Abstract: A radiation imaging device according to one embodiment includes a radiation detection panel having a first surface on which a detection region is formed and an electrode pad is formed outside the detection region, and a second surface on a side opposite to the first surface, a base substrate having a support surface configured to face the second surface of the radiation detection panel and configured to support the radiation detection panel, and a flexible circuit substrate connected to the electrode pad via a connecting member, wherein an end portion of the base substrate is located further inward than an inner end portion of the connection region in which the electrode pad, the connecting member, and the flexible circuit substrate overlap each other when seen in an Z direction orthogonal to the support surface.

Abstract: A radiation imaging device according to one embodiment comprises a radiation detection panel, a base substrate having a support surface configured to support the radiation detection panel, and a housing, wherein: the housing has a top wall and a bottom wall, the base substrate has a protruding portion which protrudes further outward than the radiation detection panel when seen in a direction orthogonal to the support surface, a first extending portion is provided to the support surface of the protruding portion, a second extending portion is provided to a back surface of the protruding portion, the second extending portion being disposed at a position which it faces the first extending portion with the protruding portion interposed therebetween, and the base substrate is supported on the top wall via the first extending portion and is supported on the bottom wall via the second extending portion.

Abstract: A copolymer of the present invention comprises a repeating unit derived from phenylphenyl (meth)acrylate; a repeating unit derived from a hydroxyphenyl group-containing unsaturated compound; and a repeating unit derived from an epoxy group-containing unsaturated compound. The copolymer of the present invention brings together excellent transparency and a high refractive index. A resin film formed from the copolymer of the present invention can be suitably utilized in the formation of a protective film or interlayer insulating film for an electronic part such as a liquid crystal display device, an integrated circuit device, or a solid-state imaging device, the formation of a microlens or a microlens array, the formation of an optical waveguide, or the like.

Abstract: A copolymer of the present invention comprises a repeating unit derived from phenylphenyl(meth)acrylate; a repeating unit derived from a hydroxyphenyl group-containing unsaturated compound; and a repeating unit derived from an epoxy group-containing unsaturated compound. The copolymer of the present invention brings together excellent transparency and a high refractive index. A resin film formed from the copolymer of the present invention can be suitably utilized in the formation of a protective film or interlayer insulating film for an electronic part such as a liquid crystal display device, an integrated circuit device, or a solid-state imaging device, the formation of a microlens or a microlens array, the formation of an optical waveguide, or the like.

Abstract: Disclosed is a photosensitive resin composition which has excellent transparency, heat resistance, thermal discoloration resistance, adhesion to a substrate and electrical characteristics, while exhibiting good developability and storage stability. Specifically disclosed is a photosensitive resin composition which contains the following components (A), (B) and (C). (A) a copolymer which contains (a1) hydroxyphenyl (meth)acrylate and (a2) an unsaturated epoxy compound as copolymerization components (B) a novolac resin which contains one or more phenols selected from among dimethylphenol, trimethylphenol, methylpropylphenol, dipropylphenol, butylphenol, methylbutylphenol, dibutylphenol, and 4,4?-dihydroxy-2,2?-diphenylpropane (C) a quinonediazide group-containing compound.

Abstract: Disclosed is a photosensitive resin composition which has excellent transparency, heat resistance, thermal discoloration resistance, adhesion to a substrate and electrical characteristics, while exhibiting good developability and storage stability. Specifically disclosed is a photosensitive resin composition which contains the following components (A), (B) and (C).