Patents by Inventor Takahiro YOKOMIZO

Takahiro YOKOMIZO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210317391
    Abstract: The present invention addresses the problem of providing a kit for a cleaning agent, which is used for the purpose of preparing a cleaning agent that maintains, even after long-term storage, adequate impurity removal performance from the surface of a semiconductor substrate that has been subjected to a CMP process. The present invention also addresses the problem of providing a method for preparing the above-described cleaning agent. A kit for a cleaning agent according to the present invention is a kit for preparing a cleaning agent which is used for cleaning of a semiconductor substrate that has been subjected to a CMP process, and which has a pH of from 7.5 to 13.0. This kit for a cleaning agent comprises a first liquid that is acidic and contains a compound represented by formula (1) and a second liquid that is alkaline and contains a basic compound; and an acidic compound is contained in at least one of the first liquid and the second liquid.
    Type: Application
    Filed: June 25, 2021
    Publication date: October 14, 2021
    Applicant: FUJIFILM Electronic Materials Co., Ltd.
    Inventors: Satoshi SHIRAHATA, Takahiro YOKOMIZO, Yoshihisa TSURUMI, Tsutomu WATAHIKI, Takayuki KAJIKAWA, Kohei HAYASHI, Hironori MIZUTA
  • Patent number: 9845538
    Abstract: The object of the present invention is to provide: an etching agent for a titanium-based metal on a semiconductor substrate, which suppresses decomposition of hydrogen peroxide, has a long liquid service life, and has less need for controlling the concentration of hydrogen peroxide in the etching agent, even in the cases where the etching agent is used for a semiconductor substrate having the titanium-based metal and a metallic copper or a metal alloy; an etching method; and an etching agent preparation liquid for use by mixing with hydrogen peroxide.
    Type: Grant
    Filed: July 3, 2014
    Date of Patent: December 19, 2017
    Assignee: WAKO PURE CHEMICAL INDUSTRIES, LTD.
    Inventors: Takahiro Yokomizo, Hiroyuki Tsurumoto, Masahiko Kakizawa
  • Publication number: 20160177457
    Abstract: The object of the present invention is to provide: an etching agent for a titanium-based metal on a semiconductor substrate, which suppresses decomposition of hydrogen peroxide, has a long liquid service life, and has less need for controlling the concentration of hydrogen peroxide in the etching agent, even in the cases where the etching agent is used for a semiconductor substrate having the titanium-based metal and a metallic copper or a metal alloy; an etching method; and an etching agent preparation liquid for use by mixing with hydrogen peroxide.
    Type: Application
    Filed: July 3, 2014
    Publication date: June 23, 2016
    Applicant: WAKO PURE CHEMICAL INDUSTRIES, LTD.
    Inventors: Takahiro YOKOMIZO, Hiroyuki TSURUMOTO, Masahiko KAKIZAWA