Patents by Inventor Takaki Murata

Takaki Murata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11777221
    Abstract: A plurality of multi-band antenna elements operable at a plurality of frequencies constitutes an array antenna. An antenna drive unit selects at least some of the multi-band antenna elements from the plurality of multi-band antenna elements in accordance with one operation frequency selected from the plurality of operation frequencies, and causes the selected multi-band antenna elements to operate.
    Type: Grant
    Filed: October 21, 2020
    Date of Patent: October 3, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Hideki Ueda, Kaoru Sudo, Kengo Onaka, Hirotsugu Mori, Takaki Murata
  • Patent number: 11450942
    Abstract: An antenna module (100) includes at least one antenna element (121), a ground electrode (GND1), and a dielectric layer (130), which is provided between the antenna element (121) and the ground electrode (GND1), and on which the antenna element (121) is mounted. A space (132) is formed between the dielectric layer (130) and the ground electrode (GND1) in a region where the antenna element (121) and the ground electrode (GND1) overlap each other when the dielectric layer (130) is seen in a plan view.
    Type: Grant
    Filed: August 13, 2020
    Date of Patent: September 20, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Takaki Murata, Kengo Onaka, Hirotsugu Mori
  • Patent number: 11336030
    Abstract: An antenna module (100) includes an antenna element (121), a dielectric substrate (150) on which the antenna element (121) is arranged, and a flexible substrate (160) having a first surface and a second surface. The flexible substrate (160) has a first portion (165), a bent portion (166) bent from the first portion (165) such that the first surface is located in an outer side portion, and a flat second portion (167) extending further from the bent portion (166). The dielectric substrate (150) is arranged on the first surface of the second portion (167). The dielectric substrate (150) has a projection portion (152) projecting from a contact surface between the dielectric substrate (150) and the flexible substrate (160) toward a side of the first portion (165) along the second portion (167). At least part of the antenna element (121) is arranged on the projection portion (152).
    Type: Grant
    Filed: August 19, 2020
    Date of Patent: May 17, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Takaki Murata, Kengo Onaka, Hirotsugu Mori
  • Publication number: 20210036428
    Abstract: A plurality of multi-band antenna elements operable at a plurality of frequencies constitutes an array antenna. An antenna drive unit selects at least some of the multi-band antenna elements from the plurality of multi-band antenna elements in accordance with one operation frequency selected from the plurality of operation frequencies, and causes the selected multi-band antenna elements to operate.
    Type: Application
    Filed: October 21, 2020
    Publication date: February 4, 2021
    Inventors: Hideki UEDA, Kaoru SUDO, Kengo ONAKA, Hirotsugu MORI, Takaki MURATA
  • Publication number: 20200381843
    Abstract: An antenna module (100) includes an antenna element (121), a dielectric substrate (150) on which the antenna element (121) is arranged, and a flexible substrate (160) having a first surface and a second surface. The flexible substrate (160) has a first portion (165), a bent portion (166) bent from the first portion (165) such that the first surface is located in an outer side portion, and a flat second portion (167) extending further from the bent portion (166). The dielectric substrate (150) is arranged on the first surface of the second portion (167). The dielectric substrate (150) has a projection portion (152) projecting from a contact surface between the dielectric substrate (150) and the flexible substrate (160) toward a side of the first portion (165) along the second portion (167). At least part of the antenna element (121) is arranged on the projection portion (152).
    Type: Application
    Filed: August 19, 2020
    Publication date: December 3, 2020
    Inventors: Takaki MURATA, Kengo ONAKA, Hirotsugu MORI
  • Publication number: 20200373646
    Abstract: An antenna module (100) includes at least one antenna element (121), a ground electrode (GND1), and a dielectric layer (130), which is provided between the antenna element (121) and the ground electrode (GND1), and on which the antenna element (121) is mounted. A space (132) is formed between the dielectric layer (130) and the ground electrode (GND1) in a region where the antenna element (121) and the ground electrode (GND1) overlap each other when the dielectric layer (130) is seen in a plan view.
    Type: Application
    Filed: August 13, 2020
    Publication date: November 26, 2020
    Inventors: Takaki MURATA, Kengo ONAKA, Hirotsugu MORI
  • Patent number: 8455381
    Abstract: A ceramic material composition advantageously used as a material for a ceramic substrate containing for example a resistor such as an isolator disposed therein. includes about 10 to 45 percent by weight of a BaO—TiO2—ReO3/2 ceramic composition, the ceramic composition being represented by xBaO-yTiO2-zReO3/2 (wherein x, y, and z each represent mole percent, 8?x?18, 52.5?y?65, and 20?z?40, and x+y+z=100; and Re represents a rare-earth element); about 5 to 40 percent by weight of alumina; and about 40 to 65 percent by weight of a borosilicate glass composition containing about 4 to 17.5 percent by weight of B2O3, about 28 to 50 percent by weight of SiO2, 0 to about 20 percent by weight of Al2O3, and about 36 to 50 percent by weight of MO (wherein MO represents at least one compound selected from CaO, MgO, SrO and BaO), wherein the total content of the BaO—TiO2—ReO3/2 ceramic composition and alumina is about 35 percent by weight or more.
    Type: Grant
    Filed: October 20, 2006
    Date of Patent: June 4, 2013
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Yasutaka Sugimoto, Satoshi Ohga, Takaki Murata
  • Patent number: 8293358
    Abstract: When a ceramic substrate is manufactured through a constraint firing step that uses a constraining layer, the constraining layer is removed without causing significant damage to a sintered base layer or an electrode formed on the surface of the sintered base layer, and the electrode can be reliably exposed. A green stacked body having a base layer and a constraining layer disposed so as to be in contact with at least one principal surface of the base layer is formed. A fired stacked body having a sintered base layer and a green constraining layer is then obtained by firing the green stacked body to sinter the base layer. Subsequently, the constraining layer is removed from the sintered base layer by vibrating media that are disposed so as to be in contact with the constraining layer.
    Type: Grant
    Filed: August 10, 2010
    Date of Patent: October 23, 2012
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Akiyoshi Kawamura, Takako Sato, Osamu Chikagawa, Takaki Murata
  • Patent number: 7879169
    Abstract: A method for producing a ceramic compact includes a laminate-preparing step of preparing an unfired laminate including a base layer including a ceramic powder and a glass material and a constraining layer that is in contact with at least one principal surface of the base layer and that primarily includes a burnable material which does not burn off when the burnable material is fired in a low-oxygen atmosphere but which burns off when the burnable material is fired at an oxygen partial pressure greater than that of the low-oxygen atmosphere, and a firing step of firing the unfired laminate to sinter the base layer. The firing step includes a first firing sub-step of firing the laminate including the constraining layer to sinter the base layer and a second firing sub-step of firing at an oxygen partial pressure greater than that of the first firing sub-step such that the burnable material included in the constraining layer burns off.
    Type: Grant
    Filed: October 21, 2008
    Date of Patent: February 1, 2011
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Takaki Murata
  • Publication number: 20100304125
    Abstract: When a ceramic substrate is manufactured through a constraint firing step that uses a constraining layer, the constraining layer is removed without causing significant damage to a sintered base layer or an electrode formed on the surface of the sintered base layer, and the electrode can be reliably exposed. A green stacked body having a base layer and a constraining layer disposed so as to be in contact with at least one principal surface of the base layer is formed. A fired stacked body having a sintered base layer and a green constraining layer is then obtained by firing the green stacked body to sinter the base layer. Subsequently, the constraining layer is removed from the sintered base layer by vibrating media that are disposed so as to be in contact with the constraining layer.
    Type: Application
    Filed: August 10, 2010
    Publication date: December 2, 2010
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventors: Akiyoshi KAWAMURA, Takako SATO, Osamu CHIKAGAWA, Takaki MURATA
  • Patent number: 7799156
    Abstract: When a ceramic substrate is manufactured through a constraint firing step that uses a constraining layer, the constraining layer is removed without causing significant damage to a sintered base layer or an electrode formed on the surface of the sintered base layer, and the electrode can be reliably exposed. A green stacked body having a base layer and a constraining layer disposed so as to be in contact with at least one principal surface of the base layer is formed. A fired stacked body having a sintered base layer and a green constraining layer is then obtained by firing the green stacked body to sinter the base layer. Subsequently, the constraining layer is removed from the sintered base layer by vibrating media that are disposed so as to be in contact with the constraining layer.
    Type: Grant
    Filed: August 26, 2009
    Date of Patent: September 21, 2010
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Akiyoshi Kawamura, Takako Sato, Osamu Chikagawa, Takaki Murata
  • Publication number: 20090305865
    Abstract: When a ceramic substrate is manufactured through a constraint firing step that uses a constraining layer, the constraining layer is removed without causing significant damage to a sintered base layer or an electrode formed on the surface of the sintered base layer, and the electrode can be reliably exposed. A green stacked body having a base layer and a constraining layer disposed so as to be in contact with at least one principal surface of the base layer is formed. A fired stacked body having a sintered base layer and a green constraining layer is then obtained by firing the green stacked body to sinter the base layer. Subsequently, the constraining layer is removed from the sintered base layer by vibrating media that are disposed so as to be in contact with the constraining layer.
    Type: Application
    Filed: August 26, 2009
    Publication date: December 10, 2009
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventors: Akiyoshi Kawamura, Takako Sato, Osamu Chikagawa, Takaki Murata
  • Patent number: 7601235
    Abstract: A method for manufacturing a multilayer ceramic board prevents damage to a wiring conductor formed on the surface of a multilayer ceramic board fabricated via a non-contraction process. On at least one principal surface of a layered body made up of a plurality of board ceramic green sheets including ceramic material powder, contraction prevention green sheets including inorganic material powder which is not sintered at the baking temperature of the board ceramic green sheet are arranged such that along at least a portion of the outer circumference of the principal surface, the portion and a nearby portion thereof are exposed to form a compound layered body, the compound layered body is baked under a condition in which the ceramic material powder is sintered, and the inorganic material powder is not sintered, following which the contraction prevention green sheets are removed.
    Type: Grant
    Filed: October 24, 2007
    Date of Patent: October 13, 2009
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Takaki Murata, Yasutaka Sugimoto
  • Publication number: 20090032168
    Abstract: A method for producing a ceramic compact includes a laminate-preparing step of preparing an unfired laminate including a base layer including a ceramic powder and a glass material and a constraining layer that is in contact with at least one principal surface of the base layer and that primarily includes a burnable material which does not burn off when the burnable material is fired in a low-oxygen atmosphere but which burns off when the burnable material is fired at an oxygen partial pressure greater than that of the low-oxygen atmosphere, and a firing step of firing the unfired laminate to sinter the base layer. The firing step includes a first firing sub-step of firing the laminate including the constraining layer to sinter the base layer and a second firing sub-step of firing at an oxygen partial pressure greater than that of the first firing sub-step such that the burnable material included in the constraining layer burns off.
    Type: Application
    Filed: October 21, 2008
    Publication date: February 5, 2009
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventor: Takaki MURATA
  • Publication number: 20080128157
    Abstract: A method for manufacturing a multilayer ceramic board prevents damage to a wiring conductor formed on the surface of a multilayer ceramic board fabricated via a non-contraction process. On at least one principal surface of a layered body made up of a plurality of board ceramic green sheets including ceramic material powder, contraction prevention green sheets including inorganic material powder which is not sintered at the baking temperature of the board ceramic green sheet are arranged such that along at least a portion of the outer circumference of the principal surface, the portion and a nearby portion thereof are exposed to form a compound layered body, the compound layered body is baked under a condition in which the ceramic material powder is sintered, and the inorganic material powder is not sintered, following which the contraction prevention green sheets are removed.
    Type: Application
    Filed: October 24, 2007
    Publication date: June 5, 2008
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventors: Takaki MURATA, Yasutaka SUGIMOTO
  • Publication number: 20070036996
    Abstract: A ceramic material composition advantageously used as a material for a ceramic substrate containing for example a resistor such as an isolator disposed therein. includes about 10 to 45 percent by weight of a BaO—TiO2—ReO3/2 ceramic composition, the ceramic composition being represented by xBaO-yTiO2-zReO3/2 (wherein x, y, and z each represent mole percent, 8?x?18, 52.5?y?65, and 20?z?40, and x+y+z=100; and Re represents a rare-earth element); about 5 to 40 percent by weight of alumina; and about 40 to 65 percent by weight of a borosilicate glass composition containing about 4 to 17.5 percent by weight of B2O3, about 28 to 50 percent by weight of SiO2, 0 to about 20 percent by weight of Al2O3, and about 36 to 50 percent by weight of MO (wherein MO represents at least one compound selected from CaO, MgO, SrO and BaO), wherein the total content of the BaO—TiO2—ReO3/2 ceramic composition and alumina is about 35 percent by weight or more.
    Type: Application
    Filed: October 20, 2006
    Publication date: February 15, 2007
    Inventors: Yasutaka Sugimoto, Satoshi Ohga, Takaki Murata