Patents by Inventor Takanori SHINOURA
Takanori SHINOURA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230274861Abstract: A chip resistor includes a substrate, two top electrodes, a resistor element, two back electrodes, and two side electrodes. The substrate has a top surface, a back surface and two side surface. The top and back surfaces face away in the thickness direction of the substrate. The side surfaces, spaced apart in a predetermined direction orthogonal to the thickness direction, are connected to the top and back surfaces. The top electrodes, spaced apart in the predetermined direction, are in contact with the top surface. The resistor element, disposed on the top surface, is connected to the top electrodes. The back electrodes, spaced apart in the predetermined direction, are in contact with the back surface. The side electrodes, held in contact with the side surfaces, are connected to the top and back electrodes. Each back electrode has a first and a second layer. The first layer is in contact with the back surface.Type: ApplicationFiled: May 9, 2023Publication date: August 31, 2023Inventor: Takanori SHINOURA
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Patent number: 11688532Abstract: A chip resistor includes a substrate, two top electrodes, a resistor element, two back electrodes, and two side electrodes. The substrate has a top surface, a back surface and two side surface. The top and back surfaces face away in the thickness direction of the substrate. The side surfaces, spaced apart in a predetermined direction orthogonal to the thickness direction, are connected to the top and back surfaces. The top electrodes, spaced apart in the predetermined direction, are in contact with the top surface. The resistor element, disposed on the top surface, is connected to the top electrodes. The back electrodes, spaced apart in the predetermined direction, are in contact with the back surface. The side electrodes, held in contact with the side surfaces, are connected to the top and back electrodes. Each back electrode has a first and a second layer. The first layer is in contact with the back surface.Type: GrantFiled: February 27, 2020Date of Patent: June 27, 2023Assignee: ROHM CO., LTD.Inventor: Takanori Shinoura
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Publication number: 20220375657Abstract: A chip resistor includes a substrate, an upper electrode and a resistor body, a back electrode, a side electrode, and a metal plating layer. The substrate includes an upper surface, a back surface that intersect a thickness-wise direction and a side surface that joins the upper surface and the back surface. The upper electrode and the resistor body are formed on the upper surface. The back electrode is formed on the back surface. The side electrode is formed on the side surface. The metal plating layer includes a back plating layer and a side plating layer. The back plating layer covers at least a portion of the back electrode. The side plating layer covers at least a portion of the side electrode. The metal plating layer has a thickness that is greater than or equal to 10 ?m and less than or equal to 60 ?m.Type: ApplicationFiled: October 29, 2020Publication date: November 24, 2022Inventors: Soichi SAKAKIBARA, Takanori SHINOURA, Wataru IMAHASHI
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Publication number: 20220165459Abstract: A chip resistor includes a substrate, two top electrodes, a resistor element, two back electrodes, and two side electrodes. The substrate has a top surface, a back surface and two side surface. The top and back surfaces face away in the thickness direction of the substrate. The side surfaces, spaced apart in a predetermined direction orthogonal to the thickness direction, are connected to the top and back surfaces. The top electrodes, spaced apart in the predetermined direction, are in contact with the top surface. The resistor element, disposed on the top surface, is connected to the top electrodes. The back electrodes, spaced apart in the predetermined direction, are in contact with the back surface. The side electrodes, held in contact with the side surfaces, are connected to the top and back electrodes. Each back electrode has a first and a second layer. The first layer is in contact with the back surface.Type: ApplicationFiled: February 27, 2020Publication date: May 26, 2022Inventor: Takanori SHINOURA
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Patent number: 11322280Abstract: A chip resistor includes a substrate, a resistor layer, a first conductive layer, an insulating layer, a second conductive layer, a third conductive layer, and a fourth conductive layer. The first conductive layer is electrically connected to the resistor layer. The insulating layer covers the resistor layer and the first conductive layer. The second conductive layer covers the first conductive layer and the insulating layer. The third conductive layer covers the second conductive layer and the insulating layer. The fourth conductive layer covers the second conductive layer and the third conductive layer. Bonding strength between the third and fourth conductive layer is stronger than that between the second and fourth conductive layer.Type: GrantFiled: January 27, 2021Date of Patent: May 3, 2022Assignee: ROHM CO., LTD.Inventor: Takanori Shinoura
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Patent number: 11189403Abstract: A chip resistor includes an upper electrode provided on a substrate, a resistor element connected to the upper electrode, and a side electrode connected to the upper electrode. The side electrode, arranged on a side surface of the substrate, has two portions overlapping with the obverse surface and reverse surface of the substrate, respectively. An intermediate electrode covers the side electrode, and an external electrode covers the intermediate electrode. A first protective layer is disposed between the upper electrode and the intermediate electrode, and held in contact with the upper electrode and the side electrode. The first protective layer is more resistant to sulfurization than the upper electrode. A second protective layer is disposed between the first protective layer and intermediate electrode, and held in contact with the first protective layer, side electrode and intermediate electrode.Type: GrantFiled: September 30, 2020Date of Patent: November 30, 2021Assignee: ROHM CO., LTD.Inventors: Takanori Shinoura, Wataru Imahashi
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Publication number: 20210151225Abstract: A chip resistor includes a substrate, a resistor layer, a first conductive layer, an insulating layer, a second conductive layer, a third conductive layer, and a fourth conductive layer. The first conductive layer is electrically connected to the resistor layer. The insulating layer covers the resistor layer and the first conductive layer. The second conductive layer covers the first conductive layer and the insulating layer. The third conductive layer covers the second conductive layer and the insulating layer. The fourth conductive layer covers the second conductive layer and the third conductive layer. Bonding strength between the third and fourth conductive layer is stronger than that between the second and fourth conductive layer.Type: ApplicationFiled: January 27, 2021Publication date: May 20, 2021Inventor: Takanori SHINOURA
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Patent number: 10937573Abstract: A chip resistor includes a substrate, a resistor layer, a first conductive layer, an insulating layer, a second conductive layer, a third conductive layer, and a fourth conductive layer. The first conductive layer is electrically connected to the resistor layer. The insulating layer covers the resistor layer and the first conductive layer. The second conductive layer covers the first conductive layer and the insulating layer. The third conductive layer covers the second conductive layer and the insulating layer. The fourth conductive layer covers the second conductive layer and the third conductive layer. Bonding strength between the third and fourth conductive layer is stronger than that between the second and fourth conductive layer.Type: GrantFiled: October 11, 2018Date of Patent: March 2, 2021Assignee: ROHM CO., LTD.Inventor: Takanori Shinoura
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Publication number: 20210012932Abstract: A chip resistor includes an upper electrode provided on a substrate, a resistor element connected to the upper electrode, and a side electrode connected to the upper electrode. The side electrode, arranged on a side surface of the substrate, has two portions overlapping with the obverse surface and reverse surface of the substrate, respectively. An intermediate electrode covers the side electrode, and an external electrode covers the intermediate electrode. A first protective layer is disposed between the upper electrode and the intermediate electrode, and held in contact with the upper electrode and the side electrode. The first protective layer is more resistant to sulfurization than the upper electrode. A second protective layer is disposed between the first protective layer and intermediate electrode, and held in contact with the first protective layer, side electrode and intermediate electrode.Type: ApplicationFiled: September 30, 2020Publication date: January 14, 2021Inventors: Takanori SHINOURA, Wataru IMAHASHI
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Patent number: 10832837Abstract: A chip resistor includes an upper electrode provided on a substrate, a resistor element connected to the upper electrode, and a side electrode connected to the upper electrode. The side electrode, arranged on a side surface of the substrate, has two portions overlapping with the obverse surface and reverse surface of the substrate, respectively. An intermediate electrode covers the side electrode, and an external electrode covers the intermediate electrode. A first protective layer is disposed between the upper electrode and the intermediate electrode, and held in contact with the upper electrode and the side electrode. The first protective layer is more resistant to sulfurization than the upper electrode. A second protective layer is disposed between the first protective layer and intermediate electrode, and held in contact with the first protective layer, side electrode and intermediate electrode.Type: GrantFiled: September 13, 2019Date of Patent: November 10, 2020Assignee: ROHM CO., LTD.Inventors: Takanori Shinoura, Wataru Imahashi
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Patent number: 10811174Abstract: One aspect of the present disclosure provides a chip resistor. In the chip resistor, a top electrode is disposed on a front surface of a substrate. A resistor is disposed on the front surface and electrically connected to the top electrode. A protective layer covers the resistor. A protective electrode is electrically connected to the top electrode. A side electrode is electrically connected to the top electrode. The side electrode has a side portion disposed on the side surface, and a top portion and a bottom portion respectively overlapping the front surface and the back surface in plan view. An intermediate electrode covers the protective electrode and the side electrode. An outer electrode covers the intermediate electrode. The protective electrode is in contact with both the top electrode and the protective layer and covers a portion of the top electrode and a portion of the protective layer.Type: GrantFiled: November 30, 2017Date of Patent: October 20, 2020Assignee: ROHM CO., LTD.Inventors: Wataru Imahashi, Takanori Shinoura
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Publication number: 20200328014Abstract: An aspect of the present disclosure provides a chip resistor, which includes a substrate, a resistor layer, a first conductive layer, an insulating layer, a second conductive layer, a third conductive layer, and a fourth conductive layer. The substrate has an obverse surface and a reverse surface facing opposite in a thickness direction, with a side surface located between the obverse and reverse surface. The resistor layer is on the obverse surface. The first conductive layer is on the obverse surface, electrically connected to the resistor layer. The insulating layer covers the resistor layer and the first conductive layer, with a first edge located on the first conductive layer. The second conductive layer covers the first conductive layer and the insulating layer while straddling over the first edge, and has a second edge located on the insulating layer.Type: ApplicationFiled: October 11, 2018Publication date: October 15, 2020Inventor: Takanori SHINOURA
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Publication number: 20200066429Abstract: One aspect of the present disclosure provides a chip resistor. In the chip resistor, a top electrode is disposed on a front surface of a substrate. A resistor is disposed on the front surface and electrically connected to the top electrode. A protective layer covers the resistor. A protective electrode is electrically connected to the top electrode. A side electrode is electrically connected to the top electrode. The side electrode has a side portion disposed on the side surface, and a top portion and a bottom portion respectively overlapping the front surface and the back surface in plan view. An intermediate electrode covers the protective electrode and the side electrode. An outer electrode covers the intermediate electrode. The protective electrode is in contact with both the top electrode and the protective layer and covers a portion of the top electrode and a portion of the protective layer.Type: ApplicationFiled: November 30, 2017Publication date: February 27, 2020Inventors: Wataru IMAHASHI, Takanori SHINOURA
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Publication number: 20200005972Abstract: A chip resistor includes an upper electrode provided on a substrate, a resistor element connected to the upper electrode, and a side electrode connected to the upper electrode. The side electrode, arranged on a side surface of the substrate, has two portions overlapping with the obverse surface and reverse surface of the substrate, respectively. An intermediate electrode covers the side electrode, and an external electrode covers the intermediate electrode. A first protective layer is disposed between the upper electrode and the intermediate electrode, and held in contact with the upper electrode and the side electrode. The first protective layer is more resistant to sulfurization than the upper electrode. A second protective layer is disposed between the first protective layer and intermediate electrode, and held in contact with the first protective layer, side electrode and intermediate electrode.Type: ApplicationFiled: September 13, 2019Publication date: January 2, 2020Inventors: Takanori SHINOURA, Wataru IMAHASHI
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Patent number: 10453593Abstract: A chip resistor includes an upper electrode provided on a substrate, a resistor element connected to the upper electrode, and a side electrode connected to the upper electrode. The side electrode, arranged on a side surface of the substrate, has two portions overlapping with the obverse surface and reverse surface of the substrate, respectively. An intermediate electrode covers the side electrode, and an external electrode covers the intermediate electrode. A first protective layer is disposed between the upper electrode and the intermediate electrode, and held in contact with the upper electrode and the side electrode. The first protective layer is more resistant to sulfurization than the upper electrode. A second protective layer is disposed between the first protective layer and intermediate electrode, and held in contact with the first protective layer, side electrode and intermediate electrode.Type: GrantFiled: May 11, 2018Date of Patent: October 22, 2019Assignee: ROHM CO., LTD.Inventors: Takanori Shinoura, Wataru Imahashi
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Publication number: 20180261361Abstract: A chip resistor includes an upper electrode provided on a substrate, a resistor element connected to the upper electrode, and a side electrode connected to the upper electrode. The side electrode, arranged on a side surface of the substrate, has two portions overlapping with the obverse surface and reverse surface of the substrate, respectively. An intermediate electrode covers the side electrode, and an external electrode covers the intermediate electrode. A first protective layer is disposed between the upper electrode and the intermediate electrode, and held in contact with the upper electrode and the side electrode. The first protective layer is more resistant to sulfurization than the upper electrode. A second protective layer is disposed between the first protective layer and intermediate electrode, and held in contact with the first protective layer, side electrode and intermediate electrode.Type: ApplicationFiled: May 11, 2018Publication date: September 13, 2018Inventors: Takanori SHINOURA, Wataru IMAHASHI
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Patent number: 9997281Abstract: A chip resistor includes an upper electrode provided on a substrate, a resistor element connected to the upper electrode, and a side electrode connected to the upper electrode. The side electrode, arranged on a side surface of the substrate, has two portions overlapping with the obverse surface and reverse surface of the substrate, respectively. An intermediate electrode covers the side electrode, and an external electrode covers the intermediate electrode. A first protective layer is disposed between the upper electrode and the intermediate electrode, and held in contact with the upper electrode and the side electrode. The first protective layer is more resistant to sulfurization than the upper electrode. A second protective layer is disposed between the first protective layer and intermediate electrode, and held in contact with the first protective layer, side electrode and intermediate electrode.Type: GrantFiled: February 16, 2016Date of Patent: June 12, 2018Assignee: ROHM CO., LTD.Inventors: Takanori Shinoura, Wataru Imahashi
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Publication number: 20160247610Abstract: A chip resistor includes an upper electrode provided on a substrate, a resistor element connected to the upper electrode, and a side electrode connected to the upper electrode. The side electrode, arranged on a side surface of the substrate, has two portions overlapping with the obverse surface and reverse surface of the substrate, respectively. An intermediate electrode covers the side electrode, and an external electrode covers the intermediate electrode. A first protective layer is disposed between the upper electrode and the intermediate electrode, and held in contact with the upper electrode and the side electrode. The first protective layer is more resistant to sulfurization than the upper electrode. A second protective layer is disposed between the first protective layer and intermediate electrode, and held in contact with the first protective layer, side electrode and intermediate electrode.Type: ApplicationFiled: February 16, 2016Publication date: August 25, 2016Inventors: Takanori SHINOURA, Wataru IMAHASHI