Abstract: A method of manufacturing a liquid discharging head includes preparing a wafer provided with an element and a discharge port formation member on a front surface of the wafer, forming a recessed portion in a rear surface of the wafer, attaching the rear surface of the wafer and a dicing tape, cutting the wafer along cutting lines to form an element board, and connecting an electric wiring board and a terminal of the element board. The element board includes a discharge port formation member having a discharge port for discharging liquid and includes the element to supply energy to the discharge port for liquid discharge. The recessed portion is formed at a location corresponding to the cutting lines, and an area of a region where the terminal overlaps the recessed portion is smaller than an area of a region where the terminal does not overlap the recessed portion.

Abstract: A recording element substrate includes an ejection port forming member in which an ejection port configured to eject liquid is formed, and a substrate. The substrate includes a liquid supply port that supplies the liquid to the ejection port, a first surface on which the ejection port forming member is placed, and a second surface that is a rear surface of the first surface. The liquid supply port includes a first portion perpendicularly connected to the first surface, and a second portion connected to the first portion. An inner wall of the second portion includes an inclined surface that is inclined toward an inner wall of the first portion such that a width of the second portion is gradually increased toward the second surface. A hydrophilic film is formed at least on the inner wall of the first portion.

Abstract: A liquid ejection head includes a substrate provided with an energy-generating element, an ejection orifice forming member that is formed on the substrate and includes an ejection orifice from which liquid is ejected, a reinforcing rib provided in the ejection orifice forming member, and a recess that is formed in the substrate and forms a part of a flow path of liquid, wherein the reinforcing rib is disposed in the inside of the recess.

Abstract: In a liquid ejection head and a method of manufacturing the ejection head, an ejection port board is provided with an expanded portion that communicates with a supply port and has an open end that is larger than an opening of the supply port.

Abstract: A liquid ejecting head having high reliability can be manufactured such that the occurrence of cracks in the print element substrate can be suppressed. The supply port of the print element substrate has an opening, the opening width of which at each end portion in the longitudinal direction is narrower than the opening width at the center portion in the longitudinal direction.

Abstract: Provided are a liquid ejection head capable of preventing deformation and breakage of a filter and a method of manufacturing the liquid ejection head. The liquid ejection head comprises: a substrate comprising a supply port through which to supply a liquid and an element configured to produce energy for ejecting the liquid; a resin layer comprising an ejection port through which the liquid is ejectable with the energy produced by the element, and a flow channel connecting the supply port and the ejection port; a filter disposed between the supply port and the flow channel; and a support portion supporting a surface of the filter on the supply port side and a surface of the filter on the flow channel side.

Abstract: A liquid ejection head 4 includes a substrate 1 provided with an energy-generating element 5, an ejection orifice forming member 2 that is formed on the substrate 1 and includes an ejection orifice 3 from which liquid is ejected, a reinforcing rib 10 provided in the ejection orifice forming member 2, and a recess 6 that is formed in the substrate 1 and forms a part of a flow path of liquid, wherein the reinforcing rib 10 is disposed in the inside of the recess 6.

Abstract: There is provided a method for manufacturing a liquid discharge head including a liquid discharge head substrate and a flow path forming member, the liquid discharge head substrate having a base, a pressure generation portion provided at a front surface of the base to generate pressure for discharging a liquid, and a supply port for supplying the liquid to the pressure generation portion, and the flow path forming member forming a flow path for feeding the liquid supplied from the supply port to the pressure generation portion. The method includes removing a sacrificial layer by etching the base from a back surface of the base, in a state in which an end covering portion of a cover layer for covering the sacrificial layer is covered with the resin layer. The method suppresses formation of a crack in the end covering portion that covers the end portion of the sacrificial layer.

Abstract: Provided are a lower price liquid ejection head and a method of manufacturing the liquid ejection head. To this end, an ejection port board is provided with an expanded portion that communicates with a supply port and has a larger open end than an opening of the supply port.

Abstract: Provided is a liquid ejecting head with high reliability in which the occurrence of cracks in the substrate is suppressed and a method of manufacturing the liquid ejecting head. To achieve the object, the supply port of the print element substrate has an opening the opening width of which at each end portion in the longitudinal direction is smaller than the opening width at the center portion in the longitudinal direction.

Abstract: Provided are a liquid ejection head capable of preventing deformation and breakage of a filter and a method of manufacturing the liquid ejection head. The liquid ejection head comprises: a substrate comprising a supply port through which to supply a liquid and an element configured to produce energy for ejecting the liquid; a resin layer comprising an ejection port through which the liquid is ejectable with the energy produced by the element, and a flow channel connecting the supply port and the ejection port; a filter disposed between the supply port and the flow channel; and a support portion supporting a surface of the filter on the supply port side and a surface of the filter on the flow channel side.

Abstract: There is provided a method for manufacturing a liquid discharge head including a liquid discharge head substrate and a flow path forming member, the liquid discharge head substrate having a base, a pressure generation portion provided at a front surface of the base to generate pressure for discharging a liquid, and a supply port for supplying the liquid to the pressure generation portion, and the flow path forming member forming a flow path for feeding the liquid supplied from the supply port to the pressure generation portion. The method includes removing a sacrificial layer by etching the base from a back surface of the base, in a state in which an end covering portion of a cover layer for covering the sacrificial layer is covered with the resin layer. The method suppresses formation of a crack in the end covering portion that covers the end portion of the sacrificial layer.

Abstract: There is provided a method for manufacturing a liquid discharge head including a liquid discharge head substrate and a flow path forming member, the liquid discharge head substrate having a base, a pressure generation portion provided at a front surface of the base to generate pressure for discharging a liquid, and a supply port for supplying the liquid to the pressure generation portion, and the flow path forming member forming a flow path for feeding the liquid supplied from the supply port to the pressure generation portion. The method includes removing a sacrificial layer by etching the base from a back surface of the base, in a state in which an end covering portion of a cover layer for covering the sacrificial layer is covered with the resin layer. The method suppresses formation of a crack in the end covering portion that covers the end portion of the sacrificial layer.

Abstract: The present invention provides a liquid ejecting head in which a chip crack is unlikely to occur. To achieve this, a liquid ejecting head includes an element substrate having energy generating elements arranged on the front face of the element substrate in its longitudinal direction and a channel member having ejection ports formed to correspond to the energy generating elements, respectively. In the element substrate, a supply port for supplying liquid is formed so as to pierce through from a back face to a front face of the element substrate, and inside the supply port, a beam is formed at a position closer to an end of the supply port rather than a center thereof in its longitudinal direction to connect facing inner walls of the supply port in its lateral direction.

Abstract: There is provided a method for manufacturing a liquid discharge head including a liquid discharge head substrate and a flow path forming member, the liquid discharge head substrate having a base, a pressure generation portion provided at a front surface of the base to generate pressure for discharging a liquid, and a supply port for supplying the liquid to the pressure generation portion, and the flow path forming member forming a flow path for feeding the liquid supplied from the supply port to the pressure generation portion. The method includes removing a sacrificial layer by etching the base from a back surface of the base, in a state in which an end covering portion of a cover layer for covering the sacrificial layer is covered with the resin layer. The method suppresses formation of a crack in the end covering portion that covers the end portion of the sacrificial layer.

Abstract: Performed are a non-through hole forming step of partitioning a supply path forming region of a second surface into a first region corresponding to a forming position of a beam, a second region located adjacent to the first region on both sides thereof, and a third region that is none of the first region and the second region, and forming a plurality of non-through holes in the second region and the third region, and an etching step of subjecting a silicon substrate to anisotropic etching from the second surface, to thereby form the supply path and the beam in the supply path. In the non-through hole forming step, at least one of an interval or a depth of the non-through holes is caused to differ in the second region and the third region, to thereby control the shape and dimension of the beam to be formed in the etching step.

Abstract: Performed are a non-through hole forming step of partitioning a supply path forming region of a second surface into a first region corresponding to a forming position of a beam, a second region located adjacent to the first region on both sides thereof, and a third region that is none of the first region and the second region, and forming a plurality of non-through holes in the second region and the third region, and an etching step of subjecting a silicon substrate to anisotropic etching from the second surface, to thereby form the supply path and the beam in the supply path. In the non-through hole forming step, at least one of an interval or a depth of the non-through holes is caused to differ in the second region and the third region, to thereby control the shape and dimension of the beam to be formed in the etching step.

Abstract: A method for manufacturing a liquid discharge head. The method includes a first step of forming a telecentric measurement pattern A by exposure, the telecentric measurement pattern A being part of a measurement pattern that allows determination of inclination of a principal ray caused by an off-axis telecentric degree occurring in a projection exposing device, and a second step of forming a telecentric measurement pattern B by exposure under an exposure condition defocused from an exposure condition in the first step, the telecentric measurement pattern B being another part of the measurement pattern, which allows the determination of the inclination of the principal ray caused by the off-axis telecentric degree occurring in the projection exposing device. The off-axis telecentric degree is determined from an amount of misalignment between relative forming positions of the telecentric measurement patterns A and B and an amount of defocusing.

Abstract: A method for manufacturing a liquid discharge head. The method includes a first step of forming a telecentric measurement pattern A by exposure, the telecentric measurement pattern A being part of a measurement pattern that allows determination of inclination of a principal ray caused by an off-axis telecentric degree occurring in a projection exposing device, and a second step of forming a telecentric measurement pattern B by exposure under an exposure condition defocused from an exposure condition in the first step, the telecentric measurement pattern B being another part of the measurement pattern, which allows the determination of the inclination of the principal ray caused by the off-axis telecentric degree occurring in the projection exposing device. The off-axis telecentric degree is determined from an amount of misalignment between relative forming positions of the telecentric measurement patterns A and B and an amount of defocusing.

Abstract: A process for producing a semiconductor chip having a substrate and a bump formed on the substrate including (1) forming, on a substrate, a conductor gold for plating to be a base of plating growth; (2) forming a mask for plating on the conductor gold for plating; (3) performing plating using the mask for plating to form the bump and a dummy pattern; (4) removing the mask for plating; (5) etching the conductor gold for plating; and (6) applying a shock to at least the dummy pattern. The amount of side etching of the conductor gold for plating is grasped from a state of separation of the dummy pattern due to the shock in the step (6).