump formation. Metal particles of the electrode parts can be changed to an appropriate state before the bump formation. Phenomenally, a bonding state between the electrode parts and the bumps can be improved as compared with the conventional art. In a further arrangement of the present invention, semiconductor components with bumps can be heated under a bonding strength improvement condition by a bonding stage (316) through controlling the heating by a controller (317).Type: GrantFiled: April 26, 2005Date of Patent: April 1, 2008Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Shoriki Narita, Koichi Yoshida, Masahiko Ikeya, Takaharu Mae, Shinji Kanayama, Makoto Imanishi, Kazushi Higashi, Kenji Fukumoto, Hiroshi Wada
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Patent number: 7296727Abstract: After detection of contact between respective solder bumps of an electronic component, sucked and held by a suction nozzle of a head tool, and respective solder portions of a circuit board, the solder bumps and the solder portions are melted by heating. Releasing of the electronic component from suction and holding by the suction nozzle of the head tool is performed, not at a time during solder melting, but at a time after the solder is melted, cooled and solidified. Thus, an electronic component mounting method and apparatus capable of mounting high-end electronic components having narrow-pitched bumps are provided.Type: GrantFiled: December 20, 2002Date of Patent: November 20, 2007Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Shunji Onobori, Shuichi Hirata, Masakazu Yamano, Kazuya Yamamoto, Satoshi Shida, Takaharu Mae, Makoto Akita, Shozo Minamitani
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Publication number: 20070187457Abstract: A component mounting apparatus includes a component feeder that feeds a component with its bump electrodes facing down, a mounting head that mounts the component onto a substrate, a supporting base that secures the substrate, and a positioning device that aligns the component with the substrate. The mounting head includes an ultrasonic vibration generator, an ultrasonic vibration propagation member that conveys the ultrasonic vibration provided by the ultrasonic vibration generator to a working face holding the component as vibration parallel thereto, a pressure loader that applies a pressure load to the working face from a position immediately thereabove in the direction perpendicular thereto, and a heater that heats the vicinity of the working face. Thereby, ultrasonic bonding is carried out with high reliability even if the component has a number of bump electrodes on its face.Type: ApplicationFiled: March 30, 2007Publication date: August 16, 2007Applicant: Matsushita Electric Industrial Co., Ltd.Inventors: Shozo Minamitani, Takaharu Mae, Yasuharu Ueno, Akira Yamada, Shinji Kanayama, Makoto Akita, Nobuhisa Watanabe, Akira Mori, Hiroyuki Naito, Shinya Marumo, Makoto Morikawa
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Patent number: 7229854Abstract: A component mounting apparatus includes a component feeder (20) that feeds a component (2) with its bump electrodes facing down, a mounting head (5) that mounts the component onto a substrate (3), a supporting base (8) that secures the substrate, and a positioning device (6, 7) that aligns the component with the substrate. The mounting head includes an ultrasonic vibration generator (24), an ultrasonic vibration propagation member (34, 38, 54) that conveys the ultrasonic vibration provided by the ultrasonic vibration generator to a working face (33, 41, 57) holding the component as vibration parallel thereto, a pressure loader (22, 23, 39, 55, 59) that applies a pressure load to the working face from a position immediately thereabove in the direction perpendicular thereto, and a heater (32, 47, 49, 50, 51, 52, 53) that heats the vicinity of the working face. Thereby, ultrasonic bonding is carried out with high reliability even if the component has a number of bump electrodes (2a) on its face.Type: GrantFiled: March 27, 2003Date of Patent: June 12, 2007Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Shozo Minamitani, Takaharu Mae, Yasuharu Ueno, Akira Yamada, Shinji Kanayama, Makoto Akita, Nobuhisa Watanabe, Akira Mori, Hiroyuki Naito, Shinya Marumo, Makoto Morikawa
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Patent number: 7052984Abstract: A bump formation method and a bump forming apparatus for a semiconductor wafer are provided in which productivity when bumps are formed onto the semiconductor wafer is improved as compared with the conventional art. There are provided a bump forming head, a recognition device, and a control device. ICs formed on the semiconductor wafer are divided into basic blocks. Bump formation is performed continuously for the ICs included in one basic block. Positional recognition for the other basic blocks is performed only when the bump formation operation is shifted from one basic block to another basic block. Thus, in comparison with the conventional art whereby a positional recognition operation is performed every time bumps are formed on each IC, the number of times of performing positional recognition is greatly reduced, so that productivity can be improved.Type: GrantFiled: November 16, 2001Date of Patent: May 30, 2006Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Shoriki Narita, Masahiko Ikeya, Yasutaka Tsuboi, Takaharu Mae, Shinji Kanayama
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Publication number: 20060102701Abstract: A bump formation method and a bump forming apparatus for a semiconductor wafer are provided in which productivity when bumps are formed onto the semiconductor wafer is improved as compared with the conventional art. There are provided a bump forming head, a recognition device, and a control device. ICs formed on the semiconductor wafer are divided into basic blocks. Bump formation is performed continuously for the ICs included in one basic block. Positional recognition for the other basic blocks is performed only when the bump formation operation is shifted from one basic block to another basic block. Thus, in comparison with the conventional art whereby a positional recognition operation is performed every time bumps are formed on each IC, the number of times of performing positional recognition is greatly reduced, so that productivity can be improved.Type: ApplicationFiled: December 27, 2005Publication date: May 18, 2006Inventors: Shoriki Narita, Masahiko Ikeya, Yasutaka Tsuboi, Takaharu Mae, Shinji Kanayama
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Patent number: 7031509Abstract: There are provided a recognition device, a wafer turning member, a turning device, and a control device. A first detection point for recognition and a second detection point for recognition are recognized, on the basis of the result of which a semiconductor wafer is turned to correct the inclination of ICs on the semiconductor wafer. As a result, the recognition operation for detecting the inclination of the ICs when a position of the ICs is to be recognized for bump formation is eliminated. The number of times the recognition is performed is reduced in comparison with the conventional art, so that the productivity can be improved.Type: GrantFiled: November 20, 2001Date of Patent: April 18, 2006Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Shoriki Narita, Masahiko Ikeya, Yasutaka Tsuboi, Takaharu Mae, Shinji Kanayama
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Patent number: 7014092Abstract: The present invention provides a bump forming apparatus which can prevent charge appearance semiconductor substrates from pyroelectric breakdown and physical failures, a method carried out by the bump forming apparatus for removing charge of charge appearance semiconductor substrates, a charge removing unit for charge appearance semiconductor substrates, and a charge appearance semiconductor substrate. At least when the wafer is cooled after the bump bonding is connected on the wafer, electric charge accumulated on the wafer because of the cooling is removed through direct contact with a post-forming bumps heating device, or the charge is removed by a decrease in temperature control so that charge can be removed in a noncontact state. Therefore, an amount of charge of the wafer can be reduced in comparison with the conventional art, so that the wafer is prevented from pyroelectric breakdown and damage such as a break or the like to the wafer itself.Type: GrantFiled: August 29, 2003Date of Patent: March 21, 2006Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Shoriki Narita, Yasutaka Tsuboi, Masahiko Ikeya, Takaharu Mae, Shinji Kanayama
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Patent number: 7005368Abstract: The present invention provides a bump forming apparatus (101, 501) which can prevent charge appearance semiconductor substrates (201, 202) from pyroelectric breakdown and physical failures, a method carried out by the bump forming apparatus for removing charge of charge appearance semiconductor substrates, a charge removing unit for charge appearance semiconductor substrates, and a charge appearance semiconductor substrate. At least when the wafer is cooled after the bump bonding is connected on the wafer, electric charge accumulated on the wafer (202) because of the cooling is removed through direct contact with a post-forming bumps heating device (170), or the charge is removed by a decrease in temperature control so that charge can be removed in a noncontact state. Therefore, an amount of charge of the wafer can be reduced in comparison with the conventional art, so that the wafer is prevented from pyroelectric breakdown and damage such as a break or the like to the wafer itself.Type: GrantFiled: August 29, 2003Date of Patent: February 28, 2006Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Shoriki Narita, Yasutaka Tsuboi, Masahiko Ikeya, Takaharu Mae, Shinji Kanayama
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Publication number: 20050227429Abstract: A component mounting apparatus includes a component feeder (20) that feeds a component (2) with its bump electrodes facing down, a mounting head (5) that mounts the component onto a substrate (3), a supporting base (8) that secures the substrate, and a positioning device (6, 7) that aligns the component with the substrate. The mounting head includes an ultrasonic vibration generator (24), an ultrasonic vibration propagation member (34, 38, 54) that conveys the ultrasonic vibration provided by the ultrasonic vibration generator to a working face (33, 41, 57) holding the component as vibration parallel thereto, a pressure loader (22, 23, 39, 55, 59) that applies a pressure load to the working face from a position immediately thereabove in the direction perpendicular thereto, and a heater (32, 47, 49, 50, 51, 52, 53) that heats the vicinity of the working face. Thereby, ultrasonic bonding is carried out with high reliability even if the component has a number of bump electrodes (2a) on its face.Type: ApplicationFiled: March 27, 2003Publication date: October 13, 2005Inventors: Shozo Minamitani, Takaharu Mae, Yasuharu Ueno, Akira Yamada, Shinji Kanayama, Makoto Akita, Nobuhisa Watanabe, Akira Mori, Hiroyuki Naito, Shinya Marumo, Makoto Morikawa
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Publication number: 20050191838Abstract: A preheat device (160) is provided to execute, before forming bumps (16) to electrode parts (15), a pre-formation temperature control for bonding promotion to promote bonding between the electrode parts and the bumps during bump formation. Metal particles of the electrode parts can be changed to an appropriate state before the bump formation. Phenomenally, a bonding state between the electrode parts and the bumps can be improved as compared with the conventional art. In a further arrangement of the present invention, semiconductor components with bumps can be heated under a bonding strength improvement condition by a bonding stage (316) through controlling the heating by a controller (317).Type: ApplicationFiled: April 26, 2005Publication date: September 1, 2005Inventors: Shoriki Narita, Koichi Yoshida, Masahiko Ikeya, Takaharu Mae, Shinji Kanayama, Makoto Imanishi, Kazushi Higashi, Kenji Fukumoto, Hiroshi Wada
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Patent number: 6910613Abstract: A preheat device (160) is provided to execute, before forming bumps (16) to electrode parts (15), a pre-formation temperature control for bonding promotion to promote bonding between the electrode parts and the bumps during bump formation. Metal particles of the electrode parts can be changed to an appropriate state before the bump formation. Phenomenally, a bonding state between the electrode parts and the bumps can be improved as compared with the conventional art. In a further arrangement of the present invention, semiconductor components with bumps can be heated under a bonding strength improvement condition by a bonding stage (316) through controlling the heating by a controller (317).Type: GrantFiled: June 29, 2001Date of Patent: June 28, 2005Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Shoriki Narita, Koichi Yoshida, Masahiko Ikeya, Takaharu Mae, Shinji Kanayama, Makoto Imanishi, Kazushi Higashi, Kenji Fukumoto, Hiroshi Wada
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Publication number: 20050098610Abstract: After detection of contact between respective solder bumps of an electronic component, sucked and held by a suction nozzle of a head tool, and respective solder portions of a circuit board, the solder bumps and the solder portions are melted by heating. Releasing of the electronic component from suction and holding by the suction nozzle of the head tool is performed, not at a time during solder melting, but at a time after the solder is melted, cooled and solidified. Thus, an electronic component mounting method and apparatus capable of mounting high-end electronic components having narrow-pitched bumps are provided.Type: ApplicationFiled: December 20, 2002Publication date: May 12, 2005Inventors: Shunji Onobori, Shuichi Hirata, Masakazu Yamano, Kazuya Yamamoto, Satoshi Shida, Takaharu Mae, Makoto Akita, Shozo Minamitani
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Patent number: 6818975Abstract: The present invention provides a bump forming apparatus (101, 501) which can prevent charge appearance semiconductor substrates (201, 202) from pyroelectric breakdown and physical failures, a method carried out by the bump forming apparatus for removing charge of charge appearance semiconductor substrates, a charge removing unit for charge appearance semiconductor substrates, and a charge appearance semiconductor substrate. At least when the wafer is cooled after the bump bonding is connected on the wafer, electric charge accumulated on the wafer (202) because of the cooling is removed through direct contact with a post-forming bumps heating device (170), or the charge is removed by a decrease in temperature control so that charge can be removed in a noncontact state. Therefore, an amount of charge of the wafer can be reduced in comparison with the conventional art, so that the wafer is prevented from pyroelectric breakdown and damage such as a break or the like to the wafer itself.Type: GrantFiled: January 2, 2002Date of Patent: November 16, 2004Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Shoriki Narita, Yasutaka Tsuboi, Masahiko Ikeya, Takaharu Mae, Shinji Kanayama
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Patent number: 6787391Abstract: A bump forming apparatus which carries out a temperature control of a type different from the conventional art in forming bumps to a semiconductor wafer, and a bump formation method executed by the bump forming apparatus are provided. A bonding stage, a load and transfer device and a control device are provided. A wafer, after having bumps formed thereon, is held by the load and transfer device and arranged above the bonding stage through control by the control device, so that a temperature drop of the wafer is controlled. Accordingly, generation of troubles such as a crack because of thermal stress and the like can be prevented to even compound semiconductor wafers sensitive to a temperature change.Type: GrantFiled: December 18, 2000Date of Patent: September 7, 2004Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Makoto Imanishi, Shoriki Narita, Masahiko Ikeya, Shinji Kanayama, Takaharu Mae
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Publication number: 20040149803Abstract: A bump forming apparatus which carries out a temperature control of a type different from the conventional art in forming bumps to a semiconductor wafer, and a bump formation method executed by the bump forming apparatus are provided. A bonding stage, a load and transfer device and a control device are provided. A wafer, after having bumps formed thereon, is held by the load and transfer device and arranged above the bonding stage through control by the control device, so that a temperature drop of the wafer is controlled. Accordingly, generation of troubles such as a crack because of thermal stress and the like can be prevented to even compound semiconductor wafers sensitive to a temperature change.Type: ApplicationFiled: January 22, 2004Publication date: August 5, 2004Inventors: Makoto Imanishi, Shoriki Narita, Masahiko Ikeya, Shinji Kanayama, Takaharu Mae