Patents by Inventor Takamitsu Inahara
Takamitsu Inahara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10138565Abstract: This disclosure enables high-productivity fabrication of porous semiconductor layers (made of single layer or multi-layer porous semiconductors such as porous silicon, comprising single porosity or multi-porosity layers). Some applications include fabrication of MEMS separation and sacrificial layers for die detachment and MEMS device fabrication, membrane formation and shallow trench isolation (STI) porous silicon (using porous silicon formation with an optimal porosity and its subsequent oxidation). Further, this disclosure is applicable to the general fields of photovoltaics, MEMS, including sensors and actuators, stand-alone, or integrated with integrated semiconductor microelectronics, semiconductor microelectronics chips and optoelectronics.Type: GrantFiled: January 4, 2017Date of Patent: November 27, 2018Assignee: TruTag Technologies, Inc.Inventors: Takao Yonehara, Subramanian Tamilmani, Karl-Josef Kramer, Jay Ashjaee, Mehrdad M. Moslehi, Yasuyoshi Miyaji, Noriyuki Hayashi, Takamitsu Inahara
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Publication number: 20180323087Abstract: This disclosure enables high-productivity fabrication of porous semiconductor layers (made of single layer or multi-layer porous semiconductors such as porous silicon, comprising single porosity or multi-porosity layers). Some applications include fabrication of MEMS separation and sacrificial layers for die detachment and MEMS device fabrication, membrane formation and shallow trench isolation (STI) porous silicon (using porous silicon formation with an optimal porosity and its subsequent oxidation). Further, this disclosure is applicable to the general fields of photovoltaics, MEMS, including sensors and actuators, stand-alone, or integrated with integrated semiconductor microelectronics, semiconductor microelectronics chips and optoelectronics.Type: ApplicationFiled: January 4, 2017Publication date: November 8, 2018Inventors: Takao Yonehara, Subramanian Tamilmani, Karl-Josef Kramer, Jay Ashjaee, Mehrdad M. Moslehi, Yasuyoshi Miyaji, Noriyuki Hayashi, Takamitsu Inahara
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Patent number: 9771662Abstract: This disclosure enables high-productivity fabrication of porous semiconductor layers (made of single layer or multi-layer porous semiconductors such as porous silicon, comprising single porosity or multi-porosity layers). Some applications include fabrication of MEMS separation and sacrificial layers for die detachment and MEMS device fabrication, membrane formation and shallow trench isolation (STI) porous silicon (using porous silicon formation with an optimal porosity and its subsequent oxidation). Further, this disclosure is applicable to the general fields of photovoltaics, MEMS, including sensors and actuators, stand-alone, or integrated with integrated semiconductor microelectronics, semiconductor microelectronics chips and optoelectronics.Type: GrantFiled: July 6, 2015Date of Patent: September 26, 2017Assignee: OB REALTY, LLCInventors: Takao Yonehara, Subramanian Tamilmani, Karl-Josef Kramer, Jay Ashjaee, Mehrdad M. Moslehi, Yasuyoshi Miyaji, Noriyuki Hayashi, Takamitsu Inahara
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Publication number: 20170243767Abstract: This disclosure enables high-productivity fabrication of porous semiconductor layers (made of single layer or multi-layer porous semiconductors such as porous silicon, comprising single porosity or multi-porosity layers). Some applications include fabrication of MEMS separation and sacrificial layers for die detachment and MEMS device fabrication, membrane formation and shallow trench isolation (STI) porous silicon (using porous silicon formation with an optimal porosity and its subsequent oxidation). Further, this disclosure is applicable to the general fields of photovoltaics, MEMS, including sensors and actuators, stand-alone, or integrated with integrated semiconductor microelectronics, semiconductor microelectronics chips and optoelectronics.Type: ApplicationFiled: January 4, 2017Publication date: August 24, 2017Inventors: Takao Yonehara, Subramanian Tamilmani, Karl-Josef Kramer, Jay Ashjaee, Mehrdad M. Moslehi, Yasuyoshi Miyaji, Noriyuki Hayashi, Takamitsu Inahara
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Publication number: 20160186358Abstract: This disclosure enables high-productivity fabrication of porous semiconductor layers (made of single layer or multi-layer porous semiconductors such as porous silicon, comprising single porosity or multi-porosity layers). Some applications include fabrication of MEMS separation and sacrificial layers for die detachment and MEMS device fabrication, membrane formation and shallow trench isolation (STI) porous silicon (using porous silicon formation with an optimal porosity and its subsequent oxidation). Further, this disclosure is applicable to the general fields of photovoltaics, MEMS, including sensors and actuators, stand-alone, or integrated with integrated semiconductor microelectronics, semiconductor microelectronics chips and optoelectronics.Type: ApplicationFiled: July 6, 2015Publication date: June 30, 2016Inventors: Takao Yonehara, Subramanian Tamilmani, Karl-Josef Kramer, Jay Ashjaee, Mehrdad M. Moslehi, Yasuyoshi Miyaji, Noriyuki Hayashi, Takamitsu Inahara
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Publication number: 20150308008Abstract: An apparatus for anodizing substrates immersed in an electrolyte solution. A substrate holder mounted in a storage tank includes a first support unit having first support elements for supporting, in a liquid-tight condition, portions of the substrates, and a second support unit attachable to and detachable from the first support unit and having second support elements for supporting, in a liquid-tight condition, the remaining portions of the substrates. The second support unit includes a first portion second support unit having support elements for supporting first portions of the remaining portions of the surfaces of the substrates, and a second portion second support unit having support elements for supporting second portions of the remaining portions of the surfaces of the substrates.Type: ApplicationFiled: March 30, 2015Publication date: October 29, 2015Inventors: Yasuyoshi MIYAJI, Noriyuki HAYASHI, Takamitsu INAHARA, Takao YONEHARA, Karl-Josef KRAMER, Subramanian TAMILMANI
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Patent number: 9076642Abstract: This disclosure enables high-productivity fabrication of porous semiconductor layers (made of single layer or multi-layer porous semiconductors such as porous silicon, comprising single porosity or multi-porosity layers). Some applications include fabrication of MEMS separation and sacrificial layers for die detachment and MEMS device fabrication, membrane formation and shallow trench isolation (STI) porous silicon (using porous silicon formation with an optimal porosity and its subsequent oxidation). Further, this disclosure is applicable to the general fields of photovoltaics, MEMS, including sensors and actuators, stand-alone, or integrated with integrated semiconductor microelectronics, semiconductor microelectronics chips and optoelectronics.Type: GrantFiled: September 24, 2011Date of Patent: July 7, 2015Assignee: Solexel, Inc.Inventors: Takao Yonehara, Subramanian Tamilmani, Karl-Josef Kramer, Jay Ashjaee, Mehrdad M. Moslehi, Yasuyoshi Miyaji, Noriyuki Hayashi, Takamitsu Inahara
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Patent number: 8992746Abstract: An apparatus for anodizing substrates immersed in an electrolyte solution. A substrate holder mounted in a storage tank includes a first support unit having first support elements for supporting, in a liquid-tight condition, only lower circumferential portions of the substrates, and a second support unit attachable to and detachable from the first support unit and having second support elements for supporting, in a liquid-tight condition, remaining circumferential portions of the substrates. A drive mechanism separates the first support unit and the second support unit when loading and unloading the substrates, and for connecting the first support unit and the second support unit after the substrates are placed in the substrate holder.Type: GrantFiled: December 2, 2011Date of Patent: March 31, 2015Assignees: Dainippon Screen Mfg. Co., Ltd., Solexel, Inc.Inventors: Yasuyoshi Miyaji, Noriyuki Hayashi, Takamitsu Inahara, Takao Yonehara, Karl-Josef Kramer, Subramanian Tamilmani
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Publication number: 20130180847Abstract: This disclosure enables high-productivity fabrication of porous semiconductor layers (made of single layer or multi-layer porous semiconductors such as porous silicon, comprising single porosity or multi-porosity layers). Some applications include fabrication of MEMS separation and sacrificial layers for die detachment and MEMS device fabrication, membrane formation and shallow trench isolation (STI) porous silicon (using porous silicon formation with an optimal porosity and its subsequent oxidation). Further, this disclosure is applicable to the general fields of photovoltaics, MEMS, including sensors and actuators, stand-alone, or integrated with integrated semiconductor microelectronics, semiconductor microelectronics chips and optoelectronics.Type: ApplicationFiled: September 24, 2011Publication date: July 18, 2013Inventors: Takao Yonehara, Subramanian Tamilmani, Karl-Josef Kramer, Jay Ashjaee, Mehrdad M. Moslehi, Yasuyoshi Miyaji, Noriyuki Hayashi, Takamitsu Inahara
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Publication number: 20120138455Abstract: An apparatus for anodizing substrates immersed in an electrolyte solution. A substrate holder mounted in a storage tank includes a first support unit having first support elements for supporting, in a liquid-tight condition, only lower circumferential portions of the substrates, and a second support unit attachable to and detachable from the first support unit and having second support elements for supporting, in a liquid-tight condition, remaining circumferential portions of the substrates. A drive mechanism separates the first support unit and the second support unit when loading and unloading the substrates, and for connecting the first support unit and the second support unit after the substrates are placed in the substrate holder.Type: ApplicationFiled: December 2, 2011Publication date: June 7, 2012Inventors: Yasuyoshi MIYAJI, Noriyuki HAYASHI, Takamitsu INAHARA, Takao YONEHARA, Karl-Josef KRAMER, Subramanian TAMILMANI
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Patent number: 6799685Abstract: A medicine packing apparatus feeds medicine in accordance with prescription data and then separates and packs the medicine by one dose. A discriminating mechanism (4) determines the type of medicine package belt to be formed in accordance with prescription data. A distributing member (42) distributes the medicine package belt based on the determination of the discriminating mechanism (4). Thus, according to the present invention, a different configuration of medicine package belts can be properly distributed and transferred based on the use thereof.Type: GrantFiled: October 31, 2000Date of Patent: October 5, 2004Assignee: Yuyama MFG. Co., Ltd.Inventors: Shoji Yuyama, Nakaji Takeda, Takamitsu Inahara, Noriyuki Iiboshi, Toshifumi Matsushita