Abstract: An electronic device includes an inlet including a ground terminal having a first surface and a second surface opposite from the first surface, a first casing metal plate configured to hold the inlet and contacting the first surface of the ground terminal, and a second casing metal plate contacting the second surface of the ground terminal.

Abstract: An electronic device includes an inlet including a ground terminal having a first surface and a second surface opposite from the first surface, a first casing metal plate configured to hold the inlet and contacting the first surface of the ground terminal, and a second casing metal plate contacting the second surface of the ground terminal.

Abstract: The circuit substrate includes at least two lands formed on a substrate, wherein one electrode is to be mounted on the at least two lands, an electronic part having electrodes, one of the electrodes is soldered on the at least two lands with solders whose amounts are adjusted by a metal mask having at least two opening parts, positions of the at least two opening parts corresponding to the at least two lands when the solders are applied and melted, areas of the at least two opening parts being different with each other, wherein a height of one of the solders is different from a height of the other of the solders according to the difference of the areas of the at least two opening parts of the metal mask, whereby the electronic part is mounted on the circuit substrate in an inclined state.

Abstract: The circuit substrate includes at least two lands formed on a substrate, wherein one electrode is to be mounted on the at least two lands, an electronic part having electrodes, one of the electrodes is soldered on the at least two lands with solders whose amounts are adjusted by a metal mask having at least two opening parts, positions of the at least two opening parts corresponding to the at least two lands when the solders are applied and melted, areas of the at least two opening parts being different with each other, wherein a height of one of the solders is different from a height of the other of the solders according to the difference of the areas of the at least two opening parts of the metal mask, whereby the electronic part is mounted on the circuit substrate in an inclined state.

Abstract: The circuit substrate includes at least two lands formed on a substrate, wherein one electrode is to be mounted on the at least two lands, an electronic part having electrodes, one of the electrodes is soldered on the at least two lands with solders whose amounts are adjusted by a metal mask having at least two opening parts, positions of the at least two opening parts corresponding to the at least two lands when the solders are applied and melted, areas of the at least two opening parts being different with each other, wherein a height of one of the solders is different from a height of the other of the solders according to the difference of the areas of the at least two opening parts of the metal mask, whereby the electronic part is mounted on the circuit substrate in an inclined state.

Abstract: The circuit board includes a contact for supplying power, in which the contact includes plural copper foil patterns each having a predetermined width, the plural copper foil patterns being formed radially from a center of the contact and connected to each other at the center of the contact. Accordingly, it is possible to enhance contact reliability of the contact while suppressing cost for connecting a high-voltage board to an image forming unit.

Abstract: The circuit substrate includes at least two lands formed on a substrate, wherein one electrode is to be mounted on the at least two lands, an electronic part having electrodes, one of the electrodes is soldered on the at least two lands with solders whose amounts are adjusted by a metal mask having at least two opening parts, positions of the at least two opening parts corresponding to the at least two lands when the solders are applied and melted, areas of the at least two opening parts being different with each other, wherein a height of one of the solders is different from a height of the other of the solders according to the difference of the areas of the at least two opening parts of the metal mask, whereby the electronic part is mounted on the circuit substrate in an inclined state.

Abstract: The circuit board includes a contact for supplying power, in which the contact includes plural copper foil patterns each having a predetermined width, the plural copper foil patterns being formed radially from a center of the contact and connected to each other at the center of the contact. Accordingly, it is possible to enhance contact reliability of the contact while suppressing cost for connecting a high-voltage board to an image forming unit.

Abstract: Disclosed is a solar cell module which uses polyvinyl chloride as the backing and does not undergo a decrease in adhesive strength between the backing and a sealing layer even when exposed to an outdoor environment. The solar cell module has a polyvinyl chloride backing, and a encapsulant-covered photoelectric conversion component and a weather-resistant layer that are laminated in this order on the backing. The module includes a first adhesive layer between the polyvinyl chloride backing and the encapsulant-covered photoelectric conversion component. The first adhesive layer is formed of a single layer, and contains a plurality of resins.

Abstract: A solar cell module having a metal layer as a substrate, and being usable pratically. The solar cell module 10 has such a configuration that a weather resistant layer 11, an encapsulation layer 12, a power generation element 13 including a power generation layer sandwiched between a couple of electrodes, a power generation element substrate, a fluorinated hydrocarbon resin layer 16, and a metal layer 17 stacked in this order.

Abstract: The solar cell module having a configuration in which a solar cell is formed on the metal-resin composite substrate, and exhibiting excellent durability. The solar cell module 10 includes a metal-resin composite substrate 16 consisting of a resin layer 16A having a melting point of not less than 125° C. sandwiched between metal layers 16B; a lower encapsulation layer 15 and/or an adhesion layer 15B arranged on the metal-resin composite substrate 16; and a power generation element 13 including a power generation layer sandwiched between a couple of electrodes, and arranged on the lower encapsulation layer 16 or the adhesion layer 15B.

Abstract: An organic electronic device which does not deteriorate a device function over a long period of time and a method for its manufacture. The organic electronic device, containing: an organic semiconductor element (B) including a pair of electrodes; a layer (C) containing a scavenger, which absorbs at least one of moisture and oxygen; and a gas barrier film (D), in that order; and an anticorrosion layer (E) between the pair of electrodes and the layer (C), wherein the layer (E) has a film thickness of 20 ?m or more, and a water vapor transmission rate Pe (g/m2/day) of layer (E) at 40° C. and 90% RH is 15 g/m2/day?Pe>Pd relative to a water vapor transmission rate Pd of the film (D) at 40° C. and 90% RH, wherein Pd is 10?4?Pd?10?1 g/m2/day.

Abstract: The present invention relates to a method of producing an aromatic carbonate by reacting an aromatic hydroxy compound, carbon monoxide, and oxygen, wherein the reaction is carried out in the presence of a catalyst comprising:(A) at least one selected from palladium and palladium compounds;(B) at least one lead compound;(C) at least one cobalt compound; and,(D) at least one halide.According to this method an aromatic carbonate which produces only a small amount of impurities and has excellent selectivity can be produced.

Abstract: The present invention relates to a method of producing an aromatic carbonate by reacting an aromatic hydroxy compound, carbon monoxide and oxygen using as a catalyst a specified catalyst system containing palladium and cerium compounds. Specifically, the present invention relates to a method of producing an aromatic carbonate by reacting an aromatic hydroxy compound, carbon monoxide and oxygen in the presence of a catalyst containing the following compounds:(A) at least one selected from palladium and palladium compounds;(B) at least one of trivalent or tetravalent cerium compounds;(C) at least one selected from quaternary ammonium salts and quaternary phosphonium salts;(D) at least one selected from quinones and reduction products thereof, i.e., aromatic diols; or(A) and (B) components of the above; and(E) at least one inorganic halide selected from alkali metal halides and alkali earth metal halides.

Abstract: A process for preparing 2-hexene-1,6-dial comprising dimerizing 2-propenal in the presence of an organometallic compound of the group VIII metal. The desired compound can be obtained under mild conditions with industrial advantages.

Abstract: A process for the production of a water-soluble carbodiimide, which comprises(1) allowing ethyl isothiocyanate to react with N,N-dimethyl-1,3-propanediamine in an aromatic hydrocarbon solvent (first reaction step),(2) removing hydrogen sulfide from a thiourea derivative formed in the first reaction step upon adding a hydrogen sulfide removing agent without isolating the thiourea derivative (second reaction step), and(3) recovering a water-soluble carbodiimide from the resulting reaction mixture.