Abstract: A managing system for managing slurry, which is used to machine workpieces. The slurry contains dispersion liquid and abrasive grains. Slurry that has been used in machining further includes impurities that are smaller than the abrasive grains. A first decanter centrifugally separates a mixture of impurities and dispersion liquid from the used slurry to recover recyclable abrasive grains from the slurry. A second decanter centrifugally separates impurities from the mixture to recover recyclable dispersion liquid from the slurry. A specific gravity gage and a viscosity gage detect properties of the used slurry. The rotating speeds of the first and second decanters are controlled in accordance with the detected properties of the slurry. This always maintains the separating efficiency of both decanters at an optimal value thus effectively recovering and recycling the abrasive grains and dispersion liquid.

Abstract: A managing system for managing slurry, which is supplied to a wire saw. Slurry is prepared in a preparing tank and sent to the wire saw and used to cut workpieces. After usage for cutting workpieces, the slurry is sent to a separating apparatus from the wire saw. The separating apparatus separates impurities from the used slurry to recover a mixture of recyclable dispersing liquid and abrasive grains from the used slurry. The recovered mixture is returned to the preparing tank. The recovered mixture is mixed with fresh abrasive grains and dispersing liquid in the preparing tank to prepare slurry. The property (specific gravity and viscosity) of the slurry in the preparing tank is detected. The amount of fresh abrasive grains and dispersing liquid supplied to the preparing tank is adjusted in accordance with the detection results. Accordingly, slurry having properties that are optimal for the cutting of workpieces is prepared.

Abstract: A slurry managing system for a wire saw is disclosed. The wire saw includes a wire that has a plurality of wire lines extending in parallel to one another. The wire is supplied with slurry containing abrasive grains in dispersing liquid to cut a workpiece so as to simultaneously produce a multiplicity of wafers. A mixer device mixes the slurry prior to supplying of the slurry to the wire saw. A first supplying device supplies the grains to the mixer device. A second supplying device supplies the dispersing liquid to the mixer device. A first adjusting device adjusts the amount of the grains supplied to the mixer device from the first supplying device. A second adjusting device adjusts the amount of the liquid supplied to the mixer device from the second supplying device.

Abstract: A slurry managing system for a wire saw is disclosed. The wire saw includes a wire that has a plurality of wire lines extending in parallel to one another. The wire is supplied with slurry containing abrasive grains in dispersing liquid to cut a workpiece so as to simultaneously produce a multiplicity of wafers. A mixer device mixes the slurry prior to supplying of the slurry to the wire saw. A first supplying device supplies the grains to the mixer device. A second supplying device supplies the dispersing liquid to the mixer device. A first adjusting device adjusts the amount of the grains supplied to the mixer device from the first supplying device. A second adjusting device adjusts the amount of the liquid supplied to the mixer device from the second supplying device.