Abstract: In order to obtain an optical module which has few components and is simple to assemble and miniaturize, and a method of configuring same, an integrated prism is provided with: a polarization rotating unit which is formed on the external surface of the prism and converts the polarization of first input light into third light having a polarization perpendicular to the polarization of second input light; and a polarization multiplexing unit which is formed on the inner surface of the prism and multiplexes the polarizations of the second and third light to output fourth light including the second and third light.

Abstract: In order to obtain an optical module which has few components and is simple to assemble and miniaturize, and a method of configuring same, an integrated prism is provided with: a polarization rotating unit which is formed on the external surface of the prism and converts the polarization of first input light into third light having a polarization perpendicular to the polarization of second input light; and a polarization multiplexing unit which is formed on the inner surface of the prism and multiplexes the polarizations of the second and third light to output fourth light including the second and third light.

Abstract: On the back surface of a transparent plate having a light extracting part for outputting lights to the outside, an electrode for wiring, and an electrode for an electromagnetic shield, an optical device is flip-chip mounted right under the light extracting part, an a driver IC is flip-chip mounted at a desired position with metal bumps. When currents driving the optical device flow from the driver IC according to an electric logical signal from the outside, an optical signal is emitted from the optical device, and is output to the outside through the light extracting part. The light extracting part may be provided with a light coupling material or an optical axis converter.

Abstract: An optical module outputting transmitted optical signals from a light-emitting element to an optical fiber and guiding received optical signals arriving from the same optical fiber to a light-receiving element prevents transmitted optical signals originating from the light-emitting element of a local station from coupling to the light-receiving element, devolving into noise and impeding communication. Light-emitting element and light-receiving element are arranged in a positional relationship, whereby the optical axis of light-emitting element and the normal to light-receiving surface of light-receiving element are located in a spatially divergent relationship.

Abstract: An optical module outputting transmitted optical signals from a light-emitting element to an optical fiber and guiding received optical signals arriving from the same optical fiber to a light-receiving element prevents transmitted optical signals originating from the light-emitting element of a local station from coupling to the light-receiving element, devolving into noise and impeding communication. Light-emitting element 210 and light-receiving element 202 are arranged in a positional relationship, whereby the optical axis of light-emitting element 201 and the normal to light-receiving surface 402 of light-receiving element 202 are located in a spatially divergent relationship.

Abstract: On the back surface of a transparent plate having a light extracting part 14 for outputting lights to the outside, an electrode 16 for wiring, and an electrode 17 for an electromagnetic shield, an optical device 11 is flip-chip mounted right under the light extracting part 14, an a driver IC 12 is flip-chip mounted at a desired position with metal bumps 15. When currents driving the optical device 11 flow from the driver IC 12 according to an electric logical signal from the outside, an optical signal is emitted from the optical device 11, and is output to the outside through the light extracting part 14. The light extracting part 14 may be provided with a light coupling material or an optical axis converter.

Abstract: A semiconductor device comprises: an insulating flexible film capable of changing its profile; first and second conductive layers provided on both surfaces of the flexible film and constituting wiring patterns; an LSI mounted on the first conductive layer; a conductor provided in a hole formed in the flexible film and making connection between the wiring pattern formed in the first conductive layer and the wiring pattern formed in the second wiring pattern; a stiffener; and a heat spreader. A part of the wiring pattern constituted by each of the first conductive layer and the second wiring pattern is a conductive wiring, whose characteristic impedance is previously calculated, for a high-speed signal and a connection portion for making connection to a mother board is provided on an end of the conductive wiring for a high-speed signal.

Abstract: A semiconductor device comprises: an insulating flexible film capable of changing its profile; first and second conductive layers provided on both surfaces of the flexible film and constituting wiring patterns; an LSI mounted on the first conductive layer; a conductor provided in a hole formed in the flexible film and making connection between the wiring pattern formed in the first conductive layer and the wiring pattern formed in the second wiring pattern; a stiffener; and a heat spreader. A part of the wiring pattern constituted by each of the first conductive layer and the second wiring pattern is a conductive wiring, whose characteristic impedance is previously calculated, for a high-speed signal and a connection portion for making connection to a mother board is provided on an end of the conductive wiring for a high-speed signal.