Patents by Inventor Takahiro Otsuki

Takahiro Otsuki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11653485
    Abstract: A component mounting device moves a board height sensor horizontally to multiple measuring points and measures heights of the front surface of the board at the multiple measuring points. Subsequently, the component mounting device obtains a positional deviation in the horizontal direction of a target mounting position on the front surface of the board based on the heights of the front surface of the board so measured. In addition, the component mounting device obtains a positional deviation in a vertical direction of the target mounting position based on a measured height in the vertical direction of the front surface of the board. Then, the component mounting device corrects the target mounting position based on the positional deviation in the horizontal direction and the positional deviation in the vertical direction that are so obtained and mounts a component in the target mounting position so corrected.
    Type: Grant
    Filed: November 21, 2018
    Date of Patent: May 16, 2023
    Assignee: FUJI CORPORATION
    Inventors: Takahiro Otsuki, Toshinori Shimizu
  • Publication number: 20220007558
    Abstract: A component mounting device moves a board height sensor horizontally to multiple measuring points and measures heights of the front surface of the board at the multiple measuring points. Subsequently, the component mounting device obtains a positional deviation in the horizontal direction of a target mounting position on the front surface of the board based on the heights of the front surface of the board so measured. In addition, the component mounting device obtains a positional deviation in a vertical direction of the target mounting position based on a measured height in the vertical direction of the front surface of the board. Then, the component mounting device corrects the target mounting position based on the positional deviation in the horizontal direction and the positional deviation in the vertical direction that are so obtained and mounts a component in the target mounting position so corrected.
    Type: Application
    Filed: November 21, 2018
    Publication date: January 6, 2022
    Applicant: FUJI CORPORATION
    Inventors: Takahiro OTSUKI, Toshinori SHIMIZU
  • Patent number: 10772247
    Abstract: A tape cutting processing apparatus includes a conveyance device conveying a component wrapping tape along a conveyance path, a detection device detecting the presence of a component accommodated in a cavity of the component wrapping tape conveyed along the conveyance path at a detection position, a folding-back member that folds back a cover tape at a folding-back position so that adhesion surfaces of the cover tape face each other as the component wrapping tape is conveyed, a cutting device that cuts each cutting portion of a carrier tape and the cover tape at a cutting position, and a control device that the conveyance device to position the carrier tape and the cover tape folded back by the folding-back member in a state of being overlapped on the cutting position, and controls the cutting device to cut the carrier tape and the cover tape.
    Type: Grant
    Filed: June 18, 2015
    Date of Patent: September 8, 2020
    Assignee: FUJI CORPORATION
    Inventors: Takahiro Otsuki, Kenji Shimosaka
  • Publication number: 20180376630
    Abstract: A tape cutting processing apparatus includes a conveyance device conveying a component wrapping tape along a conveyance path, a detection device detecting the presence of a component accommodated in a cavity of the component wrapping tape conveyed along the conveyance path at a detection position, a folding-back member that folds back a cover tape at a folding-back position so that adhesion surfaces of the cover tape face each other as the component wrapping tape is conveyed, a cutting device that cuts each cutting portion of a carrier tape and the cover tape at a cutting position, and a control device that the conveyance device to position the carrier tape and the cover tape folded back by the folding-back member in a state of being overlapped on the cutting position, and controls the cutting device to cut the carrier tape and the cover tape.
    Type: Application
    Filed: June 18, 2015
    Publication date: December 27, 2018
    Applicant: FUJI MACHINE MFG. CO., LTD.
    Inventors: Takahiro OTSUKI, Kenji SHIMOSAKA
  • Publication number: 20070002721
    Abstract: Provided is an optical disk manufacturable by a conventional recording medium manufacturing method and that is capable of performing recording with an information recording apparatus used to perform recording on conventional recording mediums, and a data recording apparatus for recording contents data. An optical disk 100 has a structure in which a first substrate 110 and a second substrate 120 are bonded together. The first substrate is provided with a recording layer in which contents data is recorded, and the second substrate is provided with a visual information recording layer in which information enabling visual recognition of, for example, the contents of contents data or a title of the contents data is recorded as visual information.
    Type: Application
    Filed: September 28, 2004
    Publication date: January 4, 2007
    Inventors: Ryuchiro Yoshimura, Hidenori Nakagawa, Takayaki Yamamoto, Takashi Nakai, Yuichi Mizuuchi, Kazumasa Nakamura, Shinzo Kawakami, Takahiro Otsuki, Takashi Otsuki, Akio Fukushima, Hiroki Yamaguchi, Naoki Yamada, Tomonori Nakada, Kenichi Oono, Kouji Harimoto, Eiji Konosu, Hajime Ishizuka, Tak Kai