Patents by Inventor Takanori Muramoto

Takanori Muramoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8268113
    Abstract: A bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.
    Type: Grant
    Filed: May 11, 2011
    Date of Patent: September 18, 2012
    Assignee: Fujitsu Limited
    Inventors: Takanori Muramoto, Takuya Ohno, Tsukasa Adachi, Koji Hashizume, Yosimasa Miyajima, Takao Kojima
  • Publication number: 20110214807
    Abstract: A bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.
    Type: Application
    Filed: May 11, 2011
    Publication date: September 8, 2011
    Applicant: Fujitsu Limited
    Inventors: Takanori Muramoto, Takuya Ohno, Tsukasa Adachi, Koji Hashizume, Yosimasa Miyajima, Takao Kojima
  • Patent number: 7963308
    Abstract: A bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.
    Type: Grant
    Filed: October 16, 2006
    Date of Patent: June 21, 2011
    Assignee: Fujitsu Limited
    Inventors: Takanori Muramoto, Takuya Ohno, Tsukasa Adachi, Koji Hashizume, Yosimasa Miyajima, Takao Kojima
  • Publication number: 20110011541
    Abstract: A bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.
    Type: Application
    Filed: September 28, 2010
    Publication date: January 20, 2011
    Applicant: Fujitsu Limited
    Inventors: Takanori Muramoto, Takuya Ohno, Tsukasa Adachi, Koji Hashizume, Yosimasa Miyajima, Takao Kojima
  • Publication number: 20100230030
    Abstract: A bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.
    Type: Application
    Filed: February 26, 2010
    Publication date: September 16, 2010
    Inventors: Takanori Muramoto, Takuya Ohno, Tsukasa Adachi, Koji Hashizume, Yosimasa Miyajima, Takao Kojima
  • Patent number: 7704348
    Abstract: A bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.
    Type: Grant
    Filed: October 21, 2005
    Date of Patent: April 27, 2010
    Assignee: Fujitsu Limited
    Inventors: Takanori Muramoto, Takuya Ohno, Tsukasa Adachi, Koji Hashizume, Yosimasa Miyajima, Takao Kojima
  • Patent number: 7597774
    Abstract: A bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.
    Type: Grant
    Filed: October 21, 2005
    Date of Patent: October 6, 2009
    Assignee: Fujitsu Limited
    Inventors: Takanori Muramoto, Takuya Ohno, Tsukasa Adachi, Koji Hashizume, Yosimasa Miyajima, Takao Kojima
  • Publication number: 20080083439
    Abstract: A method for cleaning a laminated substrate fabrication apparatus that efficiently cleans a surface used to attract a substrate while enabling stable cleaning. A cleaning unit, which includes an attraction surface for attracting and holding the substrate, is arranged in a processing chamber to clean the attraction surface.
    Type: Application
    Filed: November 27, 2007
    Publication date: April 10, 2008
    Applicant: FUJITSU LIMITED
    Inventors: Takanori Muramoto, Tetsuji Kadowaki, Yukio Takayama, Ken Tsuboi
  • Publication number: 20070235130
    Abstract: A laminated substrate manufacturing apparatus that seals an inner side of a seal frame into which liquid crystal is filled while reducing manufacturing deficiencies of laminated substrates. The substrate includes a first holding plate and a second holding plate for holding two substrates. A seal pressing device arranged on one of the first and second holding plates presses a seal formed between the substrates.
    Type: Application
    Filed: June 8, 2007
    Publication date: October 11, 2007
    Applicant: FUJITSU LIMITED
    Inventors: Joji Hasegawa, Takuya Ohno, Akiyoshi Ito, Tetsuji Kadowaki, Takanori Muramoto
  • Publication number: 20070034332
    Abstract: A bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.
    Type: Application
    Filed: October 16, 2006
    Publication date: February 15, 2007
    Applicant: Fujitsu Limited
    Inventors: Takanori Muramoto, Takuya Ohno, Tsukasa Adachi, Koji Hashizume, Yosimasa Miyajima, Takao Kojima
  • Patent number: 7137427
    Abstract: Disclosed is a bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.
    Type: Grant
    Filed: January 22, 2003
    Date of Patent: November 21, 2006
    Assignee: Fujitsu Limited
    Inventors: Takanori Muramoto, Takuya Ohno, Tsukasa Adachi, Koji Hashizume, Yosimasa Miyajima, Takao Kojima
  • Publication number: 20060221538
    Abstract: A method for cleaning a laminated substrate fabrication apparatus that efficiently cleans a surface used to attract a substrate while enabling stable cleaning. A cleaning unit, which includes an attraction surface for attracting and holding the substrate, is arranged in a processing chamber to clean the attraction surface.
    Type: Application
    Filed: October 13, 2005
    Publication date: October 5, 2006
    Applicant: FUJITSU LIMITED
    Inventors: Takanori Muramoto, Tetsuji Kadowaki, Yukio Takayama, Ken Tsuboi
  • Publication number: 20060157192
    Abstract: A laminated substrate manufacturing device for eliminating deformation of substrates during a period between when the substrates undergo a conveying process and an attracting process before the substrates are laminated. The laminated substrate manufacturing device includes two holding plates arranged in a processing chamber. Each holding plate includes vacuum pads for attracting a corresponding substrate. A controller controls an attraction device provided for each holding plate so that the holding plate sequentially attracts the corresponding substrate from a central portion to the peripheral portion of the substrate.
    Type: Application
    Filed: June 7, 2005
    Publication date: July 20, 2006
    Applicant: FUJITSU LIMITED
    Inventors: Joji Hasegawa, Yoshimasa Miyajima, Takanori Muramoto
  • Publication number: 20060048896
    Abstract: A bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.
    Type: Application
    Filed: October 21, 2005
    Publication date: March 9, 2006
    Applicant: FUJITSU LIMITED
    Inventors: Takanori Muramoto, Takuya Ohno, Tsukasa Adachi, Koji Hashizume, Yosimasa Miyajima, Takao Kojima
  • Publication number: 20060037707
    Abstract: A bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.
    Type: Application
    Filed: October 21, 2005
    Publication date: February 23, 2006
    Applicant: FUJITSU LIMITED
    Inventors: Takanori Muramoto, Takuya Ohno, Tsukasa Adachi, Koji Hashizume, Yosimasa Miyajima, Takao Kojima
  • Publication number: 20060032583
    Abstract: A bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.
    Type: Application
    Filed: October 21, 2005
    Publication date: February 16, 2006
    Applicant: FUJITSU LIMITED
    Inventors: Takanori Muramoto, Takuya Ohno, Tsukasa Adachi, Koji Hashizume, Yosimasa Miyajima, Takao Kojima
  • Publication number: 20060005920
    Abstract: A method of fabricating bonded substrates with fewer production defects. The method includes forming a frame of a seal on a surface of a first substrate; disposing first and second substrates into a process chamber, depressurizing the process chamber; moving at least one of the first and second substrates in such a way that the first and second substrates approach each other, computing a pressing load acting on the first and second substrates; stopping movement of the at least one of the first and second substrates when the computed pressing load reaches a target load; and setting a pressure in the process chamber back to atmospheric pressure.
    Type: Application
    Filed: September 13, 2005
    Publication date: January 12, 2006
    Applicant: FUJITSU LIMITED
    Inventors: Takanori Muramoto, Takuya Ohno, Kazushige Komatsu, Koji Hashizume, Tsukasa Adachi, Yoshimasa Miyajima, Katsuhiro Nakashima
  • Publication number: 20050236105
    Abstract: A laminated substrate manufacturing apparatus that seals an inner side of a seal frame into which liquid crystal is filled while reducing manufacturing deficiencies of laminated substrates. The substrate includes a first holding plate and a second holding plate for holding two substrates. A seal pressing device arranged on one of the first and second holding plates presses a seal formed between the substrates.
    Type: Application
    Filed: September 29, 2004
    Publication date: October 27, 2005
    Applicant: FUJITSU LIMITED
    Inventors: Joji Hasegawa, Takuya Ohno, Akiyoshi Ito, Tetsuji Kadowaki, Takanori Muramoto
  • Publication number: 20030226633
    Abstract: An apparatus for fabricating bonded substrates with fewer production defects. A press machine includes a vacuum process chamber formed by an upper container and a lower container, two holding plates for holding two substrates, and a pressing mechanism for moving upper holding plate downward. The upper container is connected to the pressing mechanism via upper bellows. The lower container is connected to a positioning stage via lower bellows. The upper and lower bellows prevent deformation of the vacuum process chamber from being transmitted to the two holding plates.
    Type: Application
    Filed: June 4, 2003
    Publication date: December 11, 2003
    Applicant: Fujitsu Limited
    Inventors: Takanori Muramoto, Takuya Ohno, Kazushige Komatsu, Koji Hashizume, Tsukasa Adachi, Yoshimasa Miyajima, Katsuhiro Nakashima
  • Publication number: 20030178134
    Abstract: Disclosed is a bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.
    Type: Application
    Filed: January 22, 2003
    Publication date: September 25, 2003
    Applicant: Fujitsu Limited
    Inventors: Takanori Muramoto, Takuya Ohno, Tsukasa Adachi, Koji Hashizume, Yosimasa Miyajima, Takao Kojima