Patents by Inventor Takanori Muramoto
Takanori Muramoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8268113Abstract: A bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.Type: GrantFiled: May 11, 2011Date of Patent: September 18, 2012Assignee: Fujitsu LimitedInventors: Takanori Muramoto, Takuya Ohno, Tsukasa Adachi, Koji Hashizume, Yosimasa Miyajima, Takao Kojima
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Publication number: 20110214807Abstract: A bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.Type: ApplicationFiled: May 11, 2011Publication date: September 8, 2011Applicant: Fujitsu LimitedInventors: Takanori Muramoto, Takuya Ohno, Tsukasa Adachi, Koji Hashizume, Yosimasa Miyajima, Takao Kojima
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Patent number: 7963308Abstract: A bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.Type: GrantFiled: October 16, 2006Date of Patent: June 21, 2011Assignee: Fujitsu LimitedInventors: Takanori Muramoto, Takuya Ohno, Tsukasa Adachi, Koji Hashizume, Yosimasa Miyajima, Takao Kojima
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Publication number: 20110011541Abstract: A bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.Type: ApplicationFiled: September 28, 2010Publication date: January 20, 2011Applicant: Fujitsu LimitedInventors: Takanori Muramoto, Takuya Ohno, Tsukasa Adachi, Koji Hashizume, Yosimasa Miyajima, Takao Kojima
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Publication number: 20100230030Abstract: A bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.Type: ApplicationFiled: February 26, 2010Publication date: September 16, 2010Inventors: Takanori Muramoto, Takuya Ohno, Tsukasa Adachi, Koji Hashizume, Yosimasa Miyajima, Takao Kojima
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Patent number: 7704348Abstract: A bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.Type: GrantFiled: October 21, 2005Date of Patent: April 27, 2010Assignee: Fujitsu LimitedInventors: Takanori Muramoto, Takuya Ohno, Tsukasa Adachi, Koji Hashizume, Yosimasa Miyajima, Takao Kojima
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Patent number: 7597774Abstract: A bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.Type: GrantFiled: October 21, 2005Date of Patent: October 6, 2009Assignee: Fujitsu LimitedInventors: Takanori Muramoto, Takuya Ohno, Tsukasa Adachi, Koji Hashizume, Yosimasa Miyajima, Takao Kojima
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Publication number: 20080083439Abstract: A method for cleaning a laminated substrate fabrication apparatus that efficiently cleans a surface used to attract a substrate while enabling stable cleaning. A cleaning unit, which includes an attraction surface for attracting and holding the substrate, is arranged in a processing chamber to clean the attraction surface.Type: ApplicationFiled: November 27, 2007Publication date: April 10, 2008Applicant: FUJITSU LIMITEDInventors: Takanori Muramoto, Tetsuji Kadowaki, Yukio Takayama, Ken Tsuboi
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Publication number: 20070235130Abstract: A laminated substrate manufacturing apparatus that seals an inner side of a seal frame into which liquid crystal is filled while reducing manufacturing deficiencies of laminated substrates. The substrate includes a first holding plate and a second holding plate for holding two substrates. A seal pressing device arranged on one of the first and second holding plates presses a seal formed between the substrates.Type: ApplicationFiled: June 8, 2007Publication date: October 11, 2007Applicant: FUJITSU LIMITEDInventors: Joji Hasegawa, Takuya Ohno, Akiyoshi Ito, Tetsuji Kadowaki, Takanori Muramoto
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Publication number: 20070034332Abstract: A bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.Type: ApplicationFiled: October 16, 2006Publication date: February 15, 2007Applicant: Fujitsu LimitedInventors: Takanori Muramoto, Takuya Ohno, Tsukasa Adachi, Koji Hashizume, Yosimasa Miyajima, Takao Kojima
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Patent number: 7137427Abstract: Disclosed is a bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.Type: GrantFiled: January 22, 2003Date of Patent: November 21, 2006Assignee: Fujitsu LimitedInventors: Takanori Muramoto, Takuya Ohno, Tsukasa Adachi, Koji Hashizume, Yosimasa Miyajima, Takao Kojima
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Publication number: 20060221538Abstract: A method for cleaning a laminated substrate fabrication apparatus that efficiently cleans a surface used to attract a substrate while enabling stable cleaning. A cleaning unit, which includes an attraction surface for attracting and holding the substrate, is arranged in a processing chamber to clean the attraction surface.Type: ApplicationFiled: October 13, 2005Publication date: October 5, 2006Applicant: FUJITSU LIMITEDInventors: Takanori Muramoto, Tetsuji Kadowaki, Yukio Takayama, Ken Tsuboi
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Publication number: 20060157192Abstract: A laminated substrate manufacturing device for eliminating deformation of substrates during a period between when the substrates undergo a conveying process and an attracting process before the substrates are laminated. The laminated substrate manufacturing device includes two holding plates arranged in a processing chamber. Each holding plate includes vacuum pads for attracting a corresponding substrate. A controller controls an attraction device provided for each holding plate so that the holding plate sequentially attracts the corresponding substrate from a central portion to the peripheral portion of the substrate.Type: ApplicationFiled: June 7, 2005Publication date: July 20, 2006Applicant: FUJITSU LIMITEDInventors: Joji Hasegawa, Yoshimasa Miyajima, Takanori Muramoto
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Publication number: 20060048896Abstract: A bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.Type: ApplicationFiled: October 21, 2005Publication date: March 9, 2006Applicant: FUJITSU LIMITEDInventors: Takanori Muramoto, Takuya Ohno, Tsukasa Adachi, Koji Hashizume, Yosimasa Miyajima, Takao Kojima
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Publication number: 20060037707Abstract: A bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.Type: ApplicationFiled: October 21, 2005Publication date: February 23, 2006Applicant: FUJITSU LIMITEDInventors: Takanori Muramoto, Takuya Ohno, Tsukasa Adachi, Koji Hashizume, Yosimasa Miyajima, Takao Kojima
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Publication number: 20060032583Abstract: A bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.Type: ApplicationFiled: October 21, 2005Publication date: February 16, 2006Applicant: FUJITSU LIMITEDInventors: Takanori Muramoto, Takuya Ohno, Tsukasa Adachi, Koji Hashizume, Yosimasa Miyajima, Takao Kojima
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Publication number: 20060005920Abstract: A method of fabricating bonded substrates with fewer production defects. The method includes forming a frame of a seal on a surface of a first substrate; disposing first and second substrates into a process chamber, depressurizing the process chamber; moving at least one of the first and second substrates in such a way that the first and second substrates approach each other, computing a pressing load acting on the first and second substrates; stopping movement of the at least one of the first and second substrates when the computed pressing load reaches a target load; and setting a pressure in the process chamber back to atmospheric pressure.Type: ApplicationFiled: September 13, 2005Publication date: January 12, 2006Applicant: FUJITSU LIMITEDInventors: Takanori Muramoto, Takuya Ohno, Kazushige Komatsu, Koji Hashizume, Tsukasa Adachi, Yoshimasa Miyajima, Katsuhiro Nakashima
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Publication number: 20050236105Abstract: A laminated substrate manufacturing apparatus that seals an inner side of a seal frame into which liquid crystal is filled while reducing manufacturing deficiencies of laminated substrates. The substrate includes a first holding plate and a second holding plate for holding two substrates. A seal pressing device arranged on one of the first and second holding plates presses a seal formed between the substrates.Type: ApplicationFiled: September 29, 2004Publication date: October 27, 2005Applicant: FUJITSU LIMITEDInventors: Joji Hasegawa, Takuya Ohno, Akiyoshi Ito, Tetsuji Kadowaki, Takanori Muramoto
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Publication number: 20030226633Abstract: An apparatus for fabricating bonded substrates with fewer production defects. A press machine includes a vacuum process chamber formed by an upper container and a lower container, two holding plates for holding two substrates, and a pressing mechanism for moving upper holding plate downward. The upper container is connected to the pressing mechanism via upper bellows. The lower container is connected to a positioning stage via lower bellows. The upper and lower bellows prevent deformation of the vacuum process chamber from being transmitted to the two holding plates.Type: ApplicationFiled: June 4, 2003Publication date: December 11, 2003Applicant: Fujitsu LimitedInventors: Takanori Muramoto, Takuya Ohno, Kazushige Komatsu, Koji Hashizume, Tsukasa Adachi, Yoshimasa Miyajima, Katsuhiro Nakashima
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Publication number: 20030178134Abstract: Disclosed is a bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.Type: ApplicationFiled: January 22, 2003Publication date: September 25, 2003Applicant: Fujitsu LimitedInventors: Takanori Muramoto, Takuya Ohno, Tsukasa Adachi, Koji Hashizume, Yosimasa Miyajima, Takao Kojima