Patents by Inventor Takao Miyagawa

Takao Miyagawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flexible laminated board and multilayer circuit board
    Patent number: 11985762
    Abstract: A flexible laminated sheet manufacturing method includes thermocompression-bonding an insulation film formed of a liquid crystal polymer onto a metal foil between endless belts to form a flexible laminated sheet. The thermocompression bonding includes heating the flexible laminated sheet so that the maximum temperature of the sheet is in the range from a temperature that is 45° C. lower than the melting point of the liquid crystal polymer to a temperature that is 5° C. lower than the melting point. The thermocompression bonding also includes slowly cooling the flexible laminated sheet so that an exit temperature, which is a temperature of the sheet when transferred out of the endless belts, is in the range from a temperature that is 235° C. lower than the melting point of the liquid crystal polymer to a temperature that is 100° C. lower than the melting point.
    Type: Grant
    Filed: January 25, 2021
    Date of Patent: May 14, 2024
    Assignee: UBE EXSYMO CO., LTD.
    Inventors: Eisuke Tachibana, Taro Suzuki, Makoto Totani, Kouji Kondoh, Eijirou Miyagawa, Junya Kasahara, Takao Arima
  • Terminating resistance circuit
    Patent number: 5936389
    Abstract: A terminating resistance circuit is used for a bus line in which a power source line, signal lines and ground lines are connected between computer equipment via terminators, respectively. An input terminal of a regulator is connected to the power source line, and the terminator is connected between an output terminal of the regulator and the signal line. A zener diode is connected between the output terminal and the ground line in such a manner that a cathode terminal and an anode terminal of the zener diode are connected to the output terminal of the regulator and the ground line, respectively.
    Type: Grant
    Filed: October 7, 1996
    Date of Patent: August 10, 1999
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Takao Miyagawa, Hidenobu Sakai
  • Bus terminating circuit
    Patent number: 5553250
    Abstract: A bus terminating circuit is provided on each of a plurality of SCSI devices connected to each other through an SCSI bus line. A first terminating resistor is inserted between each of the signal lines and a power source line of the bus line and a second terminating resistor is inserted between each of the signal lines and ground. A first transistor is connected between the first terminating resistor and the power source line and a second transistor is connected between the second terminating resistor and ground. The first and second transistors are turned-on or off in response to an ON signal or an OFF signal inputted from an external terminal so that the first and second resistors can be connected or disconnected to or from the bus line.
    Type: Grant
    Filed: July 27, 1994
    Date of Patent: September 3, 1996
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Takao Miyagawa, Akinori Kashio, Ken Hashimoto, Makoto Yasuda, Hidenobu Sakai, William C. Kutsche