Patents by Inventor Takanori Nishizawa

Takanori Nishizawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6277763
    Abstract: A method and apparatus for etching of a substrate comprising both a polysilicon layer and an overlying tungsten layer. The method comprises etching the tungsten layer in a chamber using a plasma formed from a gas mixture comprising a fluorinated gas (such as CF4, NF3, SF6, and the like) and oxygen.
    Type: Grant
    Filed: December 16, 1999
    Date of Patent: August 21, 2001
    Assignee: Applied Materials, Inc.
    Inventors: Katsuhisa Kugimiya, Takanori Nishizawa, Daisuke Tajima