Abstract: A multilayer coil component includes: an element body; a coil disposed in the element body; and a first external electrode disposed on a surface of the element body in which the first external electrode has a first electrode layer disposed on the surface of the element body and a first plating layer and a second plating layer disposed on the first electrode layer, and the first plating layer and the second plating layer are disposed so as to be scattered in a plurality of places on an edge of the first electrode layer.

Abstract: A multilayer coil component includes: an element body formed by stacking a magnetic body layer containing a plurality of metal magnetic particles of a soft magnetic material; a first coil disposed in the element body and configured to include a plurality of first coil conductors; a second coil disposed in the element body and configured to include a plurality of second coil conductors; a first external electrode to which one end portion of each of the first coil and the second coil is connected; and a second external electrode to which the other end portion of each of the first coil and the second coil is connected.

Abstract: An apparatus includes an extract unit configured to extract features of a first image based on an electromagnetic wave in a first frequency band, an acquire unit configured to acquire motion information about the features, a classify unit configured to classify the features into a first group and a second group based on the motion information, and a remove unit configured to remove, from the first image, a signal corresponding to the feature belonging to the first group.

Abstract: A system includes a transmission unit configured to generate an electromagnetic wave, a first reception unit configured to detect the electromagnetic wave, and a processing unit configured to determine whether an output of the electromagnetic wave from the transmission unit is more than or equal to a threshold based on first image information obtained by capturing an image of the transmission unit in a state where the transmission unit is irradiating the electromagnetic wave.

Abstract: The present invention relates to an aqueous gravure ink containing a pigment, a polymer, a water-soluble organic solvent, a surfactant and water, in which the water-soluble organic solvent contains a glycol ether having a boiling point of from 100 to 260° C., and a content of the glycol ether in the ink is from 1 to 10% by mass; a total content of the water-soluble organic solvent in the ink is not more than 15% by mass; the surfactant contains an acetylene glycol-based surfactant; and a content of water in the ink is from 50 to 70% by mass.

Abstract: The present technology relates to an imaging device, an imaging method, and a program that make it possible to easily perform imaging focusing on a subject or a specific part of the subject. The imaging device causes a preliminary-notice frame that gives notice of a specific area to be focused to be displayed on an image obtained by an imaging unit according to a type of the subject. The present technology can be applied to an imaging device.

Abstract: A resin particle dispersion containing core/shell-type resin particles and water is described. A shell portion resin of the core/shell-type resin particles contains a constitutional unit derived from a (meth)acrylic acid ester containing a hydrocarbon group having from 4 to 8 carbon atoms. A core portion resin of the core/shell-type resin particles contains a constitutional unit derived from a (meth)acrylamide-based monomer whose solubility parameter lies within the range of from 17.0 to 21.0 (J/cm3)0.5 in an amount of not less than 5% by mass, and a glass transition temperature of the core portion resin is not higher than 50° C. An acid value of the core/shell-type resin particles is from 50 to 100 mgKOH/g. A process for producing the resin particle dispersion and a printing method using the resin particle dispersion is also described.

Abstract: The semiconductor device includes: a semiconductor substrate; a first transistor disposed above the semiconductor substrate and including a first source electrode, a first gate region, and a first drain electrode; and a second transistor disposed above the semiconductor substrate and including a second source electrode, a second gate region, and a second drain electrode. The first source electrode, the second gate region, and the second source electrode are substantially at an identical potential. The first drain electrode and the second drain electrode are substantially at an identical potential.

Abstract: A surface acoustic wave device according to the present disclosure includes a support substrate; an intermediate layer laminated on the support substrate; a piezoelectric layer laminated on the intermediate layer; and an IDT electrode formed on the piezoelectric layer, an Euler angle of the support substrate is (?45°±10°, ?54°±10°, 180°±30°) and an Euler angle of the piezoelectric layer is (0°±5°, 112.5°±22.5°, 0°±5°) or (0°±5°, ?67.5°±22.5°, 0°±5°).

Abstract: A vehicle speed control device 1 mounted in a vehicle comprises: a forward detection unit 121 that obtains the amount of time until a vehicle Vb to be overtaken that is traveling to the side of a host vehicle Va, in which the vehicle speed device 1 is mounted, is overtaken; a rearward detection unit 122 that obtains the amount of time until the distance between the host vehicle Va and a following vehicle Vc traveling rearward of the host vehicle Va reaches a prescribed rearward distance; and a speed control unit 123 that increases the speed of the host vehicle Va when the time until overtaking occurs is greater than the time until the prescribed rearward distance is reached.

Abstract: A forming apparatus forms a formable material using a mold including a contact region to be brought into contact with the formable material on a substrate. The apparatus includes a controller configured to perform processing of bringing the contact region and the formable material on the substrate into contact with each other. The controller controls the processing so as to bring the mold and the substrate close to each other at a first relative speed and then bring the mold and the substrate close to each other at a second relative speed lower than the first relative speed, and controls switching from the first relative speed to the second relative speed so as to compensate a manufacturing error of the mold.

Abstract: An object of the present invention is to provide a powder of a CeO2—ZrO2-based complex oxide which enables to achieve an improvement in the purification performance at a low to middle temperature of an exhaust gas purification catalyst, and, in order to achieve the above-mentioned object, the present invention provides a powder of a CeO2—ZrO2-based complex oxide, wherein a pore volume with from-10-to-100-nm diameters after a heat treatment performed at 1,000° C. for 3 hours in an air atmosphere, is 0.35 mL/g or more, and wherein an amount of carbon dioxide desorbed after the heat treatment, as measured by a temperature programmed desorption method, is 80 ?mol/g or more.

Abstract: A steering control device 10 is equipped with: a first specification unit 121 for specifying an expected travel position where a vehicle is expected to travel in the traffic lane in which the vehicle is travelling; a second specification unit 122 for specifying information about the weight of the vehicle; an adjustment unit 123 for adjusting the expected travel position in the vehicle-widthwise direction on the basis of the expected travel position of the vehicle and the weight information; and a steering control unit 124 for controlling steering on the basis of the adjusted expected travel position.

Abstract: An integrated semiconductor device includes an Si substrate, and a high-side transistor and a low-side transistor which configure a half-bridge. A source electrode of a unit transistor configuring the high-side transistor and a drain electrode of a unit transistor configuring the low-side transistor are integrated as a common electrode.

Abstract: A ferrite composition comprises a main component and a subcomponent. The main component includes 32.0 to 46.4 mol % of iron oxide in terms of Fe2O3, 4.4 to 14.0 mol % of copper oxide in terms of CuO, and 8.4 to 56.9 mol % of zinc oxide in terms of ZnO. The subcomponent includes 0.53 to 11.00 parts by weight of a silicon compound in terms of SiO2, 0.1 to 12.8 parts by weight of a tin compound in terms of SnO2, and 0.5 to 7.0 parts by weight of a bismuth compound in terms of Bi2O3, with respect to 100 parts by weight of the main component.

Abstract: A semiconductor device includes: a substrate; a first nitride semiconductor layer above the substrate; a second nitride semiconductor layer above the first nitride semiconductor layer and being greater than the first nitride semiconductor layer in band gap; and a first field-effect transistor including a first source electrode, a first drain electrode, and a first gate electrode that are above the second nitride semiconductor layer, the first source electrode and the first drain electrode being separated from each other, the first gate electrode being disposed between the first source electrode and the first drain electrode. The first field-effect transistor includes a third semiconductor layer that is above the second nitride semiconductor layer in part of a region between lower part of the first source electrode and the first gate electrode, and is separated from the first gate electrode. The third semiconductor layer and the first source electrode are electrically connected.

Abstract: In a multilayer coil component, first and second conductor patterns respectively have parallel parts that overlap in a lamination direction and non-parallel parts that do not overlap. The parallel parts of the first and second conductor patterns of one set are interconnected by a first through hole. The non-parallel parts of the first and second conductor patterns of sets adjacent to each other in the lamination direction are interconnected by a second through hole.

Abstract: A forming apparatus includes a substrate holder having a plurality of chucking regions that chuck a lower surface of the substrate and configured to hold the substrate by chucking the substrate with the plurality of chucking regions, and a controller configured to control execution of a forming process and independently control a chucking force of each of the plurality of chucking regions. The controller controls a chucking force of each of the plurality of chucking regions in a mold separation step so as to make a final mold separation point, at which the mold finally separates from the composition, coincide with a center of a pattern surface of the mold.