Patents by Inventor Takahiro Nakano
Takahiro Nakano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240123969Abstract: A vehicle moving apparatus executes a moving control to autonomously move a vehicle by controlling a power output from an internal combustion engine and an electric motor. When the vehicle is requested to be accelerated while the moving control is not executed, the apparatus keeps the engine deactivated and activates the motor while a requested power is smaller than a first start determination value, and starts to activate the engine when the requested power reaches the first start determination value. When the vehicle is requested to be accelerated while the moving control is executed, the apparatus keeps the engine deactivated and activates the motor while the requested power is smaller than a second start determination value, and starts to activate the engine when the requested power reaches the second start determination value. The second start determination value is smaller than the first start determination value.Type: ApplicationFiled: July 14, 2023Publication date: April 18, 2024Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Hideki KAMATANI, Yusuke Tsuzuki, Takahiro Nakano
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Publication number: 20240077842Abstract: An adjustment support system includes a controller and a storage, in which the storage holds production line model data related to a model of one or more production facilities in a cyberspace of a production line and actual machine data obtained by actually measuring one or more production facilities disposed in an actual space of the production line, the controller calculates a difference between the production line model data and the actual machine data, upon determination that the difference exists on a basis of a result of calculating the difference, the controller creates one or more adjustment plans each targeting at least one of the model of the one or more production facilities in the cyberspace or the one or more production facilities disposed in the actual space, and the controller outputs the one or more adjustment plans having been created.Type: ApplicationFiled: May 31, 2023Publication date: March 7, 2024Inventors: Reiko INOUE, Daiki KAJITA, Takahiro NAKANO
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Publication number: 20240036561Abstract: Provided is a quasi-optimal solution for a production line such that a KPI is further improved without deteriorating production throughput after the production line is designed. The invention includes: a storage unit configured to store product CAD information pertaining to a shape of a product, component attribute information pertaining to an attribute of a component, module group specification information pertaining to a specification of a module group implemented by combining attributes of modules as a production resource of the product for respective work processes of the component, and module specification information pertaining to a specification of the module; and a computation unit configured to design a production line by executing an equipment design, a control design, a process design, and an arrangement design in this order.Type: ApplicationFiled: September 29, 2021Publication date: February 1, 2024Inventors: Takahiro NAKANO, Daiki KAJITA, Daisuke TSUTSUMI
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Publication number: 20230367296Abstract: This industrial system is characterized by being provided with: a storage unit that stores design data used when constructing an industrial line; a simulation execution unit that executes a simulation of movement of the industrial line, based on the design data; and a detection unit that compares a result of the simulation with the movement of the industrial line during operation and detects an abnormality in components of the industrial line. With such a configuration and movement, the present invention can be utilized for line operation support and high-resolution abnormality detection.Type: ApplicationFiled: November 2, 2020Publication date: November 16, 2023Applicant: Hitachi, Ltd.Inventors: Nobuhiro KAKENO, Yoshiteru KATSUMURA, Daiki KAJITA, Takahiro NAKANO, Miho ARAI
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Publication number: 20230221706Abstract: It is possible to more efficiently make a factory plan configured to maximize a productivity index. Provided is a factory plan device including a calculation unit configured to specify a process and a production resource candidate based on a shape of a component of a target product by inputting past production performance data of a product, production volume data, design data of the product, specification data of a production resource, and layout data of a factory, and to calculate a process plan configured to determine order of the process and the production resource, a production plan configured to determine working date and time of the production resource, and a layout of the production resource so as to maximize a predetermined productivity index in the factory.Type: ApplicationFiled: May 10, 2021Publication date: July 13, 2023Inventors: Takahiro NAKANO, Atsuko ENOMOTO, Daiki KAJITA
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Publication number: 20230223310Abstract: An element package includes a semiconductor element, a redistribution layer, a sealing resin body, and an insulating portion. The semiconductor element includes a semiconductor substrate having an element region and a scribe region, a main electrode and a pad disposed on a surface of the semiconductor substrate, and a protective film disposed above the element region on the surface of the semiconductor substrate. The sealing resin body seals the semiconductor element while exposing the main electrode and the pad. The insulating portion is disposed above the scribe region on the surface of the semiconductor element with a height not to exceed an outer peripheral edge portion of an upper surface of the protective film on the element region. The redistribution layer extends over the protective film and the insulating portion above the scribe region.Type: ApplicationFiled: February 27, 2023Publication date: July 13, 2023Applicant: DENSO CORPORATIONInventors: YOSHIHIRO INUTSUKA, TAKAHIRO NAKANO, MASAYUKI TAKENAKA, NAOHITO MIZUNO, SEIGO OSAWA, YASUSHI OKURA
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Publication number: 20230131077Abstract: The production line design apparatus includes a memory unit configured to store resource configuration information defining production resources constituting a production line to be designed, resource arrangement constraint information defining an arrangement constraint on the production resources, a production condition to be satisfied by the production line, work allocation information including a workpiece allocated to the production resources and a number of the workpiece, work order information including the production resources used in setup works of the production line and an order of the setup works, and resource candidate information defining a specification of the production resources; a layout generation unit configured to generate a plurality of layout candidates for each of the resource configuration information, where the layout candidate satisfies the arrangement constraint and the production condition; and a setup time calculation unit configured to calculate a setup time for each layout candiType: ApplicationFiled: September 28, 2022Publication date: April 27, 2023Inventors: Hiroyuki SAKAKA, Daisuke TSUTSUMI, Takahiro NAKANO
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Publication number: 20230046379Abstract: A function to optimize factory management using information on operation ability and capability of an operator and a machine is provided.Type: ApplicationFiled: September 8, 2020Publication date: February 16, 2023Inventors: Takahiro NAKANO, Daisuke TSUTSUMI, Yumiko UENO
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Publication number: 20230032353Abstract: A semiconductor device includes a semiconductor element, a sealing member, and a rewiring layer. The rewiring layer includes an insulating layer covering a front surface of the semiconductor element and a part of the sealing member, an electrode connected to the semiconductor element, and an externally-exposed layer being conductive and covering a portion of the electrode exposed from the insulating layer.Type: ApplicationFiled: October 12, 2022Publication date: February 2, 2023Inventors: TAKAHIRO NAKANO, SEIGO OOSAWA, YASUSHI OOKURA, NAOHITO MIZUNO, YOSHIHIRO INUTSUKA
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Publication number: 20220310558Abstract: A manufacturing method comprises preparing a bonding substrate having bumps thereon; preparing a mounted member having external conductive members; applying a fixing material to the surface of the bonding substrate and/or to a surface of the mounted member; and fixing the bonding substrate and the mounted member with the fixing material such that the bumps contact the external conductive members. The fixing material is prepared to contain a first compound and a second compound, each having respective viscosities which change depending on their respective temperature profiles; and applying the fixing material to the bonding substrate and/or the mounted member at a temperature lower than a first temperature, and the fixing comprises pressing the bonding substrate against the mounted member when the fixing material has a temperature lower than the first temperature; and heating the fixing material to a temperature higher than the second temperature and curing the fixed material.Type: ApplicationFiled: June 13, 2022Publication date: September 29, 2022Inventors: Katsunori HIRATA, Nozomi SHIMOISHIZAKA, Takahiro NAKANO
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Publication number: 20220075355Abstract: In an arrangement design of a robot cell and of robot work, a planning device searches an arrangement graph, that shows candidates for relative positions and orientations between a robot and a fixture; searches a disassembly task sequence, of disassembly tasks that are operations of the robot for disassembling components from the assembly in an arrangement of the relative positions and orientations between the robot and the fixture, and searches for, based on a point sequence of positioning relay points of the robot, a trajectory in which the robot disassembles the components from the assembly; and generates assembly tasks formed of a point sequence obtained by reversing the point sequence of the relay points, an assembly trajectory of the robot which is reverse to a disassembly trajectory formed of interpolation points between the point sequences, and an assembly sequence, which is a reverse order of the disassembly task sequence.Type: ApplicationFiled: August 18, 2021Publication date: March 10, 2022Inventors: Atsuko ENOMOTO, Daiki KAJITA, Takahiro NAKANO, Takaharu MATSUI
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Patent number: 11235942Abstract: A sheet processing apparatus arranged in a space between an image reading section for reading an image and an image formation section for forming an image on a sheet includes a carry-in path guiding a sheet from a carry-in entrance; a relay roller provided in the carry-in path to relay and transport the sheet; a first transport path positioned on a downstream side of the relay roller and having a carry-in roller to transport the sheet from the carry-in path to the first collection tray; and a second transport path branched from the carry-in path and having a branch roller to transport the transported sheet to the second collection tray. The relay roller shifts the sheet in a direction crossing the transport direction while a front end of the sheet enters the first transport path or the second transport path, and arrives at the carry-in roller or the branch roller.Type: GrantFiled: February 20, 2020Date of Patent: February 1, 2022Assignee: CANON FINETECH NISCA INC.Inventor: Takahiro Nakano
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Publication number: 20220005743Abstract: A semiconductor module includes a first heat sink member, a semiconductor device, a second heat sink member, a lead frame, a second sealing member. The semiconductor device includes a semiconductor element, a first sealing member for covering the semiconductor element, a first wiring and a second wiring electrically connected to the semiconductor element, and a rewiring layer on the semiconductor element and the sealing member. The second heat sink member is disposed on the semiconductor device. The lead frame is electrically connected to the semiconductor device through a bonding member. The second sealing member covers a portion of the first heat sink member, the semiconductor and a portion of the second heat sink member. A surface of the second heat sink member faces the semiconductor device. The semiconductor device has a portion protruded from an outline of the second surface sink member.Type: ApplicationFiled: September 15, 2021Publication date: January 6, 2022Inventors: Seigo OSAWA, Yasushi OKURA, Takahiro NAKANO, Naohito MIZUNO, Masayuki TAKENAKA, Yoshihiro INUTSUKA
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Publication number: 20210097884Abstract: A work capacity analysis is performed to improve productivity of a worker. A work support apparatus includes a storage unit that stores work instruction information including instructions of work procedures for instructing workers to perform predetermined work processes and work capacity model information including a plurality of models determined based on physical characteristics of the workers in respective work processes; a work sensing processing unit that senses the physical characteristic of the worker during a work that the worker performs based on the work instruction information and generates sensing information; and a work capacity evaluation processing unit that selects, for each of the workers, one or a plurality of models corresponding to the sensing information from the work capacity model information and associates the selected model with the sensing information to generate work capacity evaluation information.Type: ApplicationFiled: August 27, 2020Publication date: April 1, 2021Applicant: HITACHI, LTD.Inventors: Daisuke Tsutsumi, Youichi Nonaka, Takahiro Nakano, Yumiko Ueno
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Patent number: 10935458Abstract: A facility condition monitoring device includes an abnormality-degree-calculation-model construction part which constructs an abnormality-degree-calculation model for calculating an abnormality degree of a monitoring feature group of a monitoring target facility, based on a normal feature group extracted from a state-quantity fluctuation data of the monitoring target facility, an abnormality degree calculation part which calculates the abnormality degree of the monitoring feature group with the abnormality-degree-calculation model, an abnormality determination part which determines whether the monitoring target facility is abnormal, based on the abnormality degree, an abnormality-contribution-rate calculation part which obtains a contribution rate of each feature constituting the monitoring feature group used for calculating the abnormality degree determined as abnormal by the abnormality determination part, and an abnormality cause identification part which identifies an abnormality cause of the monitoring tType: GrantFiled: March 26, 2018Date of Patent: March 2, 2021Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.Inventors: Kentaro Hayashi, Takahiro Nakano, Atsushi Yuge, Masaaki Shibata
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Patent number: 10761519Abstract: A product design and process design device includes: a storage unit that stores design specification information containing the tolerance of a dimensional variation at any site of an assembly product, part dimension error information, assembly facility error information, assembly tolerance information, the part dimension error information, and the assembly facility error information, part manufacturing cost information, and facility investment cost information with respect to the assembly facility error information; a tolerance distribution processing unit that uses the assembly tolerance information to generate proposed tolerance distributions that differ in distributional combination with respect to each error, and calculates part manufacturing costs and facility investment costs; a facility planning processing unit that determines a proposed tolerance distribution, with, as an evaluation index, total production costs respectively including the sums of the part manufacturing costs and the facility investmenType: GrantFiled: November 8, 2018Date of Patent: September 1, 2020Assignees: HITACHI, LTD., Computer and Automation Research Institute, Hungarian Academy of SciencesInventors: Daisuke Tsutsumi, Yumiko Ueno, Youichi Nonaka, Takahiro Nakano, József Váncza, Gábor Erdós, Dávid Gyulai, András Kovács, Bence Tipary
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Publication number: 20200263669Abstract: An operating condition of a wind turbine facility or at least one wind turbine is acquired, and an estimated value of a measurable physical quantity corresponding to the operating condition is calculated. It is determined whether an abnormality is present in the wind turbine by comparing the estimated value and the actual value.Type: ApplicationFiled: November 22, 2019Publication date: August 20, 2020Inventors: Eriko SHINKAWA, Kentaro HAYASHI, Atsushi YUGE, Masayuki HASHIMOTO, Yoshikatsu IKAWA, Takahiro NAKANO
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Publication number: 20200189872Abstract: A sheet processing apparatus arranged in a space between an image reading section for reading an image and an image formation section for forming an image on a sheet includes a carry-in path guiding a sheet from a carry-in entrance; a relay roller provided in the carry-in path to relay and transport the sheet; a first transport path positioned on a downstream side of the relay roller and having a carry-in roller to transport the sheet from the carry-in path to the first collection tray; and a second transport path branched from the carry-in path and having a branch roller to transport the transported sheet to the second collection tray. The relay roller shifts the sheet in a direction crossing the transport direction while a front end of the sheet enters the first transport path or the second transport path, and arrives at the carry-in roller or the branch roller.Type: ApplicationFiled: February 20, 2020Publication date: June 18, 2020Applicant: CANON FINETECH NISCA INC.Inventor: Takahiro NAKANO
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Patent number: 10625475Abstract: An ultrasonic bonding tool is used on a horn side or anvil side of an ultrasonic joining device in which two synthetic resin sheets that include a polyethylene layer, a polypropylene layer and a ceramic heat-resistant layer are superposed and joined together so that the heat-resistant layers face each other. The ultrasonic bonding tool includes a plurality of protrusions shaped as quadrangular pyramids having a flat top surface. Each of the protrusions has an apex angle formed by two mutually opposite side surfaces that is within a range of 110-130°. When two separators of a battery cell are joined together using the ultrasonic bonding device with the ultrasonic bonding tool, a force with which the separators adhere to the protrusions is weak. In this way, the separators do not adhere to the horn during ultrasonic bonding of the synthetic resin sheets.Type: GrantFiled: December 27, 2016Date of Patent: April 21, 2020Assignee: Envision AESC Japan Ltd.Inventor: Takahiro Nakano
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Patent number: 10604369Abstract: A sheet processing apparatus includes a carry-in path for guiding a sheet from a carry-in entrance, a shift roller provided in the carry-in path to relay and transport the sheet, a first transport path positioned on the downstream side of the relay roller to transport the sheet from the carry-in path to a first collection tray, and a second transport path branched off from the carry-in path to transport the transported sheet to a second collection tray. The relay roller shifts the sheet in the direction crossing the transport direction, while the shift by the relay roller is performed after the sheet front end enters the first transport path or second transport path. Thus, it is possible to provide a relatively compact sheet processing apparatus capable of shifting in sorting and shifting sheets, without increasing the carry-in path.Type: GrantFiled: December 4, 2017Date of Patent: March 31, 2020Assignee: CANON FINETECH NISCA INC.Inventor: Takahiro Nakano