Abstract: An optical module having a laser element which emits a laser beam, include an optical path setting material which reflects a part of the laser beam in a predetermined direction; and a shield element which blocks the laser beam that is reflected by the optical path setting material.

Abstract: The present invention provides an optical communication module and the like in which a plurality of lead terminals necessary for the optical communication module is collected in one direction to effectively process the increased internal wiring. A plurality of lead terminals are arranged in a projecting manner over two stages of upper and lower stages at one end of a package 1, and a driver IC is arranged on a ceramic substrate. A step difference is formed at the edge of the ceramic substrate facing the optical element, and the optical element and the ceramic substrate are electrically connected using the step difference.

Abstract: A semiconductor laser chip unit includes an electrode pattern and a ground electrode; a semiconductor laser chip which is die-bonded to the ground electrode and outputs a laser beam according to a high-frequency signal transmitted from the electrode pattern and the ground electrode, and a collimator lens for collimating the laser beam from the semiconductor laser chip. The semiconductor laser chip and the collimator lens are so positioned that the laser beam output from the semiconductor laser chip is made incident on a surface of the collimator lens at a position inside of the focal point of the collimator lens, and the unit is integrated in a non-conductive heat sink so as to form a unit.

Abstract: The light beam emitted from a variable wavelength light source element 2 is partly directly monitored in a second detector 2 for automatic power control in an APC circuit 14, and is also partly passed through a wavelength filter 5 with the transmittance thereof varying with the wavelength and monitored in A first detector 65. Automatic frequency control is performed in an AFC circuit 15 while detecting wavelength variations by using the filter output and the direct monitored output. Thus, the construction is extremely simplified, while reducing the size and cost.

Abstract: A semiconductor laser chip unit includes an electrode pattern and a ground electrode; a semiconductor laser chip which is die-bonded to the ground electrode and outputs a laser beam according to a high-frequency signal transmitted from the electrode pattern and the ground electrode, and a collimator lens for collimating the laser beam from the semiconductor laser chip. The semiconductor laser chip and the collimator lens are so positioned that the laser beam output from the semiconductor laser chip is made incident on a surface of the collimator lens at a position inside of the focal point of the collimator lens, and the unit is integrated in a non-conductive heat sink so as to form a unit.

Abstract: The light beam emitted from a variable wavelength light source element 2 is partly directly monitored in a second detector 2 for automatic power control in an APC circuit 14, and is also partly passed through a wavelength filter 5 with the transmittance thereof varying with the wavelength and monitored in A first detector 65. Automatic frequency control is performed in an AFC circuit 15while detecting wavelength variations by using the filter output and the direct monitored output. Thus, the construction is extremely simplified, while reducing the size and cost.