Abstract: A composite printed wiring board that allows for reflow heating for mounting electronic components using solder includes a first printed wiring board, an intermediate member, a second printed wiring board, and a bonding layer. The intermediate member is stacked on the first printed wiring board. The intermediate member has a cavity. The second printed wiring board is stacked on a surface on the opposite side to a surface opposed to the first printed wiring board in the intermediate member. The bonding layer is arranged at a bonding section between the first printed wiring board and the intermediate member and at a bonding section between the second printed wiring board and the intermediate member. The bonding layer contains high melting point metal and low melting point metal. The melting point of the bonding layer is higher than the melting point of the low melting point metal.

Abstract: A conductor ground plane provided on a dielectric substrate and provided with a patch antenna and a conductor ground plane provided on the side of a dielectric substrate having a through hole are bonded by solder in a state where the through hole and the patch antenna are arranged to face each other, and a conductor ground plane provided on the back side of the dielectric substrate and a conductor ground plane provided on a dielectric substrate are bonded by solder.

Abstract: A conductor ground plane provided on a dielectric substrate and provided with a patch antenna and a conductor ground plane provided on the side of a dielectric substrate having a through hole are bonded by solder in a state where the through hole and the patch antenna are arranged to face each other, and a conductor ground plane provided on the back side of the dielectric substrate and a conductor ground plane provided on a dielectric substrate are bonded by solder.

Abstract: A composite printed wiring board that allows for reflow heating for mounting electronic components using solder includes a first printed wiring board, an intermediate member, a second printed wiring board, and a bonding layer. The intermediate member is stacked on the first printed wiring board. The intermediate member has a cavity. The second printed wiring board is stacked on a surface on the opposite side to a surface opposed to the first printed wiring board in the intermediate member. The bonding layer is arranged at a bonding section between the first printed wiring board and the intermediate member and at a bonding section between the second printed wiring board and the intermediate member. The bonding layer contains high melting point metal and low melting point metal. The melting point of the bonding layer is higher than the melting point of the low melting point metal.

Abstract: Provided is a kernel program and so on capable of enhancing the confidentiality of data memorized in a storage device without using a file system on an OS kernel level. The kernel program is mounted on a computer operable to input and output data between an application program and a storage device, and causes the computer to function as: a socket establisher establishing a socket for connecting with the application program; a relational database operable to input and output data from/to the storage device through a device driver; and an access controller inputting a command from the application program through a message structure of the socket then to output the command to the relational database and inputting an execution result from the relational database then to output the execution result through a message structure of the socket to the application program.

Abstract: Provided is a kernel program and so on capable of enhancing the confidentiality of data memorized in a storage device without using a file system on an OS kernel level. The kernel program is mounted on a computer operable to input and output data between an application program and a storage device, and causes the computer to function as: a socket establisher establishing a socket for connecting with the application program; a relational database operable to input and output data from/to the storage device through a device driver; and an access controller inputting a command from the application program through a message structure of the socket then to output the command to the relational database and inputting an execution result from the relational database then to output the execution result through a message structure of the socket to the application program.