Abstract: A multi-chip module has semiconductor devices and a wiring substrate for mounting the semiconductor devices, in which the wiring substrate comprises a glass substrate having holes formed by sand blasting and a wiring layer formed on the surface of the glass substrate and having wiring and an insulation layer.

Abstract: A multi-chip module including semiconductor devices and a wiring substrate for mounting the semiconductor devices in which the wiring substrate comprises a glass substrate having holes formed by sand blasting and a wiring layer formed on the surface of the glass substrate and having wiring and an insulation layer.

Abstract: A multi-chip module including semiconductor devices and a wiring substrate for mounting the semiconductor devices in which the wiring substrate comprises a glass substrate having holes formed by sand blasting and a wiring layer formed on the surface of the glass substrate and having wiring and an insulation layer.

Abstract: A multi-chip module including semiconductor devices and a wiring substrate for mounting the semiconductor devices in which the wiring substrate comprises a glass substrate having holes formed by sand blasting and a wiring layer formed on the surface of the glass substrate and having wiring and an insulation layer.

Abstract: A manufacturing method for a gas discharge type display panel makes it possible to manufacture an environmentally friendly substrate with high accuracy and yet at low cost. According to the manufacturing methods electrodes are formed on a back substrate by photolithography or printing, then a glass paste is printed to a height of approximately 10 &mgr;m-500 &mgr;m by printing. A barrier rib blanks are produced by rolling under pressure the glass paste by using a roller provided with grooves. The roller is heated in advance. The barrier rib blanks are sintered into the barrier ribs.

Abstract: A laser-machining optical apparatus designed to efficiently work an object through a large area thereof by projecting an image of a mask to the object through a laser beam having a small sectional area and a high energy density. The apparatus has a laser head for oscillating laser light for working the specimen, a mask provided in the optical path of the laser light beam between the specimen and the laser head and having a working pattern formed on its surface, an objective provided in the optical path of the laser-light beam between the mask and the specimen, a mechanism on which the mask and the specimen are placed so that an optical imaging relationship is maintained therebetween with the objective interposed therebetween, and a two-dimensional scanning device provided in the optical path of the laser light beam between the laser head and the mask to two-dimensionally scan the surface of the mask with the laser light beam from the laser head.

Abstract: A multi-channel module with a plurality of chips is mounted on a multilayer circuit board and has a simple and highly reliable structure cooling system for cooling the heat generated by the chips consuming a large amount of electric power. The cooling system uses in the horizontal direction a coolant supply pipe having straight tube sections and flexible bellows sections alternately disposed in the axial direction of the pipe. The straight tube sections of the aforesaid coolant supply pipe are brought into contact with the upper faces of the chips by a spring force so as to cool continuously the plurality of chips with the coolant flowing in one coolant supply pipe thereby providing a simply structured cooling system for chips. Such a structured cooling system enables the collective assembly of cooling parts for a plurality of chips with only a small number of parts and produces highly reliable effects thereby being able to implement the miniaturization of a main frame computer.

Abstract: A cooling device for cooling semiconductor elements by removing heat generated from the semiconductor elements such as, for example, semiconductor integrated chips in a large-sized electronic computer. The cooling device is fashioned of a composite AlN-BN sintered material having a Vickers hardness not higher than one-fifth of that of an AlN material, and an anisotropic property of thermal conductivity in a two dimensional direction is higher than that of AlN which is isotropic in thermal conductivity. The cooling device may be mass-produced while nevertheless having a high transfer performance matching the quantity of heat generated for each semiconductor element even if the composite sintered material is uniform in shape and size. The composite sintered material is formed by a mixture of a hexagonal BN powder having an average particle diameter of not less than 1 .mu.m and an AlN powder having an average particle diameter of about 2 .mu.

Abstract: The present invention relates to a method of and a device for detecting torque, and more particularly to a method of and a device for detecting torque which are suitable for use at the time of a high-velocity rotation or for detecting a very small torque. An annular or ring-like elastic member is interposed between, for instance, a drive shaft and a load shaft constituting a torque-transmitting shaft system, and is formed with slits with parts of an outer periphery thereof left unslitted to be divided in the axial direction so that the member is of a configuration easily deformable in the radial direction thereof by means of torque. A non-contact type displacement sensor is provided for measuring the deformation of the elastic member, and a marker is attached on the drive shaft to provide a positional signal for use as a sampling signal. The signal of the displacement sensor is extracted on the basis of the sampling signal to be stored and held.

Abstract: This invention is directed to a boring machine provided with a spindle supported rotatably in a spindle housing, a driving means for rotating the spindle, and a spindle feed mechanism supporting the spindle housing so that the spindle housing can be moved up and down. This boring machine includes a means for detecting the level of axial displacement of the spindle in boring motion with the detecting means not contacting the spindle, and a comparator for comparing the level of the actual axial displacement of the spindle or the thrust force applied thereto and corresponding to this displacement with a predetermined threshold level of axial displacement or a threshold level of thrust force. The spindle feed mechanism is controlled in response to the output from the comparator.

Abstract: An electron beam drilling apparatus for drilling a number of holes in a substrate by an electron beam is disclosed. The holes are drilled at a high speed by scanning the electron beam along a direction perpendicular to the direction of movement of the workpiece while the workpiece is moved at a high speed. A drilling position error due to the high speed movement of the workpiece is corrected by controlling an electron beam deflection unit and an electron beam generator.

Abstract: A method for jointing two pipes such as an aluminum pipe and a copper pipe by friction welding. The aluminum pipe is inserted into a bore of a ring made of a heat resistant material, the bore having a straight section and a tapered section continuous from the straight section. The copper pipe has a tapered end peripheral surface. The copper pipe is pressed at its tapered end, in a rotating state, against the end of the aluminum pipe so as to expand the latter. As a result, an ironing is effected on the aluminum pipe by the straight section of the bore of the ring, such that the aluminum pipe overlies the straight section of the copper pipe in close contact with the latter. Consequently, the tapered surface of the copper pipe is friction welded to corresponding portion of the aluminum pipe while the latter is being backed up by the tapered section of the bore of the ring.

Abstract: Improvements in a plastic working process for face-centered cubic metals, and titanium and zirconium having close-packed-hexagonal lattice, which process utilizes a phenomenon that the ductility of these metals is increased at sub-zero temperatures, i.e., temperatures below 0.degree. C. This process includes the steps of (i) imparting plastic flow including at least a uniaxial tensile stress field a metal at a temperature below zero, (ii) subjecting the metal to plastic flow to an extent that the strain of the metal is within the limit of uniform elongation of the metal, and then to plastic flow including at least a uniaxial tensile stress field continuously thereafter, or (iii) using frost as a lubricant for plastic working at temperatures below 0.degree. C according to either one of the foregoing steps.