Patents by Inventor Takanobu Kai

Takanobu Kai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6881894
    Abstract: An EMI shielding structure comprises a printed circuit having at least one contact protuberance forming part of a ground plane. An EMI shield member is placed in a desired alignment over the printed circuit. The EMI shield member is formed with an aperture receiving the contact protuberance in contact with the aperture defining contact wall so that electric continuity between the EMI shield member and the ground plane is ensured.
    Type: Grant
    Filed: October 12, 2001
    Date of Patent: April 19, 2005
    Assignee: NEC LCD Technologies, Ltd.
    Inventor: Takanobu Kai
  • Publication number: 20030070824
    Abstract: An EMI shielding structure comprises a printed circuit having at least one contact protuberance forming part of a ground plane. An EMI shield member is placed in a desired alignment over the printed circuit. The EMI shield member is formed with an aperture receiving the contact protuberance in contact with the aperture defining contact wall so that electric continuity between the EMI shield member and the ground plane is ensured.
    Type: Application
    Filed: October 12, 2001
    Publication date: April 17, 2003
    Inventor: Takanobu Kai
  • Patent number: 5982468
    Abstract: In a liquid crystal display (LCD) apparatus, at least one flexible printed board for driving an LCD panel has input terminals and a dummy lead as an alignment marker. An opening is perforated at an end of the flexible printed board. A printed wiring board has connection pads to be connected to the input terminals and a dummy land as an alignment marker.
    Type: Grant
    Filed: March 21, 1997
    Date of Patent: November 9, 1999
    Assignee: NEC Corporation
    Inventors: Akihide Satou, Takanobu Kai
  • Patent number: 5679493
    Abstract: A packaging glass mask is used for local exposure to light on a photo conductive layer which is insulative and becomes conductive upon exposure to light. This results in elimination of charge on the exposed surface of the photo conductive layer to form a charged pattern in accordance with a packaging pattern. Each conductive particle consisting of a core insulator coated with plating of a conductive material is then distributed on the surface of the photo conductive layer. The conductive particles are deposited in a concentrated manner on charged sections of the photo conductive layer. An insulating resin is then laid on the conductive particles by application or transfer to complete an anisotropic conductive film with the conductive particles selectively distributed therein in accordance with the packaging pattern.
    Type: Grant
    Filed: October 2, 1995
    Date of Patent: October 21, 1997
    Assignee: NEC Corporation
    Inventor: Takanobu Kai