Abstract: According to a composite substrate manufacturing method of the present invention, (a) a piezoelectric substrate having minute asperities formed in a rear surface thereof, and a support substrate having a smaller thermal expansion coefficient than the piezoelectric substrate are prepared, (b) a filler is applied to the rear surface 11a to fill the minute asperities, thereby forming a filling layer, (c) a surface of the filling layer is mirror-polished to such an extent that an arithmetic mean roughness Ra of the surface of the filling layer is smaller than an arithmetic mean roughness Ra of the rear surface 11a in a state of above (a), and (d) the surface of the filling layer and a surface of the support substrate are bonded to each other with an adhesive layer interposed therebetween, thereby forming a composite substrate.

Abstract: According to a composite substrate manufacturing method of the present invention, (a) a piezoelectric substrate having minute asperities formed in a rear surface thereof, and a support substrate having a smaller thermal expansion coefficient than the piezoelectric substrate are prepared, (b) a filler is applied to the rear surface 11a to fill the minute asperities, thereby forming a filling layer, (c) a surface of the filling layer is mirror-polished to such an extent that an arithmetic mean roughness Ra of the surface of the filling layer is smaller than an arithmetic mean roughness Ra of the rear surface 11a in a state of above (a), and (d) the surface of the filling layer and a surface of the support substrate are bonded to each other with an adhesive layer interposed therebetween, thereby forming a composite substrate.

Abstract: An electrostatic chuck of this invention includes a conductive film, an insulating coat formed on a susceptor to cover the conductive film, and a feeder circuit for applying a voltage to the conductive film to cause the insulating coat to generate an electrostatic attractive force. The feeder circuit includes a connecting conductor replacing a portion of the insulating coat to be electrically connected to the conductive film, a first feeder pin extending through the susceptor from its front surface side to its rear surface side and having one end portion electrically connected to the connecting conductor, an insulating member for insulating the first feeder pin from the susceptor, a second feeder pin having one end portion pressed against the other end portion of the first feeder pin to be electrically connected to the first feeder pin, and a power supply electrically connected to the second feeder pin.