Abstract: The present invention provides an antibacterial composition capable of forming an antibacterial film having suppressed coloration, excellent antibacterial property, and suppressed film cracking, antibacterial film, and an antibacterial film-attached substrate. The antibacterial composition of the present invention includes a silver-based antibacterial agent containing zirconium phosphate and silver carried and supported on the zirconium phosphate, a monomer having a polymerizable group, and a solvent. The monomer having a polymerizable group includes a first monomer having a polymerizable group and a hydrophilic group, and a second monomer having a polymerizable group and having no hydrophilic group, and the content of the first monomer is 30% to 70% by mass with respect to the total mass of the monomer having a polymerizable group.

Abstract: A first object of the present invention is to provide an antibacterial film excellent in the antibacterial property and the antiviral property and resistant to discoloration. A second object of the present invention is to provide an antibacterial composition excellent in the antibacterial property and the antiviral property and capable of providing an antibacterial film that is resistant to discoloration. A third object of the present invention is to provide an antibacterial film-attached substrate provided with the above antibacterial film. A fourth object of the present invention is to provide a method for imparting an antibacterial property using the above antibacterial film and the above antibacterial composition. An antibacterial film of the present invention includes: an antibacterial agent including silver; a binder; an antiviral agent; and a fluorine-based surfactant.

Abstract: Provided is a thermoelectric conversion module having a high heat resistance. The thermoelectric conversion module includes a first substrate, a second substrate, a thermoelectric element, and a bonding layer. The first substrate includes a first metalized layer. The second substrate includes a second metalized layer which faces the first metalized layer. The thermoelectric element includes a chip formed from a thermoelectric material and is arranged between the first metalized layer and the second metalized layer. The bonding layer is composed of a sintered body of a metallic material of which the average crystal particle diameter is no greater than 20 ?m and bonds the first metalized layer and the second metalized layer with the thermoelectric element.

Abstract: A nickel-base alloy welding material according to an embodiment comprises: Cr (chromium) larger than 30.0% and less than or equal to 36.0% by mass; C (carbon) less than or equal to 0.050% by mass; Fe (iron) larger than or equal to 1.00% and less than or equal to 3.00% by mass; Si (silicon) less than or equal to 0.50% by mass; Nb (niobium)+Ta (tantalum) less than or equal to 3.00% by mass; Ti (titanium) less than or equal to 0.70% by mass; Mn (manganese) larger than or equal to 0.10% and less than or equal to 3.50% by mass; Cu (copper) less than or equal to 0.5% by mass, and a remainder is Ni and unavoidable impurities.

Abstract: Provided is a fiber-reinforced thermoplastic resin prepreg which exhibits high interfacial adhesion between reinforcement fibers and a matrix resin, while having excellent interlaminar fracture resistance. The fiber-reinforced thermoplastic resin prepreg of the present invention comprises: a matrix resin comprising a polyarylketone resin and a polyetherimide resin; and a carbon fiber, wherein the polyetherimide resin in the matrix resin comprises a polyetherimide resin having a structural unit represented by Formula (1), an amount of the polyetherimide resin in the matrix resin (100% by mass) is 3% by mass to 25% by mass, and an amount of the polyarylketone resin in the matrix resin (100% by mass) is 75% by mass or more.

Abstract: Disclosed is a wiring board including: an insulating substrate; a plurality of connection terminals arranged on the insulating substrate; and a plurality of non-conductive protruding parts respectively arranged on areas of the insulating substrate except areas on which the plurality of connection terminals are arranged. The non-conductive protruding parts has a height greater than that of the connection terminals.

Abstract: Disclosed is a wiring board including: an insulating substrate; a plurality of connection terminals arranged on the insulating substrate; and a plurality of non-conductive protruding parts respectively arranged on areas of the insulating substrate except areas on which the plurality of connection terminals are arranged. The non-conductive protruding parts has a height greater than that of the connection terminals.

Abstract: In a cooker according to the present disclosure, a convection heater for executing a convection mode and a circulation fan are disposed in a convection forming space that is in communication with a heating chamber, and a fan driver is disposed outside of the convection forming space. The cooker includes a leakage suppression mechanism for suppressing a microwave leak from the convection forming space. The leakage suppression mechanism is formed by a coaxial seal for setting a distance between opposing faces, i.e., between a circulation fan shaft passing through a first wall forming the convection forming space and the first wall to a predetermined distance or smaller. Therefore, a microwave leak from a mechanism for executing the convection mode is suppressed, and heat cooking with a microwave-heating mode can highly effectively be performed.

Abstract: A thermoelectric conversion module package includes: a thermoelectric conversion module including a first and a second substrate opposed to each other, a plurality of thermoelectric elements arranged between the first and second substrates, and a first and a second lead wire drawn out from one of the first and second substrates; and a package including a first metal foil covering the first substrate of the thermoelectric conversion module, a second metal foil covering the second substrate of the thermoelectric conversion module, a resin portion hermetically connecting the first metal foil and the second metal foil along an outer edge portion of the thermoelectric conversion module, and an insertion portion for hermetically passing the first and second lead wires through the resin portion.

Abstract: In a microwave heating device of the present disclosure, inverter unit drives first and second microwave generators. Cooling unit cools first and second microwave generators and inverter unit. First and second waveguides supplies, to cavity, microwaves generated by first and second microwave generators. First and second microwave generators are disposed side by side in a right-left direction below a bottom surface of cavity. Inverter unit and cooling fan are disposed from the first and second microwave generators toward a front side in order, and first and second waveguides are provided so as to extend in a front-back direction from first and second microwave generators, respectively. According to the present disclosure, the microwave heating device can be further downsized in a right-left direction.

Abstract: A microfluidic chip includes a flow passage plate, a flat plate, and an annular seal. In the flow passage plate, a recess forming a flow passage for liquid and a communication hole communicating with the recess are formed. The flat plate is stacked on or under the flow passage plate to close the recess for defining the flow passage. In the flat plate, a communication through-hole communicating with the recess is formed. The annular seal is located on, or formed on, an outer surface of at least one of the flow passage plate and the flat plate, the annular seal surrounding at least one of the communication hole and the communication through-hole. The annular seal is made of an elastomer.

Abstract: A wiring substrate has a substrate body formed by a single or a plurality of insulating layers and having front and back surfaces located at opposite sides of the substrate body; a plurality of pads formed on at least one of the front surface, the back surface and an inner layer surface that is located between the front and back surfaces, and having a staggered arrangement in plan view; and a plurality of via conductors formed at each of the pads, extending in a thickness direction of the substrate body with the plurality of via conductors being parallel to each other and connecting the pads located on different surfaces. Arrangement, in plan view, of the plurality of via conductors connecting to the pad and arrangement, in plan view, of the plurality of via conductors connecting to an adjacent pad located on the same surface are different from each other.

Abstract: A thermoelectric conversion module includes: a substrate; a plurality of thermoelectric elements including an N-type element and a P-type element; a bonding layer including silver and disposed between the substrate and the plurality of thermoelectric elements; a first electrode that connects the N-type element with the bonding layer, the first electrode including a first nickel layer and an aluminum layer that is disposed between the first nickel layer and the N-type element; and a second electrode that connects the P-type element with the bonding layer, the second electrode including a second nickel layer.

Abstract: A wiring board includes: a wiring-board body including a first surface and a second surface opposite to the first surface, and including at least one insulator layer; pads formed at at least one of an internal layer boundary plane and the first surface and the second surface defining a first plane; and via conductors connected to corresponding ones of the pads, and arranged in parallel to extend in a thickness direction of the wiring-board body. Each of first and second ones of the pads adjacent to each other in planar view at the first plane is connected to corresponding ones of the via conductors. The via conductors corresponding to the first pad are arranged differently from the via conductors corresponding to the second pad, in planar view.

Abstract: A unit cell that constitutes a fuel cell stack is obtained by sandwiching an electrolyte mem-brane/electrode structure with a cathode-side separator and an anode-side separator. A first resin member is provided along the entire periphery of the cathode-side separator in the outer peripheral portion of the cathode-side separator. Surfaces of the cathode-side separator are provided with sealing parts that cover a part of the first resin member and constitute a first sealing member.

Abstract: An object of the present disclosure is to provide an exhaust gas purification catalyst demonstrating superior storage of NOx contained in exhaust gas. The exhaust gas purification catalyst of the present disclosure has a substrate, a first catalyst layer containing a catalytic metal for NOx reduction and a NOx storage material and formed on the substrate, and a second catalyst layer containing a catalytic metal for NOx oxidation and formed on the first catalyst layer. In the exhaust gas purification catalyst of the present disclosure, the value obtained by dividing the volume of all large pores having a pore volume of 1000 ?m3 or more by the total volume of all medium pores of having a pore volume of 10 ?m3 to 1000 ?m3 in the second catalyst layer is 2.44 or less.

Abstract: Provided are a carbon fiber thermoplastic resin prepreg which is a carbon fiber prepreg obtained by impregnating a PAN-based carbon fiber in which the average fiber fineness of a single fiber is 1.0 dtex to 2.4 dtex with a thermoplastic resin, wherein the thermoplastic resin satisfies 20?(FM/FS)?40 (where FM: flexural modulus (MPa) of a resin sheet comprising only the thermoplastic resin, and FS: flexural strength (MPa) of the resin sheet), a method for manufacturing the same, and a carbon fiber composite material employing the carbon fiber prepreg.

Abstract: Provided are a carbon fiber thermoplastic resin prepreg which is a carbon fiber prepreg obtained by impregnating a PAN-based carbon fiber in which the average fiber fineness of a single fiber is 1.0 dtex to 2.4 dtex with a thermoplastic resin, wherein the thermoplastic resin satisfies 20?(FM/FS)?40 (where FM: flexural modulus (MPa) of a resin sheet comprising only the thermoplastic resin, and FS: flexural strength (MPa) of the resin sheet), a method for manufacturing the same, and a carbon fiber composite material employing the carbon fiber prepreg.

Abstract: A method has the steps of forming a lot of potting portions made of a rubber-like elastic material at appropriate intervals in respect of an extending direction of the gasket main body in the one side in the thickness direction in the peripheral edge portion of the plate in such a manner as to be positioned in a forming area of the gasket main body, next, pinching a portion constructed by the peripheral edge portion of the plate and the potting portion between inner surfaces of a gasket forming cavity of the metal mold and bringing the other side in the thickness direction of the peripheral edge portion into close contact with the one inner surface of the cavity by positioning and arranging the plate within the metal mold and clamping the mold, and filling a liquid rubber material into the cavity and curing the liquid rubber material.

Abstract: Heating cooker (30) of the present disclosure includes convection device (35) that includes fan (14), heater (13), a first air guide, and second air guide, is communicated with heating chamber (2) through a suction port and a discharge port provided in back wall (2d) of heating chamber (2), and supplies hot air to the heating chamber (2). Fan (14) sucks air inside heating chamber (2) from the suction port into convection device (35), and sends out the air from the discharge port into heating chamber (2). Heater (13) is provided in front of fan (14), and heats the sucked air. The first air guide is provided so as to surround heater (13), and guides the heated air to the discharge port. The second air guide is provided so as to surround fan (14) and the first air guide, and guides the heated air to the discharge port. A part of the second air guide is in contact with the first air guide, and another part of the second air guide is isolated from the first air guide.