Patents by Inventor Takami Sawai

Takami Sawai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Powdery mold-releasing lubricant for use in casting with a mold and a mold casting method
    Patent number: 6589919
    Abstract: A powdery mold-releasing lubricant according to the present invention uses a powdery mixture of a powdery organic material, which is evaporated or decomposed by heating to generate a gas, and a powdery inorganic material. A gas-solid mixed layer formed with the gas generated from the powdery mixture and the powdery inorganic material is used as a heat-insulating boundary layer. The powdery mold-releasing lubricant is inexpensive and has a superior mold lubricity.
    Type: Grant
    Filed: June 12, 2001
    Date of Patent: July 8, 2003
    Assignees: Hiroshima University, Hanano Corporation
    Inventors: Hideharu Fukunaga, Makoto Yoshida, Takami Sawai
  • Powdery mold-releasing lubricant for use in casting with a mold and a mold casting method
    Publication number: 20020022580
    Abstract: A powdery mold-releasing lubricant according to the present invention uses a powdery mixture of a powdery organic material, which is evaporated or decomposed by heating to generate a gas, and a powdery inorganic material. A gas-solid mixed layer formed with the gas generated from the powdery mixture and the powdery inorganic material is used as a heat-insulating boundary layer. The powdery mold-releasing lubricant is inexpensive and has a superior mold lubricity.
    Type: Application
    Filed: June 12, 2001
    Publication date: February 21, 2002
    Inventors: Hideharu Fukunaga, Makoto Yoshida, Takami Sawai