Abstract: An image pickup unit includes: an image pickup member configured to output an image pickup signal; a sensor; a three-dimensional wiring board including a surface on which the image pickup member is mounted and a different surface on which the sensor is mounted; a signal cable electrically connected to the three-dimensional wiring board; a frame member housing the image pickup member, the sensor, the three-dimensional wiring board, and a distal end portion of the signal cable; a first resin sealing the sensor; and a second resin sealing the distal end portion of the signal cable and having a lower elastic modulus than an elastic modulus of the first resin.

Abstract: An optical module for endoscope includes an optical fiber, a light emitting element, a ferrule including a front surface and a back surface, and including a first through-hole into which the optical fiber is inserted, a glass substrate including a first principal surface at which the light emitting element is mounted and a second principal surface, a sleeve including a third principal surface bonded to the second principal surface of the glass substrate, and a fourth principal surface, and including a second through-hole into which the ferrule is inserted, and a stopper including a contact surface in surface contact with the back surface of the ferrule, fixed to the sleeve by using an adhesive, and further including an inner side surface in contact with a side surface of the sleeve.

Abstract: An image pickup apparatus for an endoscope includes: a light emitting element configured to emit an optical signal; an optical fiber configured to transmit the optical signal; metal cables configured to transmit an electric signal; a ferrule including an insertion hole into which the optical fiber is inserted; and a molded interconnect device to which core wires of the metal cables and the light emitting element are electrically connected, and which is integrally molded, the molded interconnect device including a recess in which the light emitting element and the ferrule are accommodated.

Abstract: An optical module for endoscope includes an optical fiber, a light emitting element, a ferrule including a front surface and a back surface, and including a first through-hole into which the optical fiber is inserted, a glass substrate including a first principal surface at which the light emitting element is mounted and a second principal surface, a sleeve including a third principal surface bonded to the second principal surface of the glass substrate, and a fourth principal surface, and including a second through-hole into which the ferrule is inserted, and a stopper including a contact surface in surface contact with the back surface of the ferrule, fixed to the sleeve by using an adhesive, and further including an inner side surface in contact with a side surface of the sleeve.

Abstract: An endoscope includes an image pickup unit at a distal end portion of an insertion portion, the image pickup unit includes a chip part provided with a first electrode pad and a second electrode pad, an image pickup device provided with a third electrode pad and a wiring board including a flying lead, the flying lead is inserted into a gap between the chip part and the image pickup device, the first electrode pad and the flying lead are bonded together via a first bump, a bonded portion between the first electrode pad and the flying lead is sealed with first sealing resin, the second electrode pad and the third electrode pad are bonded together via a second bump which is higher than the first bump and sealed with second sealing resin having a Young's modulus lower than a Young's modulus of the first sealing resin.

Abstract: An optical module includes: an optical element; an optical fiber on which a first metal film is disposed; a wiring board which includes a through hole in which the optical fiber is inserted, wherein a second metal film is disposed on a wall surface of the through hole, and the second metal film is provided so as to annularly extend in a periphery of an opening of the through hole; and solder which fixes the optical fiber to the wiring board, and the solder is filled between the wall surface of the through hole and the outer peripheral face of the optical fiber and further forms a fillet covering a periphery of the opening of the wiring board and the outer peripheral face of the optical fiber.

Abstract: An endoscope includes an image pickup unit at a distal end portion of an insertion portion, the image pickup unit includes a chip part provided with a first electrode pad and a second electrode pad, an image pickup device provided with a third electrode pad and a wiring board including a flying lead, the flying lead is inserted into a gap between the chip part and the image pickup device, the first electrode pad and the flying lead are bonded together via a first bump, a bonded portion between the first electrode pad and the flying lead is sealed with first sealing resin, the second electrode pad and the third electrode pad are bonded together via a second bump which is higher than the first bump and sealed with second sealing resin having a Young's modulus lower than a Young's modulus of the first sealing resin.

Abstract: A three-dimensional wiring board includes a chip component including a first end electrode and a second end electrode, a first wiring board with a recessed portion including a first junction electrode on a bottom surface, and a second wiring board, disposed on the first wiring board, including a second junction electrode, where the chip component is vertically housed in the recessed portion, the first end electrode is joined to the first junction electrode, and the second end electrode is joined to the second junction electrode.