Abstract: An austenitic stainless steel includes a mixed grain structure composed of a columnar crystal having an average crystal grain size of 20 ?m or less and an equiaxed crystal having an average crystal grain size of 5.0 ?m or less, in which an area proportion of the columnar crystal in the mixed grain structure is 20% or more, and an average crystal grain size of the whole mixed grain structure is 5.0 ?m or less. Accordingly, it is possible to provide a material having excellent irradiation resistance and mechanical properties.

Abstract: Provided is a fastening member having a base material including an aluminum alloy and an anticorrosive film with which the base material is coated. This anticorrosive film contains aluminum hydroxide oxide (AlO(OH)), and in a profile obtained from X-ray diffractometry with a Cu-K? radiation on the fastening member, a peak intensity ratio R (IB(020)/IAl(200)) is 0.003 or more and 0.1 or less, wherein IB(020) is an intensity of a diffraction peak of a (020) plane of aluminum hydroxide oxide, and IAl(200) is an intensity of a diffraction peak of a (200) plane of aluminum as a main peak. The anticorrosive film formed by the present invention is uniformly formed on the fastening member and excellent in stability and adhesion.

Abstract: A method of manufacturing a composite member including an aluminum member and a resin member that are bonded to each other, the method including: performing blasting on a surface of the aluminum member; modifying the surface of the aluminum member into aluminum hydroxide, the modifying including causing the surface of the aluminum member having undergone blasting to react with water vapor by applying a pressure exceeding an atmospheric pressure; and directly bonding the resin member to the surface of the aluminum member modified to aluminum hydroxide.

Abstract: An objective of the invention is to provide an austenitic stainless steel article having superior irradiation resistance and stress corrosion cracking resistance than before while maintaining mechanical properties equivalent to those of conventional ones. There is provided a dispersion strengthened austenitic stainless steel article, including: 16-26 mass % of Cr; 8-22 mass % of Ni; 0.005-0.08 mass % of C; 0.002-0.1 mass % of N; 0.02-0.4 mass % of O; at least one of 0.2-2.8 mass % of Zr, 0.4-5 mass % of Ta, and 0.2-2.6 mass % of Ti; and a balance consisting of Fe and inevitable impurities. The Zr, Ta and Ti components form inclusion particles in the stainless steel article by combining with the C, N and O components. The stainless steel article has an average grain size of 1 ?m or less and a maximum grain size of 5 ?m or less.

Abstract: An austenitic stainless steel includes a mixed grain structure composed of a columnar crystal having an average crystal grain size of 20 ?m or less and an equiaxed crystal having an average crystal grain size of 5.0 ?m or less, in which an area proportion of the columnar crystal in the mixed grain structure is 20% or more, and an average crystal grain size of the whole mixed grain structure is 5.0 ?m or less. Accordingly, it is possible to provide a material having excellent irradiation resistance and mechanical properties.

Abstract: A building comprises a structural material configured to form a framework of the building; a hydrogen storing alloy integrated with the structural material; a temperature regulator provided inside of the structural material such as to regulate temperature of the structural material; and a piping provided inside of the structural material such as to cause hydrogen taken out from the hydrogen storing alloy to flow therethrough.

Abstract: A building comprises a structural material configured to form a framework of the building; a hydrogen storing alloy integrated with the structural material; a temperature regulator provided inside of the structural material such as to regulate temperature of the structural material; and a piping provided inside of the structural material such as to cause hydrogen taken out from the hydrogen storing alloy to flow therethrough.

Abstract: An objective of the invention is to provide an austenitic stainless steel article having superior irradiation resistance and stress corrosion cracking resistance than before while maintaining mechanical properties equivalent to those of conventional ones. There is provided a dispersion strengthened austenitic stainless steel article, including: 16-26 mass % of Cr; 8-22 mass % of Ni; 0.005-0.08 mass % of C; 0.002-0.1 mass % of N; 0.02-0.4 mass % of O; at least one of 0.2-2.8 mass % of Zr, 0.4-5 mass % of Ta, and 0.2-2.6 mass % of Ti; and a balance consisting of Fe and inevitable impurities. The Zr, Ta and Ti components form inclusion particles in the stainless steel article by combining with the C, N and O components. The stainless steel article has an average grain size of 1 ?m or less and a maximum grain size of 5 ?m or less.

Abstract: An object of the present invention is to provide austenitic stainless steel having a high strength and high corrosion resistance while improving resistance to irradiation and reducing irradiation-induced stress corrosion cracking. A solution is as follows. Austenitic stainless steel of the present invention contains Cr: 16 to 26%, Ni: 8 to 22%, O: 0.02 to 0.4%, C: 0.08% or less, and N: 0.1% or less by weight, and further contains at least one kind of Zr: 0.2 to 2.8%, Ta: 0.4 to 5. 0%, and Ti: 0.2 to 2.6%, the balance being Fe and unavoidable impurities, wherein Zr, Ta, and Ti are precipitated as precipitates of one or more kinds of oxide particles, carbide particles, nitride particles, and composite particles thereof.

Abstract: An tank such as an electroless copper plating tank 200, includes a liquid squirting part 4 having a squirt port 6 for squirting the processing solution Q from the squirt port 6 toward the treatment object obliquely upward to a horizontal plane, and hitting the processing solution Q on the upper area of the plate-like work 10 so that the processing solution Q runs down the plate-like work 10.

Abstract: A tank body 100 includes a liquid receiving part 2 for receiving processing solution Q applied to a plate-like work 10 and a liquid retaining part 4 for retaining liquids to be applied to the plate-like work 10 and a liquid outflowing part 6 for causing a flow of the processing solution Q which is spilled out of the liquid retaining part 4 and traveled down toward the plate-like work 10, wherein a tip 6a of the liquid outflowing part 6 is projected from a connecting part 5 connecting to the liquid retaining part 4 (or the liquid receiving part 2).

Abstract: The regeneration unit includes a tubular portion having the inner circumferential surface functioning as an anode, and a cathode provided inside the tubular portion and extending along the extension direction of the tubular portion in a state of separation from the inner circumferential surface. The treatment liquid used for desmearing treatment is fed through a gap between the inner circumferential surface of the tubular portion and the cathode. A feed-side conduit is connected by a downstream end portion thereof to the tubular portion and guides the treatment liquid discharged from a desmearing treatment tank into a regeneration unit. A return-side conduit is connected by an upstream end portion thereof to the tubular portion and guides the treatment liquid discharged from the regeneration unit into the desmearing treatment tank.

Abstract: An tank such as an electroless copper plating tank 200, includes a liquid squirting part 4 having a squirt port 6 for squirting the processing solution Q from the squirt port 6 toward the treatment object obliquely upward to a horizontal plane, and hitting the processing solution Q on the upper area of the plate-like work 10 so that the processing solution Q runs down the plate-like work 10.

Abstract: A tank body 100 includes a liquid receiving part 2 for receiving processing solution Q applied to a plate-like work 10 and a liquid retaining part 4 for retaining liquids to be applied to the plate-like work 10 and a liquid outflowing part 6 for causing a flow of the processing solution Q which is spilled out of the liquid retaining part 4 and traveled down toward the plate-like work 10, wherein a tip 6a of the liquid outflowing part 6 is projected from a connecting part 5 connecting to the liquid retaining part 4 (or the liquid receiving part 2).

Abstract: Provided are an electroless copper plating bath and an electroless copper plating method using the electroless copper plating bath, the electroless copper plating bath not containing formaldehyde; being usable under approximately neutral pH conditions; improving plating bath stability; and capable of forming a plating film with a good thickness while controlling deposition outside a pattern. The electroless copper plating bath according to the present invention contains a water-soluble copper salt, and amine borane or a substituted derivative thereof as a reducing agent; does not contain formaldehyde; and has a pH of 4 to 9, wherein polyaminopolyphosphonic acid as a complexing agent, an anionic surface-active agent, an antimony compound, and a nitrogen-containing aromatic compound are contained.

Abstract: The present invention is directed to a method for manufacturing a printed circuit board in which a plurality of conductive layers forming a wiring pattern are laminated in the state where they are put between insulating layers, and a printed circuit board formed thereby. The printed circuit board manufacturing method for the present invention includes a step of forming a via fill (17) to allow electroless plating liquid to be in contact with the surface of the wiring pattern exposed to a bottom part of a via hole (14) formed at a insulating layer to laminate plating metallic film from the bottom part to a opening part of the via hole (14), to form the via fill (17), and a step of forming a wiring pattern to form electroless plating metallic film (20) serving as the wiring pattern onto a substrate where the via fill (17) is formed.

Abstract: A method for forming a circuit pattern is disclosed. A circuit pattern that forms an electrically conductive layer (2L) is formed on an insulating resin (11) that forms a first insulating layer (1L). An insulating resin (13) that forms a second insulating layer (3L) is laminated on the insulating resin (11) on which the circuit pattern has been formed. A trench (14) is formed in the laminated insulating resin (13) to expose the circuit pattern. An electroless plating metal (15) is buried by electroless plating in the trench (14) formed.

Abstract: Disclosed is an electroless plating solution exhibiting a good plating metal filling performance even for larger trenches or vias of several to one hundred and tens of ?m, in a manner free from voids or seams, and allowing maintenance of stabilized performance for prolonged time. The electroless plating solution contains at least a water-soluble metal salt, a reducing agent for reducing metal ions derived from the water-soluble metal salt, and a chelating agent. In addition, the electroless plating solution contains a sulfur-based organic compound as a leveler having at least one aliphatic cyclic group or aromatic cyclic group to which may be linked at least one optional substituent. The aliphatic cyclic group or the aromatic cyclic group contains optional numbers of carbon atoms, oxygen atoms, phosphorus atoms, sulfur atoms and nitrogen atoms.

Abstract: Disclosed is an electroless plating solution exhibiting a good plating metal filling performance even for larger trenches or vias of several to one hundred and tens of ?m, in a manner free from voids or seams, and allowing maintenance of stabilized performance for prolonged time. The electroless plating solution contains at least a water-soluble metal salt, a reducing agent for reducing metal ions derived from the water-soluble metal salt, and a chelating agent. In addition, the electroless plating solution contains a sulfur-based organic compound as a leveler having at least one aliphatic cyclic group or aromatic cyclic group to which may be linked at least one optional substituent. The aliphatic cyclic group or the aromatic cyclic group contains optional numbers of carbon atoms, oxygen atoms, phosphorus atoms, sulfur atoms and nitrogen atoms.

Abstract: Disclosed is an electroless plating solution exhibiting a good plating metal filling performance even for larger trenches or vias of several to one hundred and tens of ?m, in a manner free from voids or seams, and allowing maintenance of stabilized performance for prolonged time. The electroless plating solution contains at least a water-soluble metal salt, a reducing agent for reducing metal ions derived from the water-soluble metal salt, and a chelating agent. In addition, the electroless plating solution contains a sulfur-based organic compound as a leveler having at least one aliphatic cyclic group or aromatic cyclic group to which may be linked at least one optional substituent. The aliphatic cyclic group or the aromatic cyclic group contains optional numbers of carbon atoms, oxygen atoms, phosphorus atoms, sulfur atoms and nitrogen atoms.