Abstract: A machine learning apparatus that learns an alarm factor in a motor drive device includes a state observation unit that obtains a feature amount as a state variable from the motor drive device and an alarm factor as label data, the alarm factor corresponding to the feature amount, and a learning unit that generates a learning model for inferring a new alarm factor corresponding to a new feature amount, from a dataset created on a basis of a combination of the state variable and the label data. The feature amount includes at least one of a detected current value detected from the motor, a speed command value specifying a rotational speed of the motor, an output voltage value output to the motor, an estimated speed value of the motor, and a detected speed value of the motor.

Abstract: A solenoid control apparatus includes a resin housing having a solenoid mounting portion, a connector portion, and a circuit board mounting portion in which a circuit board is mounted. Terminals extending from the solenoid mounting portion and the connector portion are soldered to the electrical circuit on the circuit board. The circuit board has a reduced-rigidity portion in its area corresponding to a portion of the resin housing through which the connector portion is connected to the solenoid mounting portion. The reduced-rigidity portion is formed by reducing the amount of material forming the circuit board per unit area, and is more easily deformable than the remaining portion of the circuit board. When the connector portion is thermally deformed, the circuit board is also easily deformable about the reduced-rigidity portion. This reduces stress on the soldered portions.

Abstract: A solenoid control apparatus includes a resin housing having a solenoid mounting portion, a connector portion, and a circuit board mounting portion in which a circuit board is mounted. Terminals extending from the solenoid mounting portion and the connector portion are soldered to the electrical circuit on the circuit board. The circuit board has a reduced-rigidity portion in its area corresponding to a portion of the resin housing through which the connector portion is connected to the solenoid mounting portion. The reduced-rigidity portion is formed by reducing the amount of material forming the circuit board per unit area, and is more easily deformable than the remaining portion of the circuit board. When the connector portion is thermally deformed, the circuit board is also easily deformable about the reduced-rigidity portion. This reduces stress on the soldered portions.