Patents by Inventor Takahiro Igarashi

Takahiro Igarashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240145901
    Abstract: The present invention relates to a semiconductor device and an electronic device that facilitate calibration and can obtain favorable characteristics. The semiconductor device includes a substrate, a millimeter wave antenna provided on the substrate, and an image sensor provided on the substrate, in which an antenna surface of the millimeter wave antenna and a light receiving surface of the image sensor are disposed at spatially partitioned positions. The present technology can be applied to a sensor module.
    Type: Application
    Filed: March 2, 2022
    Publication date: May 2, 2024
    Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Takahiro IGARASHI, Shuichi OKA, Shun MITARAI
  • Publication number: 20240079425
    Abstract: An image pickup module includes: a lens unit including a first principal surface and a second principal surface; an image pickup unit including a third principal surface and a fourth principal surface on which an external electrode is disposed; a wiring board including a hole and a bonding electrode disposed on a bottom surface of the hole; a solder that bonds the bonding electrode and the external electrode; a rigid member that defines a spacing between the fourth principal surface and the bottom surface; and a second resin disposed between the fourth principal surface and the bottom surface.
    Type: Application
    Filed: November 14, 2023
    Publication date: March 7, 2024
    Applicant: OLYMPUS CORPORATION
    Inventors: Naoki ITO, Takatoshi IGARASHI, Keiichi KOBAYASHI, Takahiro SHIMOHATA
  • Patent number: 11817538
    Abstract: A laminated film in which a heat-resistant base film and a metal foil are bonded using an adhesive is provided with a barrier layer that prevents chemicals from entering the adhesive layer, between the metal foil and the adhesive layer. The barrier layer is made of a heat-resistant resin similar to that of the base film and has a water absorption rate of 1% or less. The adhesive layer is a silicone-based resin and has a thickness of 40 ?m or more after drying.
    Type: Grant
    Filed: May 19, 2022
    Date of Patent: November 14, 2023
    Assignee: STANLEY ELECTRIC CO., LTD.
    Inventors: Takahiro Igarashi, Shoko Kasai, Akihiko Hanya
  • Publication number: 20230125605
    Abstract: Provided is a semiconductor device capable of maintaining the flatness of a glass substrate and sufficiently protecting an end portion of the glass substrate. A semiconductor device according to one aspect of the present disclosure includes: a glass substrate including a first surface, a second surface opposite to the first surface, and a first side surface between the first surface and the second surface; wirings provided on the first and second surfaces; a first insulating film that covers the first surface; a second insulating film that covers the second surface; and a third insulating film that covers the first side surface, the third insulating film being continuous with at least one of the first and second insulating films.
    Type: Application
    Filed: March 23, 2021
    Publication date: April 27, 2023
    Inventors: YUTO TANAKA, SHUICHI OKA, SHUN MITARAI, KIWAMU ADACHI, TAKAHIRO IGARASHI, HIIZU OHTORII, NAOKI KAKOIYAMA, KOUSUKE SEKI, HIROYUKI SHIGETA
  • Publication number: 20230099457
    Abstract: The present invention provides a radio frequency module including: an interposer; a plurality of antenna element groups that include first electrodes and a second electrode and are configured such that the first electrodes are aligned in line shapes in at least a first direction on a first surface of the interposer; and meta material portions that are provided at the interposer and affect electromagnetic properties of the plurality of antenna elements. The meta material portions include electromagnetic band gap structures provided by forming predetermined geometric patterns near both sides of the first electrodes along at least the first direction. The radio frequency module can thus have a reduced size and a broad band/a high gain.
    Type: Application
    Filed: January 18, 2021
    Publication date: March 30, 2023
    Inventors: TAKAHIRO IGARASHI, SHUSAKU YANAGAWA
  • Publication number: 20230035537
    Abstract: A measurement device 100 includes a light source that irradiates a subject with light, a drive control unit that intermittently drives the light source, a light receiving element that receives scattered light of the light from the subject and generates an electric signal, and an amplifier that amplifies the electric signal with an integration circuit.
    Type: Application
    Filed: March 11, 2021
    Publication date: February 2, 2023
    Inventors: YOSHIHIRO WAKITA, KOTA AIZAWA, TAKAHIRO IGARASHI
  • Patent number: 11527494
    Abstract: A module of an embodiment of the present disclosure includes a first substrate including a first wiring pattern and a second substrate having a second wiring pattern with a wiring density different from that of the first wiring pattern, in which the second substrate is bonded to the first substrate. At least one of the first substrate or the second substrate has visible light transmittance.
    Type: Grant
    Filed: April 10, 2019
    Date of Patent: December 13, 2022
    Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Takahiro Igarashi, Shusaku Yanagawa
  • Publication number: 20220376155
    Abstract: A laminated film in which a heat-resistant base film and a metal foil are bonded using an adhesive is provided with a barrier layer that prevents chemicals from entering the adhesive layer, between the metal foil and the adhesive layer. The barrier layer is made of a heat-resistant resin similar to that of the base film and has a water absorption rate of 1% or less. The adhesive layer is a silicone-based resin and has a thickness of 40 ?m or more after drying.
    Type: Application
    Filed: May 19, 2022
    Publication date: November 24, 2022
    Applicant: STANLEY ELECTRIC CO., LTD.
    Inventors: Takahiro IGARASHI, Shoko KASAI, Akihiko HANYA
  • Publication number: 20220320743
    Abstract: An antenna device and a wireless communication apparatus capable of improving performance are provided. The antenna device includes a first antenna element and a second antenna element disposed on the side of one surface of the first antenna element. The first antenna element includes a first glass substrate and a first patch antenna provided on the first glass substrate. The second antenna element includes a second glass substrate and a second patch antenna provided on the second glass substrate. The shape of at least one of the first patch antenna and the second patch antenna in a plan view is a rectangle. Contours of one or more of four corners of the rectangle include a curved line or a plurality of obtuse angles in a plan view.
    Type: Application
    Filed: September 28, 2020
    Publication date: October 6, 2022
    Inventor: TAKAHIRO IGARASHI
  • Publication number: 20220102831
    Abstract: An antenna device and a wireless communication apparatus capable of implementing increase in bandwidth and reduction of the manufacturing cost are provided. The antenna device includes a first antenna element and a second antenna element arranged on one face side of the first antenna element. The first antenna element includes a first glass substrate and a first patch antenna provided on the first glass substrate. The second antenna element includes a second glass substrate and a second patch antenna provided on the second glass substrate. At least part of the first patch antenna faces the second patch antenna with an air gap interposed therebetween.
    Type: Application
    Filed: December 13, 2019
    Publication date: March 31, 2022
    Inventors: TAKAHIRO IGARASHI, NAOKI KAKOIYAMA, SHUICHI OKA, SHUSAKU YANAGAWA
  • Publication number: 20210233876
    Abstract: A module of an embodiment of the present disclosure includes a first substrate including a first wiring pattern and a second substrate having a second wiring pattern with a wiring density different from that of the first wiring pattern, in which the second substrate is bonded to the first substrate. At least one of the first substrate or the second substrate has visible light transmittance.
    Type: Application
    Filed: April 10, 2019
    Publication date: July 29, 2021
    Inventors: TAKAHIRO IGARASHI, SHUSAKU YANAGAWA
  • Publication number: 20200233098
    Abstract: The present technology relates to a light-receiving device that makes it possible to simplify readout from a plurality of pixels and a process after the readout, without deteriorating light receiving sensitivity and characteristics in resolution. A plurality of unit elements is disposed above a substrate, each of the unit elements including a plurality of pixels disposed in m number of rows and n number of columns, and a readout section that sequentially reads out signals from a plurality of pixels disposed in a column direction among the plurality of pixels. The number of readout sections is at least the same as the number of columns. The readout section includes a QV amplifier. The present technology is applicable to the light-receiving device that detects radiation.
    Type: Application
    Filed: February 8, 2018
    Publication date: July 23, 2020
    Inventors: KATSUJI MATSUMOTO, TAKAHIRO IGARASHI, TAKAHIRO SONODA
  • Patent number: 10358598
    Abstract: A compound is provided containing silicon, aluminum, strontium, europium, nitrogen, and oxygen is used that enables a red phosphor having strong luminous intensity and high luminance to be obtained, and that enables the color gamut of a white LED to be increased with the use of red phosphor. The red phosphor contains element A, europium, silicon, aluminum, oxygen, and nitrogen at the atom number ratio of the following formula: [Am?x)Eux]Si9AlyOnN [12+y?2(n?m)/3]. The element A in the formula is at least one of magnesium, calcium, strontium, and barium, and m, x, y, and n in the formula satisfy the relations 3<m<5, 0<x<1, 0<y<2, and 0<n<10.
    Type: Grant
    Filed: June 2, 2017
    Date of Patent: July 23, 2019
    Assignee: DEXERIALS CORPORATION
    Inventors: Hiraku Akiho, Tsuneo Kusunoki, Takahiro Igarashi, Takamasa Izawa
  • Publication number: 20190103501
    Abstract: A light-receiving device of an embodiment of the present disclosure includes, on a first principal surface of a semiconductor layer, a pixel region that includes a plurality of light-receiving pixels each receiving light incident from side of a second principal surface of the semiconductor layer. The light-receiving device further includes, throughout a gap between the second principal surface and the pixel region, a low-impurity region having a relatively lower impurity concentration than the pixel region. The light-receiving pixels each include one or a plurality of photoelectric current extraction regions each including, on the first principal surface, an anode region and a cathode region, and a circuit region that is electrically coupled to each of the cathode regions and is electrically separated from the impurity region.
    Type: Application
    Filed: February 15, 2017
    Publication date: April 4, 2019
    Applicant: SONY CORPORATION
    Inventors: Takahiro IGARASHI, Takahiro SONODA, Atsushi SUZUKI, Shinya YAMAKAWA, Hiroshi YUMOTO, Izuho HATADA, Takeshi KODAMA, Kiwamu ADACHI, Katsuji MATSUMOTO
  • Publication number: 20190049599
    Abstract: An imaging apparatus includes: a substrate; and a plurality of device sections each including a photoelectric converter and disposed on the substrate to be spaced from one another and to collectively form a concave shape.
    Type: Application
    Filed: January 17, 2017
    Publication date: February 14, 2019
    Applicant: SONY CORPORATION
    Inventors: Katsuji MATSUMOTO, Shusaku YANAGAWA, Takahiro IGARASHI, Hiroshi ICHIKI
  • Patent number: 10061036
    Abstract: A radiation detector includes a substrate, a plurality of device sections each disposed separately from the substrate and each including a photoelectric conversion device, a buried layer formed in a region between the device sections, and a wavelength conversion layer that is formed on the plurality of device sections and converts entered radiation into light. Any of the device sections includes a first surface that faces the wavelength conversion layer, and a second surface that faces the substrate, and an upper end of the buried layer is disposed at a position higher than the second surface of the any of the device sections.
    Type: Grant
    Filed: January 8, 2016
    Date of Patent: August 28, 2018
    Assignee: SONY CORPORATION
    Inventors: Takahiro Igarashi, Yusuke Oyama, Shusaku Yanagawa
  • Patent number: 10047931
    Abstract: A method for manufacturing green-emitting phosphor particles including the steps of producing a powder containing europium and strontium from a solution containing a europium compound and a strontium compound, mixing the resulting powder and a powdered gallium compound, and performing firing.
    Type: Grant
    Filed: November 9, 2015
    Date of Patent: August 14, 2018
    Assignee: DEXERIALS CORPORATION
    Inventors: Takamasa Izawa, Tsuneo Kusunoki, Takahiro Igarashi
  • Patent number: 9989838
    Abstract: A light emitting element includes a base material having a rough surface and a phosphor layer which is directly or indirectly formed on the rough surface of the base material and includes a plurality of phosphor particles which are bonded to each other by a binder.
    Type: Grant
    Filed: May 1, 2017
    Date of Patent: June 5, 2018
    Assignee: Sony Corporation
    Inventors: Yuki Maeda, Takahiro Igarashi, Yutaka Imai
  • Patent number: 9929199
    Abstract: There is provided a radiation detector including: a plurality of photoelectric conversion devices, each photoelectric conversion device formed at least partially within an embedding layer and having a light receiving surface situated at least partially outside of the embedding layer, and a plurality of scintillator crystals, at least a first scintillator crystal of the plurality of scintillator crystals in contact with at least one light receiving surface at a proximal end, wherein a cross-section of the first scintillator crystal at the proximal end is smaller than a cross-section of the first scintillator crystal at a distal end.
    Type: Grant
    Filed: August 21, 2014
    Date of Patent: March 27, 2018
    Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Takahiro Igarashi, Izuho Hatada, Takeshi Kodama, Kiwamu Adachi, Shuichi Oka, Shun Mitarai, Hiizu Ootorii, Shusaku Yanagawa, Katsuji Matsumoto
  • Publication number: 20180003830
    Abstract: A radiation detector includes a substrate, a plurality of device sections each disposed separately from the substrate and each including a photoelectric conversion device, a buried layer formed in a region between the device sections, and a wavelength conversion layer that is formed on the plurality of device sections and converts entered radiation into light. Any of the device sections includes a first surface that faces the wavelength conversion layer, and a second surface that faces the substrate, and an upper end of the buried layer is disposed at a position higher than the second surface of the any of the device sections.
    Type: Application
    Filed: January 8, 2016
    Publication date: January 4, 2018
    Inventors: TAKAHIRO IGARASHI, YUSUKE OYAMA, SHUSAKU YANAGAWA