Patents by Inventor Takahiro YADA
Takahiro YADA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11967565Abstract: In one example, a semiconductor structure or device comprises a substrate comprising a conductive structure having a top side and a first shielding terminal on the top side of the conductive structure, an electronic component on the top side of the conductive structure, a package body on the top side of the conductive structure and contacting a side of the electronic component, a shield on a top side of the package body and a lateral side of the package body, and a shield interconnect coupling the shield to the first shielding terminal of the conductive structure. Other examples and related methods are also disclosed herein.Type: GrantFiled: June 13, 2022Date of Patent: April 23, 2024Assignee: Amkor Technology Japan, Inc.Inventors: Takahiro Yada, Tsukasa Takaiwa
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Publication number: 20220375873Abstract: In one example, a semiconductor structure or device comprises a substrate comprising a conductive structure having a top side and a first shielding terminal on the top side of the conductive structure, an electronic component on the top side of the conductive structure, a package body on the top side of the conductive structure and contacting a side of the electronic component, a shield on a top side of the package body and a lateral side of the package body, and a shield interconnect coupling the shield to the first shielding terminal of the conductive structure. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: June 13, 2022Publication date: November 24, 2022Applicant: Amkor Technology Japan, Inc.Inventors: Takahiro YADA, Tsukasa TAKAIWA
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Patent number: 11362041Abstract: In one example, a semiconductor structure or device comprises a substrate comprising a conductive structure having a top side and a first shielding terminal on the top side of the conductive structure, an electronic component on the top side of the conductive structure, a package body on the top side of the conductive structure and contacting a side of the electronic component, a shield on a top side of the package body and a lateral side of the package body, and a shield interconnect coupling the shield to the first shielding terminal of the conductive structure. Other examples and related methods are also disclosed herein.Type: GrantFiled: December 19, 2019Date of Patent: June 14, 2022Assignee: Amkor Technology Japan, Inc.Inventors: Takahiro Yada, Tsukasa Takaiwa
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Publication number: 20210193587Abstract: In one example, a semiconductor structure or device comprises a substrate comprising a conductive structure having a top side and a first shielding terminal on the top side of the conductive structure, an electronic component on the top side of the conductive structure, a package body on the top side of the conductive structure and contacting a side of the electronic component, a shield on a top side of the package body and a lateral side of the package body, and a shield interconnect coupling the shield to the first shielding terminal of the conductive structure. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: December 19, 2019Publication date: June 24, 2021Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Takahiro YADA, Tsukasa TAKAIWA
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Patent number: 10312186Abstract: A method for forming a packaged electronic device includes providing a substrate comprising a lead and a pad. The method includes attaching a thermally conductive structure to the pad and attaching an electronic component to one of the thermally conductive structure or the pad. The method includes electrically coupling the electronic component to the lead, and forming a package body that encapsulates the electronic component and at least portions of the lead, the pad, and the thermally conductive structure, wherein the package body has a first major surface and a second major surface opposite to the first major surface, and one of the first bottom surface of the thermally conductive structure or the bottom surface of the pad is exposed in the first major surface of the package body.Type: GrantFiled: October 31, 2017Date of Patent: June 4, 2019Assignee: Amkor Technology Inc.Inventors: Takahiro Yada, Toru Takahashi
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Publication number: 20190131219Abstract: A method for forming a packaged electronic device includes providing a substrate comprising a lead and a pad. The method includes attaching a thermally conductive structure to the pad and attaching an electronic component to one of the thermally conductive structure or the pad. The method includes electrically coupling the electronic component to the lead, and forming a package body that encapsulates the electronic component and at least portions of the lead, the pad, and the thermally conductive structure, wherein the package body has a first major surface and a second major surface opposite to the first major surface, and one of the first bottom surface of the thermally conductive structure or the bottom surface of the pad is exposed in the first major surface of the package body.Type: ApplicationFiled: October 31, 2017Publication date: May 2, 2019Applicant: Amkor Technology, Inc.Inventors: Takahiro Yada, Toru Takahashi
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Publication number: 20170256453Abstract: A manufacturing method of a semiconductor package which improves productivity and can manufacture high-quality semiconductor packages is provided.Type: ApplicationFiled: January 19, 2017Publication date: September 7, 2017Inventors: Takahiro YADA, Katsushi YOSHIMITSU
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Patent number: 8926785Abstract: A method for manufacturing a multi-piece board having a frame section and a multiple piece sections connected to the frame section includes forming a frame section from a manufacturing panel for the frame section, sorting out multiple acceptable piece sections by inspecting quality of piece sections, forming notch portions in the frame section and the acceptable piece sections such that the notch portions allow the acceptable piece sections to be arranged with respect to the frame section, provisionally fixing the piece sections and the frame section in respective positions, injecting an adhesive agent into cavities formed by the notch portions when the frame section and the piece sections are provisionally fixed to each other, and joining the acceptable piece sections with the frame section by curing the adhesive agent injected into the cavities.Type: GrantFiled: June 15, 2012Date of Patent: January 6, 2015Assignee: Ibiden Co., Ltd.Inventor: Takahiro Yada
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Patent number: 8741411Abstract: A method for manufacturing a multi-piece board having a frame section and a multiple piece sections connected to the frame section includes forming a frame section from a manufacturing panel for the frame section, sorting out multiple acceptable piece sections by inspecting quality of piece sections, forming notch portions in the frame section and the acceptable piece sections such that the notch portions allow the acceptable piece sections to be arranged with respect to the frame section, provisionally fixing the piece sections and the frame section in respective positions, injecting an adhesive agent into cavities formed by the notch portions when the frame section and the piece sections are provisionally fixed to each other, and joining the acceptable piece sections with the frame section by curing the adhesive agent injected into the cavities.Type: GrantFiled: January 29, 2010Date of Patent: June 3, 2014Assignee: Ibiden Co., Ltd.Inventor: Takahiro Yada
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Patent number: 8547702Abstract: A multi-piece board includes a frame and multiple wiring boards connected to the frame. The frame and each of the wiring boards are positioned with a clearance. The frame and/or each of the wiring boards has an end portion having a first notch portion on a surface side adjacent to the clearance. The end portion of the frame and/or each of the wiring boards has a second notch portion formed on the opposite surface side with respect to the surface side of the first notched portion adjacent to the clearance. The clearance between the frame and each of the wiring boards is filled with an adhesive agent.Type: GrantFiled: June 3, 2010Date of Patent: October 1, 2013Assignee: Ibiden Co., Ltd.Inventors: Takahiro Yada, Takahiro Yamazaki, Sumiki Muto
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Publication number: 20120247662Abstract: A method for manufacturing a multi-piece board having a frame section and a multiple piece sections connected to the frame section includes forming a frame section from a manufacturing panel for the frame section, sorting out multiple acceptable piece sections by inspecting quality of piece sections, forming notch portions in the frame section and the acceptable piece sections such that the notch portions allow the acceptable piece sections to be arranged with respect to the frame section, provisionally fixing the piece sections and the frame section in respective positions, injecting an adhesive agent into cavities formed by the notch portions when the frame section and the piece sections are provisionally fixed to each other, and joining the acceptable piece sections with the frame section by curing the adhesive agent injected into the cavities.Type: ApplicationFiled: June 15, 2012Publication date: October 4, 2012Applicant: IBIDEN CO., LTD.Inventor: Takahiro YADA
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Publication number: 20110096517Abstract: A multi-piece board includes a frame and multiple wiring boards connected to the frame. The frame and each of the wiring boards are positioned with a clearance. The frame and/or each of the wiring boards has an end portion having a first notch portion on a surface side adjacent to the clearance. The end portion of the frame and/or each of the wiring boards has a second notch portion formed on the opposite surface side with respect to the surface side of the first notched portion adjacent to the clearance. The clearance between the frame and each of the wiring boards is filled with an adhesive agent.Type: ApplicationFiled: June 3, 2010Publication date: April 28, 2011Applicant: IBIDEN CO., LTD.Inventors: Takahiro Yada, Takahiro Yamazaki, Sumiki Muto
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Publication number: 20100310829Abstract: A method for manufacturing a multi-piece board having a frame section and a multiple piece sections connected to the frame section includes forming a frame section from a manufacturing panel for the frame section, sorting out multiple acceptable piece sections by inspecting quality of piece sections, forming notch portions in the frame section and the acceptable piece sections such that the notch portions allow the acceptable piece sections to be arranged with respect to the frame section, provisionally fixing the piece sections and the frame section in respective positions, injecting an adhesive agent into cavities formed by the notch portions when the frame section and the piece sections are provisionally fixed to each other, and joining the acceptable piece sections with the frame section by curing the adhesive agent injected into the cavities.Type: ApplicationFiled: January 29, 2010Publication date: December 9, 2010Applicant: IBIDEN CO., LTD.Inventor: Takahiro YADA