Patents by Inventor Takahiko Sumino
Takahiko Sumino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10273359Abstract: Disclosed is a polyamide resin composition, including: a polyamide (A) containing a diamine unit including 70 mol % or more of a p-xylylenediamine unit and a dicarboxylic acid unit including 70 mol % or more of a linear aliphatic dicarboxylic acid unit having 6 to 18 carbon atoms; and a filler (B), in which the polyamide (A) includes a polyamide having a phosphorus atom concentration of 50 to 1,000 ppm and a YI value of 10 or less in a color difference test in accordance with JIS-K-7105, and a content of the filler (B) is 1 to 200 parts by mass with respect to 100 parts by mass of the polyamide (A).Type: GrantFiled: September 14, 2010Date of Patent: April 30, 2019Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Shun Ogawa, Hisayuki Kuwahara, Shinichi Ayuba, Takahiko Sumino, Kentaro Ishii
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Patent number: 10148006Abstract: Provided is a thermoplastic resin composition that allows a plated layer to be successfully formed on a surface of resin molded article obtained therefrom under a wide range of laser irradiation condition. A thermoplastic resin composition comprising a thermoplastic resin, and 1 to 30 parts by weight of a laser direct structuring additive and 0.1 to 10 parts by weight of a laser marking additive per 100 parts by weight of the thermoplastic resin, wherein the laser direct structuring additive comprises 70% by weight or more of a tin oxide.Type: GrantFiled: September 5, 2013Date of Patent: December 4, 2018Assignee: MITSUBISHI ENGINEERING-PLASTICS CORPORATIONInventors: Takahiro Takano, Takahiko Sumino, Kentarou Ishihara, Naohisa Akashi
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Patent number: 9587316Abstract: Provide is a thermoplastic resin composition from which a resin molded article having high whiteness and mechanical strength can be obtained while retaining the plating properties of the resin molded article. A thermoplastic resin composition comprising a thermoplastic resin, and 1 to 30 parts by weight of a laser direct structuring additive, 0.1 to 20 parts by weight of a titanium oxide and 10 to 230 parts by weight of a glass fiber per 100 parts by weight of the thermoplastic resin, wherein the laser direct structuring additive has an L value of 50 or more, and the glass fiber comprises SiO2 and Al2O3 in a proportion of 60 to 70% by weight of SiO2 and 20 to 30% by weight of Al2O3.Type: GrantFiled: September 5, 2013Date of Patent: March 7, 2017Assignee: Mitsubishi Engineering-Plastics CorporationInventors: Takahiro Takano, Takahiko Sumino, Kentarou Ishihara, Naohisa Akashi
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Patent number: 9365693Abstract: Provided is a thermoplastic resin composition which is excellent in platability (appearance of plating), and keeps high reflectance even after thermal aging. A thermoplastic resin composition comprising: per (A) 100 parts by weight of a crystalline thermoplastic resin having a melting point, measured by differential scanning calorimetry (DSC) at a heating rate of 10° C./min, of 250° C. or above; (B) 10 to 80 parts by weight of a glass filler; (C) 1 to 30 parts by weight of a laser direct structuring additive having a reflectance at 450 nm of 25% or above; and (D) 20 to 150 parts by weight of titanium oxide.Type: GrantFiled: March 15, 2013Date of Patent: June 14, 2016Assignee: MITSUBISHI ENGINEERING-PLASTICS CORPORATIONInventors: Takahiro Takano, Takahiko Sumino, Kentarou Ishihara
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Publication number: 20150353714Abstract: Providing a thermoplastic resin composition from which a resin molded article having high mechanical strength can be obtained while retaining the plating properties of the resin molded article. A thermoplastic resin composition comprising a thermoplastic resin, and 1 to 30 parts by weight of a laser direct structuring additive and 10 to 200 parts by weight of a glass fiber per 100 parts by weight of the thermoplastic resin, wherein the glass fiber comprises SiO2 and Al2O3 in a proportion of 60 to 70% by weight of SiO2 and 20 to 30% by weight of Al2O3.Type: ApplicationFiled: September 5, 2013Publication date: December 10, 2015Applicant: MITSUBISHI ENGINEERING-PLASTICS CORPORATIONInventors: Takahiro TAKANO, Takahiko SUMINO, Kentarou ISHIHARA, Naohisa AKASHI
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Publication number: 20150247243Abstract: Provide is a thermoplastic resin composition from which a resin molded article having high whiteness and mechanical strength can be obtained while retaining the plating properties of the resin molded article. A thermoplastic resin composition comprising a thermoplastic resin, and 1 to 30 parts by weight of a laser direct structuring additive, 0.1 to 20 parts by weight of a titanium oxide and 10 to 230 parts by weight of a glass fiber per 100 parts by weight of the thermoplastic resin, wherein the laser direct structuring additive has an L value of 50 or more, and the glass fiber comprises SiO2 and Al2O3 in a proportion of 60 to 70% by weight of SiO2 and 20 to 30% by weight of Al2O3.Type: ApplicationFiled: September 5, 2013Publication date: September 3, 2015Applicant: MITSUBISHI ENGINEERING-PLASTICS CORPORATIONInventors: Takahiro Takano, Takahiko Sumino, Kentarou Ishihara, Naohisa Akashi
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Publication number: 20150244066Abstract: Provided is a thermoplastic resin composition that allows a plated layer to be successfully formed on a surface of resin molded article obtained therefrom under a wide range of laser irradiation condition. A thermoplastic resin composition comprising a thermoplastic resin, and 1 to 30 parts by weight of a laser direct structuring additive and 0.1 to 10 parts by weight of a laser marking additive per 100 parts by weight of the thermoplastic resin, wherein the laser direct structuring additive comprises 70% by weight or more of a tin oxide.Type: ApplicationFiled: September 5, 2013Publication date: August 27, 2015Applicant: MITSUBISHI ENGINEERING-PLASTICS CORPORATIONInventors: Takahiro Takano, Takahiko Sumino, Kentarou Ishihara, Naohisa Akashi
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Publication number: 20150166726Abstract: A polyamide resin which comprises a diamine unit containing 70 mol % or more of a paraxylylenediamine unit and a dicarboxylic acid unit containing 70 mol % or more of a linear aliphatic dicarboxylic acid unit having from 6 to 18 carbon atoms, and which has a phosphorus atom concentration of from 50 to 1,000 ppm and a YI value of 10 or less in the color difference test in accordance with JIS-K-7105.Type: ApplicationFiled: September 19, 2014Publication date: June 18, 2015Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Shun Ogawa, Shinichi Ayuba, Takahiko Sumino, Hisayuki Kuwahara, Kentaro Ishii
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Patent number: 8933161Abstract: Provided is a thermoplastic resin molded article excellent in bending strength, flexural modulus and Charpy impact strength, on which the plated layer may be formed in a successful manner. The thermoplastic resin composition for laser direct structuring comprising, per 100 parts by weight of the thermoplastic resin, 10 to 150 parts by weight of an inorganic fiber and 1 to 30 parts by weight of a laser direct structuring additive, the laser direct structuring additive containing at least one of copper, antimony and tin, and having a Mohs hardness 1.5 or more smaller than the Mohs hardness of the inorganic fiber.Type: GrantFiled: March 16, 2012Date of Patent: January 13, 2015Assignees: Mitsubishi Chemical Europe GmbH, Mitsubishi Engineering-Plastics CorporationInventors: Takahiro Takano, Takahiko Sumino, Kentarou Ishihara, Bernardus Antonius Gerardus Schrauwen
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Patent number: 8927647Abstract: A polyamide resin composed of constitutional units derived from a diamine component 70 mol % or more of which is derived from p-xylylenediamine and constitutional unit derived from a dicarboxylic acid 70 mol % or more of which is derived from an aliphatic dicarboxylic acid having 6 to 18 carbon atoms. The polyamide resin has a number average molecular weight (Mn) of 10,000 to 50,000 and a degree of dispersion (weight average molecular weight/number average molecular weight=Mw/Mn) satisfying the following formula (1): 1.5?(Mw/Mn)?6.0, wherein Mw and Mn are determined by gel permeation chromatography (GPC).Type: GrantFiled: September 15, 2009Date of Patent: January 6, 2015Assignee: Mitsubishi Gas Chemical Company, Inc.Inventors: Tomomichi Kanda, Hisayuki Kuwahara, Shun Ogawa, Takahiko Sumino, Kentaro Ishii
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Patent number: 8835596Abstract: A method of producing polyamide by the direct polycondensation of a diamine component and a dicarboxylic acid component without using a solvent, such as water. The diamine component containing 70 mol % or more of p-xylylenediamine is added to a reaction system containing the dicarboxylic acid component under pressure while maintaining the reaction system in a molten state. After the addition of the diamine component, the pressure of the reaction system is reduced to atmospheric pressure over 50 min or more at a pressure falling speed of 1.0 MPa/h or less. By the production method, polyamide with a small molecular weight dispersion is easily produced.Type: GrantFiled: September 11, 2009Date of Patent: September 16, 2014Assignee: Mitsubishi Gas Chemical Company, Inc.Inventors: Hisayuki Kuwahara, Tomomichi Kanda, Shun Ogawa, Shinichi Ayuba, Kentaro Ishii, Takahiko Sumino
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Publication number: 20140147682Abstract: Provided is a thermoplastic resin composition which is excellent in platability (appearance of plating), and keeps high reflectance even after thermal aging. A thermoplastic resin composition comprising: per (A) 100 parts by weight of a crystalline thermoplastic resin having a melting point, measured by differential scanning calorimetry (DSC) at a heating rate of 10° C./min, of 250° C. or above; (B) 10 to 80 parts by weight of a glass filler; (C) 1 to 30 parts by weight of a laser direct structuring additive having a reflectance at 450 nm of 25% or above; and (D) 20 to 150 parts by weight of titanium oxide.Type: ApplicationFiled: March 15, 2013Publication date: May 29, 2014Inventors: Takahiro Takano, Takahiko Sumino, Kentarou Ishihara
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Publication number: 20140002311Abstract: Provided is a thermoplastic resin molded article excellent in bending strength, flexural modulus and Charpy impact strength, on which the plated layer may be formed in a successful manner. The thermoplastic resin composition for laser direct structuring comprising, per 100 parts by weight of the thermoplastic resin, 10 to 150 parts by weight of an inorganic fiber and 1 to 30 parts by weight of a laser direct structuring additive, the laser direct structuring additive containing at least one of copper, antimony and tin, and having a Mohs hardness 1.5 or more smaller than the Mohs hardness of the inorganic fiber.Type: ApplicationFiled: March 16, 2012Publication date: January 2, 2014Applicants: MITSUBISHI ENGINEERING-PLASTICS CORPORATION, MITSUBISHI CHEMICAL EUROPE GMBHInventors: Takahiro Takano, Takahiko Sumino, Kentarou Ishihara, Bernardus Antonius Gerardus Schrauwen
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Patent number: 8569404Abstract: Disclose is a polyamide resin composition having excellent heat resistance, heat aging resistance and mechanical physical properties, which is produced by incorporating a specified aromatic secondary amine compound and a specified organic sulfur based compound into a polyamide composed of a diamine unit containing a paraxylylenediamine unit as a major component and a dicarboxylic acid unit containing a linear aliphatic dicarboxylic acid unit having from 6 to 18 carbon atoms as a major component.Type: GrantFiled: May 28, 2010Date of Patent: October 29, 2013Assignee: Mitsubishi Gas Chemical Company, Inc.Inventors: Shun Ogawa, Takahiko Sumino
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Patent number: 8440756Abstract: Disclosed is a flame-retardant polyamide resin composition, including: a polyamide (A) containing a diamine unit including 70 mol % or more of a p-xylylenediamine unit and a dicarboxylic acid unit including 70 mol % or more of a linear aliphatic dicarboxylic acid unit having 6 to 18 carbon atoms; an organic halogen compound (B) that serves as a flame retardant; an inorganic compound (C) that serves as a flame retardant aid; and an inorganic filler (D), in which the polyamide (A) includes a polyamide having a phosphorus atom concentration of 50 to 1,000 ppm and a YI value of 10 or less in a color difference test in accordance with JIS-K-7105, and a content of the organic halogen compound (B), a content of the inorganic compound (C), and a content of the inorganic filler (D) are 1 to 100 parts by mass, 0.5 to 50 parts by mass, and 0 to 100 parts by mass, respectively, with respect to 100 parts by mass of the polyamide (A).Type: GrantFiled: September 14, 2010Date of Patent: May 14, 2013Assignee: Mitsubishi Gas Chemical Company, Inc.Inventors: Kentaro Ishii, Hisayuki Kuwahara, Shun Ogawa, Shinichi Ayuba, Takahiko Sumino
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Publication number: 20120177937Abstract: Disclosed is a polyamide resin composition, including: a polyamide (A) containing a diamine unit including 70 mol % or more of a p-xylylenediamine unit and a dicarboxylic acid unit including 70 mol % or more of a linear aliphatic dicarboxylic acid unit having 6 to 18 carbon atoms; and a filler (B), in which the polyamide (A) includes a polyamide having a phosphorus atom concentration of 50 to 1,000 ppm and a YI value of 10 or less in a color difference test in accordance with JIS-K-7105, and a content of the filler (B) is 1 to 200 parts by mass with respect to 100 parts by mass of the polyamide (A).Type: ApplicationFiled: September 14, 2010Publication date: July 12, 2012Inventors: Shun Ogawa, Hisayuki Kuwahara, Shinichi Ayuba, Takahiko Sumino, Kentaro Ishii
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Publication number: 20120172512Abstract: Disclosed is a flame-retardant polyamide resin composition, including: a polyamide (A) containing a diamine unit including 70 mol % or more of a p-xylylenediamine unit and a dicarboxylic acid unit including 70 mol % or more of a linear aliphatic dicarboxylic acid unit having 6 to 18 carbon atoms; an organic halogen compound (B) that serves as a flame retardant; an inorganic compound (C) that serves as a flame retardant aid; and an inorganic filler (D), in which the polyamide (A) includes a polyamide having a phosphorus atom concentration of 50 to 1,000 ppm and a YI value of 10 or less in a color difference test in accordance with JIS-K-7105, and a content of the organic halogen compound (B), a content of the inorganic compound (C), and a content of the inorganic filler (D) are 1 to 100 parts by mass, 0.5 to 50 parts by mass, and 0 to 100 parts by mass, respectively, with respect to 100 parts by mass of the polyamide (A).Type: ApplicationFiled: September 14, 2010Publication date: July 5, 2012Applicant: Mitsubishi Gas Chemical Company, Inc.Inventors: Kentaro Ishii, Hisayuki Kuwahara, Shun Ogawa, Shinichi Ayuba, Takahiko Sumino
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Publication number: 20120065303Abstract: Disclose is a polyamide resin composition having excellent heat resistance, heat aging resistance and mechanical physical properties, which is produced by incorporating a specified aromatic secondary amine compound and a specified organic sulfur based compound into a polyamide composed of a diamine unit containing a paraxylylenediamine unit as a major component and a dicarboxylic acid unit containing a linear aliphatic dicarboxylic acid unit having from 6 to 18 carbon atoms as a major component.Type: ApplicationFiled: May 28, 2010Publication date: March 15, 2012Applicant: MITSUBISHI GAS CHEMICAL COMPANY INCInventors: Shun Ogawa, Takahiko Sumino
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Publication number: 20120065327Abstract: A polyamide resin which comprises a diamine unit containing 70 mol % or more of a paraxylylenediamine unit and a dicarboxylic acid unit containing 70 mol % or more of a linear aliphatic dicarboxylic acid unit having from 6 to 18 carbon atoms, and which has a phosphorus atom concentration of from 50 to 1,000 ppm and a YI value of 10 or less in the color difference test in accordance with JIS-K-7105.Type: ApplicationFiled: May 28, 2010Publication date: March 15, 2012Applicant: MITSUBISHI GAS CHEMICAL COMPANY INCInventors: Shun Ogawa, Shinichi Ayuba, Takahiko Sumino, Hisayuki Kuwahara, Kentaro Ishii
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Publication number: 20110245454Abstract: A method of producing polyamide by the direct polycondensation of a diamine component and a dicarboxylic acid component without using a solvent, such as water. The diamine component containing 70 mol % or more of p-xylylenediamine is added to a reaction system containing the dicarboxylic acid component under pressure while maintaining the reaction system in a molten state. After the addition of the diamine component, the pressure of the reaction system is reduced to atmospheric pressure over 50 min or more at a pressure falling speed of 1.0 MPa/h or less. By the production method, polyamide with a small molecular weight dispersion is easily produced.Type: ApplicationFiled: September 11, 2009Publication date: October 6, 2011Applicant: Mitsubishi Gas Chemical Company, Inc.Inventors: Hisayuki Kuwahara, Tomomichi Kanda, Shun Ogawa, Shinichi Ayuba, Kentaro Ishii, Takahiko Sumino