Abstract: In a substrate processing apparatus for processing a substrate, a processing chamber accommodating the substrate is provided. A mounting table is disposed in the processing chamber and configured to attract and hold the substrate using an electrostatic attractive force. A charge amount measurement unit is disposed in the processing chamber and configured to measure charge amount of a substrate attraction surface of the mounting table. A charge neutralization mechanism is configured to neutralize the substrate attraction surface of the mounting table. A retreating mechanism is configured to make the charge amount measurement unit retreat from a measurement position facing the substrate attraction surface of the mounting table.

Abstract: There is provided an electrostatic attraction device having an electrostatic chuck in which an electrode and a heater are embedded in a dielectric. The device comprises: a DC power source unit having a DC power source configured to supply a DC power to the electrode; a first neutralizing circuit connected to a power supply path between the DC power source and the electrode; and a second neutralizing circuit connected to a power supply path between the first neutralizing circuit and the electrode.

Abstract: A method for adjusting a contact position of lift pins in a substrate placement mechanism is provided. The substrate placement mechanism includes a substrate placement table and a substrate lifting mechanism having lift pins and a driving mechanism, wherein the contact position of the lift pins is a height position where tip ends of the lift pins get in contact with the substrate. The method comprises creating torque waveforms, for a plurality of voltages, indicating temporal changes of a torque of the motor while moving the tip ends of the lift; obtaining from the plurality of torque waveforms a contact point when the lift pins get in contact with the substrate and calculating the contact position from the contact point and a speed of the motor; determining whether the contact position is within an appropriate range; and automatically adjusting the contact position when the contact position is not within the appropriate range.

Abstract: In a substrate processing apparatus for processing a substrate, a processing chamber accommodating the substrate is provided. A mounting table is disposed in the processing chamber and configured to attract and hold the substrate using an electrostatic attractive force. A charge amount measurement unit is disposed in the processing chamber and configured to measure charge amount of a substrate attraction surface of the mounting table. A charge neutralization mechanism is configured to neutralize the substrate attraction surface of the mounting table. A retreating mechanism is configured to make the charge amount measurement unit retreat from a measurement position facing the substrate attraction surface of the mounting table.