Abstract: A tire assembly includes a tire for mounting on a vehicle, an elastic body disposed on an inner side of the tire, and a power generation body disposed between an inner surface of the tire and the elastic body. The power generation body includes a first member and a second member. The first member has a first insulating film forming a first surface. The second member has a second insulating film forming a second surface that faces the first surface and contacts the first surface. The elastic body biases the power generation body toward the inner surface of the tire.

Abstract: An experiment support apparatus includes: one or more non-transitory computer-readable media that include an instruction; and one or more processors that execute the instruction. The instruction is configured to cause the one or more processors to execute an operation, the operation includes: causing a display device to display a condition table TB that indicates an experiment condition for measurement, in response to an input of the experiment condition; and causing the display device to display at least one of a measurement result based on measurement data, or an analysis result of the measurement data, in a cell of the condition table TB, in response to an input of the measurement data, the measurement data being obtained using a measurement apparatus under the experiment condition corresponding to the cell.

Abstract: A physical property value estimation device that estimates a physical property value corresponding to a physical property required for a composite material is provided with a storage unit that stores a learned physical property regression formula corresponding to the physical property in order to calculate a physical property value corresponding to a physical property predetermined as an objective variable, by using compound data of a material that composes the composite material and feature data of the material as explanatory variables, and stores a feature amount value of the material required for calculating the feature data; a reception unit that receives compound data of the material that composes the composite material as an estimation target; and a physical property calculation unit that obtains the physical property regression formula corresponding to the physical property from the storage unit, and calculates the physical property value based on the obtained compound data by using the obtained physic

Abstract: A first synthesized characteristic value calculated based on a first blending ratio of constituent materials contained in a first composite material and on a first characteristic value corresponding to the constituent materials contained in the first composite material, as well as first blending information of the constituent materials contained in the first composite material are used as input parameters (explanatory variables) for an approximate function to estimate a value of physical quantity (objective variable) for the first composite material.

Abstract: A light emitting device includes a light emitting surface, a back surface arranged on an opposite side of the light emitting surface, a mounting surface arranged between the light emitting surface and the back surface, and includes a light emitting element, a light shielding member, first and second terminal coating films, and first and second electrically conductive members. The light emitting element has first and second electrodes arranged on the second main surface. The light shielding member covers the lateral surface of the light emitting element and does not cover the first main surface of the light emitting element. The first and second terminal coating films are electrically connected to the first and second electrodes respectively, and arranged continuously on the back surface and the mounting surface of the light emitting device. The first and second electrically conductive members are in contact with the first and second electrodes respectively.

Abstract: A light emitting device includes a light emitting surface, a back surface arranged on an opposite side of the light emitting surface, a mounting surface arranged between the light emitting surface and the back surface, and includes a light emitting element, a light shielding member, first and second terminal coating films, and first and second electrically conductive members. The light emitting element has first and second electrodes arranged on the second main surface. The light shielding member covers the lateral surface of the light emitting element and does not cover the first main surface of the light emitting element. The first and second terminal coating films are electrically connected to the first and second electrodes respectively, and arranged continuously on the back surface and the mounting surface of the light emitting device. The first and second electrically conductive members are in contact with the first and second electrodes respectively.

Abstract: A method of manufacturing a light emitting device includes: arranging first and second light emitting elements, each having a pair of electrodes disposed on a surface opposite to a main light emitting surface, on a base body adjacent to each other with the electrodes facing upward; forming a light shielding member at least covering the electrodes of each of the first and second light emitting elements and a portion between the first and second light emitting elements; forming recesses by removing portions of the light shielding member so that at least a portion of each of the electrodes of the first and second light emitting elements are exposed from the light shielding member; and forming electrically conductive members in the recesses so that each of the electrically conductive members is in contact with a corresponding one of the electrodes of the first and second light emitting elements.

Abstract: A method of manufacturing a light emitting device includes: arranging first and second light emitting elements, each having a pair of electrodes disposed on a surface opposite to a main light emitting surface, on a base body adjacent to each other with the electrodes facing upward; forming a light shielding member at least covering the electrodes of each of the first and second light emitting elements and a portion between the first and second light emitting elements; forming recesses by removing portions of the light shielding member so that at least a portion of each of the electrodes of the first and second light emitting elements are exposed from the light shielding member; and forming electrically conductive members in the recesses so that each of the electrically conductive members is in contact with a corresponding one of the electrodes of the first and second light emitting elements.

Abstract: A method of manufacturing a light emitting device includes: arranging a first light emitting element and a second light emitting element, each having a pair of first and second electrodes disposed on a surface opposite to a main light emitting surface, on a base body adjacent to each other with the pair of electrodes facing upward; forming a pair of electrically conductive members each extending between one of the pair of electrodes of the first light emitting element and a corresponding one of the pair of electrodes of the second light emitting element; forming a light shielding member at least covering between the first and second light emitting elements; and cutting the pair of electrically conductive members and the light shielding member between the first and second light emitting elements, along a direction substantially perpendicular to the main light emitting surface of each of the first and second light emitting elements.

Abstract: A method of manufacturing a light emitting device includes: arranging a first light emitting element and a second light emitting element, each having a pair of first and second electrodes disposed on a surface opposite to a main light emitting surface, on a base body adjacent to each other with the pair of electrodes facing upward; forming a pair of electrically conductive members each extending between one of the pair of electrodes of the first light emitting element and a corresponding one of the pair of electrodes of the second light emitting element; forming a light shielding member at least covering between the first and second light emitting elements; and cutting the pair of electrically conductive members and the light shielding member between the first and second light emitting elements, along a direction substantially perpendicular to the main light emitting surface of each of the first and second light emitting elements.

Abstract: A method of manufacturing a light-emitting device includes flattening top portions of solder bumps disposed on a wiring substrate, disposing a light-emitting element on the solder bumps whose top portions are flattened, and heating the solder bumps to be melt and to be fused so as to provide an adhesive with which the light-emitting element is secured on the wiring substrate.

Abstract: A light emitting device has a base comprising at least one pair of leads having a silver-containing layer on their surfaces and being secured by a resin molded body, a light emitting element mounted on said leads, a protective film made of an inorganic material that covers the upper surface of said base, and a sealing resin disposed on the base surface via said protective film. The sealing resin has a first resin that covers said light emitting element, and a second resin having a higher hardness than said first resin that covers the boundaries between said resin molded body and said leads.

Abstract: A method of manufacturing a light-emitting device includes flattening top portions of solder bumps disposed on a wiring substrate, disposing a light-emitting element on the solder bumps whose top portions are flattened, and heating the solder bumps to be melt and to be fused so as to provide an adhesive with which the light-emitting element is secured on the wiring substrate.

Abstract: An MWL signal encoding part encodes a signal occurring on a main word signal line, an SD signal encoding part encodes a signal occurring on a subdecode signal line, a WL calculating part calculates a WL value, based on an MWL signal encoded value and an SD signal encoded value; an input and output operation part allows one-word data in a memory cell selected by the WL value to be read and written via the bit signal line; and a read and write control part controls a read operation and a write operation of the input and output operation part, based on a signal level on the bit signal line.

Abstract: A fault simulation apparatus includes an MOS transistor output signal strength determining portion for extracting the conductivity type of an MOS transistor in which an event such as a variation in signal level occurs. A control signal value is obtained from a control terminal, and an input signal value is obtained from an input terminal, and output signal strength when the event occurring MOS transistor is turned ON is determined. In the apparatus, fault simulation is performed depending upon the output signal strength determined by the output signal strength determining portion.

Abstract: A semiconductor circuit logical check apparatus including a unit for extracting information about laser trimming fuse elements based on layout data and logic-circuit diagram data of a semiconductor circuit, a unit for generating a command sequence indicating that some of the laser trimming fuse elements are broken on the basis of the extracted laser trimming fuse element information, a unit for generating error bit memory cell array models from memory cell array models, and a unit for executing, on a semiconductor circuit model, logic simulation on the basis of the command sequence.

Abstract: A logic simulation device includes an indefinite value generating signal line extracting unit, a propagation deciding unit and a message output unit. The logic simulation device is supplied with circuit connection data of a logic circuit and input signal data employed for simulating the logic circuit. The indefinite value generating signal line extracting unit extracts a signal line which enters a floating state in excess of an allowance time or that causes a collision of logic states as an indefinite value generating signal line. The propagation deciding unit decides whether or not a propagation candidate gate having a propagation input end which is connected with an indefinite value generating signal line is in a state propagating the indefinite value to its output. The propagation deciding unit decides that the indefinite value generating signal line is an error signal line causing an error only when the propagation candidate gate is in a state of propagating the value at the propagation input end.

Abstract: In a switch level simulation system of the present invention, bidirectional switch models are allocated more accurately at locations which need to be bidirectional in circuit connection information and uni-directional switch models corresponding to the flow direction of a signal are allocated at the other locations. The connection information extracting section extracts the connection state of each device in a circuit indicated by circuit information and produces connection information. The input/output type determining section determines whether or not a switching device in a circuit is bidirectional and the flow direction of a signal in a uni-directional switching device, according to connection information. The circuit connection information generating section generates circuit connection information to be used by a simulation executing section, using the result of determining of the input/output type determining section.

Abstract: The temperature of the circuit to be verified is evaluated. A simulation executing section (101) executes logic simulation of the circuit to be verified expressed in function block units at function block level. A circuit action extracting section (103) extracts an actin mode of a function block in its process. A total current consumption calculating section (105) calculates the total current consumption which is the current consumed in the entire circuit to be verified, on the basis of the data of current consumption in each action mode and extracted action mode. An average current calculating section (107) calculates the average current which is the average of the total current consumption over the check period, reflecting the thermal characteristic of the circuit to be verified. An allowable temperature judging section (109) calculates the temperature of the circuit to be verified according to this average current, and compares with an allowable current.

Abstract: There are provided a logic simulator apparatus and a circuit simulation apparatus capable of simulation based on signal propagation delay time with high reliability. A voltage drop calculating portion (9) calculates a voltage drop value (Vi) on the basis of power-supply information (D4), drain current (Ii) and voltage drop resistance (Ri). A propagation delay calculating portion (10) calculates delay time (Di) required for each element to propagate a logic signal value on the basis of gain coefficient (.beta.i), interconnection parasitic capacitance (Cj) and voltage drop value (Vi). A logic simulation performing portion (12) performs the logic simulation on the basis of the circuit connection data (D22) provided with the delay time (Di). Accordingly, logic and circuit simulation can be accomplished on the basis of the signal propagation delay time with high reliability.