Abstract: A vapor phase growth apparatus according to an embodiment includes, n reactors performing a deposition process for a plurality of substrates at the same time, a first main gas supply path distributing a predetermined amount of first process gas including a group-III element to the n reactors at the same time, a second main gas supply path distributing a predetermined amount of second process gas including a group-V element to the n reactors at the same time, a controller controlling a flow rate of the first and second process gas, on the basis of control values of the flow rates of the first and second process gas supplied to the n reactors, and independently controlling predetermined process parameter independently set for each of the n reactors on the basis of control values, rotary drivers, and a heater.

Abstract: A vapor phase growth apparatus according to an embodiment includes, n reactors performing a deposition process for a plurality of substrates at the same time, a first main gas supply path distributing a predetermined amount of first process gas including a group-III element to the n reactors at the same time, a second main gas supply path distributing a predetermined amount of second process gas including a group-V element to the n reactors at the same time, a controller controlling a flow rate of the first and second process gas, on the basis of control values of the flow rates of the first and second process gas supplied to the n reactors, and independently controlling predetermined process parameter independently set for each of the n reactors on the basis of control values, rotary drivers, and a heater.

Abstract: A vapor phase growth apparatus according to an embodiment includes, n reactors performing a deposition process for a plurality of substrates at the same time, a first main gas supply path distributing a predetermined amount of first process gas including a group-III element to the n reactors at the same time, a second main gas supply path distributing a predetermined amount of second process gas including a group-V element to the n reactors at the same time, a controller controlling a flow rate of the first and second process gas, on the basis of control values of the flow rates of the first and second process gas supplied to the n reactors, and independently controlling predetermined process parameter independently set for each of the n reactors on the basis of control values, rotary drivers, and a heater.

Abstract: A vapor phase growth apparatus has a reaction chamber to form a film on an upper surface of a substrate by a vapor growth reaction, a gas supplier to supply a gas to the reaction chamber, a heater to heat the substrate from a back side of the substrate, and a controller to control an output of the heater. The controller has an electrical characteristics measuring instrument which measures electrical characteristics of the heater at predetermined time intervals and detects a variation value of the electrical characteristics between a newly value and previous value, and a threshold determiner which extracts a maximum value and a minimum value of a predetermined number of detected variation values and newly variation value of the electrical characteristics, calculates differences between the maximum value and the minimum value at the predetermined time intervals, and determines whether the difference exceeds a predetermined threshold.

Abstract: A film forming apparatus according to the present embodiment includes a film forming chamber accommodating a substrate and performing a film forming process per substrate, a gas supplier supplying a gas onto the substrate, a heater heating the substrate, a window provided to the film forming chamber, a radiation thermometer measuring a temperature of the substrate through the window, a parameter acquirer acquiring a parameter correlated with the temperature of the substrate, a corrector correcting the temperature of the substrate based on a change from an initial value of the parameter, and a controller controlling the heater based on the temperature of the substrate or the temperature of the substrate thus corrected.

Abstract: A vapor growth apparatus has a reaction chamber, a gas supply part to supply a gas to the reaction chamber, a heater to heat the substrate from a surface opposite to a film growth surface of the substrate, an irradiation part to emit an optical signal to the film growth surface, a light receiving part to receive the reflected optical signal, a first light receiving range determination part to determine whether a light receiving position of the optical signal in the light receiving part is out of a predetermined first light receiving range, and a position deviation detection part to judge that the substrate has caused position deviation, a rotation part to rotate the substrate via a susceptor, a purge gas supply part to supply a purge gas into the rotation part, and a control part to control a supply amount of the purge gas.

Abstract: A vapor phase growth method of growing a film on a substrate by supplying material gases to the substrate while heating the substrate with a heating unit according to an embodiment, the method includes: measuring a temperature of the substrate with a radiation thermometer; executing a temperature feedback control to control an output of the heating unit to cause a measurement value of the radiation thermometer to have a set value when a film is not grown on the substrate; and executing a constant output control to maintain an output of the heating unit constant when a film causing thin-film interference in a wavelength measured by the radiation thermometer is grown on the substrate.

Abstract: A vapor phase growth apparatus according to an embodiment includes, n reactors performing a deposition process for a plurality of substrates at the same time, a first main gas supply path distributing a predetermined amount of first process gas including a group-III element to the n reactors at the same time, a second main gas supply path distributing a predetermined amount of second process gas including a group-V element to the n reactors at the same time, a controller controlling a flow rate of the first and second process gas, on the basis of control values of the flow rates of the first and second process gas supplied to the n reactors, and independently controlling predetermined process parameter independently set for each of the n reactors on the basis of control values, rotary drivers, and a heater.

Abstract: A vapor phase growth method of growing a film on a substrate by supplying material gases to the substrate while heating the substrate with a heating unit according to an embodiment, the method includes: measuring a temperature of the substrate with a radiation thermometer; executing a temperature feedback control to control an output of the heating unit to cause a measurement value of the radiation thermometer to have a set value when a film is not grown on the substrate; and executing a constant output control to maintain an output of the heating unit constant when a film causing thin-film interference in a wavelength measured by the radiation thermometer is grown on the substrate.