Abstract: A network which simplifies structure, realizes autonomous automation, digitalizes data, and effectively uses data is disclosed. A measuring card for measuring voltage and current according to values detected by the state detector that detects voltage and current of the system. A protection card performs a protective arithmetical operation according to values detected by the state detector and outputting a protection command to a controller. A control card performs a protective arithmetical operation according to values detected by the state detector and outputting a control command to a controller are integrated within an on-site cubicle. The protection card, measuring card, and control card are connected to the substation monitoring and controlling device via a serial bus which is shared by those cards, and data is sent and received between those cards and the monitoring and controlling device via the serial bus.

Abstract: An epoxy resin composition for encapsulation of semiconductors which contains substantially no halogen-based flame retarding agents or antimony compounds having properties of moldability, flame retardance, high-temperature storage characteristics, reliability for moisture resistance, and solder cracking resistance. The epoxy resin composition for encapsulating semiconductors contains (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, (D) an inorganic filler and (E) a phosphazene compound as essential components, the total weight of phosphate ion and phosphite ion contained in the phosphazene compound being not more than 500 ppm. Further, the epoxy resin composition may optionally contain a flame-retarding assistant or an ion scavenger.

Abstract: The structure, provides autonomous automation, digitalize data, and effective use data by utilizing a network. A measuring card for measuring voltage and current according to values detected by the state detector that detects voltage and current of the system, a protection card for performing a protective arithmetical operation according to values detected by the state detector and outputting a protection command to a controller, and a control card for performing a protective arithmetical operation according to values detected by the state detector and outputting a control command to a controller are integrated within an on-site cubicle, wherein the protection card, measuring card, and control card are connected to the substation monitoring and controlling device via a serial bus which is shared by those cards, and data is sent and received between those cards and the monitoring and controlling device via the serial bus.

Abstract: To simplify the structure, realize autonomous automation, digitalize data, and effectively use data by utilizing a network. A measuring card for measuring voltage and current according to values detected by the state detector that detects voltage and current of the system, a protection card for performing a protective arithmetical operation according to values detected by the state detector and outputting a protection command to a controller, and a control card for performing a protective arithmetical operation according to values detected by the state detector and outputting a control command to a controller are integrated within an on-site cubicle, wherein the protection card, measuring card, and control card are connected to the substation monitoring and controlling device via a serial bus which is shared by those cards, and data is sent and received between those cards and the monitoring and controlling device via the serial bus.

Abstract: The present invention provides an epoxy resin composition for encapsulation of semiconductors which contains substantially neither halogen-based flame retarding agents nor antimony compounds and is excellent in moldability, flame retardance, high-temperature storage characteristics, reliability for moisture resistance, and solder cracking resistance. That is, the present invention is an epoxy resin composition for encapsulating semiconductors which contains (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, (D) an inorganic filler and (E) a phosphazene compound as essential components, the total weight of phosphate ion and phosphite ion contained in the phosphazene compound being not more than 500 ppm. Further, the epoxy resin composition may optionally contain a flame-retarding assistant or an ion scavenger.

Abstract: To simplify the structure, realize autonomous automation, digitalize data, and effectively use data by utilizing a network. A measuring card for measuring voltage and current according to values detected by the state detector that detects voltage and current of the system, a protection card for performing a protective arithmetical operation according to values detected by the state detector and outputting a protection command to a controller, and a control card for performing a protective arithmetical operation according to values detected by the state detector and outputting a control command to a controller are integrated within an on-site cubicle, wherein the protection card, measuring card, and control card are connected to the substation monitoring and controlling device via a serial bus which is shared by those cards, and data is sent and received between those cards and the monitoring and controlling device via the serial bus.

Abstract: A method of manufacturing a noise-cut filter having distributed inductances and distributed capacitances is produced wherein conductive spiral coil patterns are formed on the opposite surfaces of a dielectric sheet, such that the spiral coil patterns are aligned with each other in a direction perpendicular to the plane of the dielectric sheet, and a main circuit pattern is constructed by bonding a main circuit conductor to the spiral coil pattern formed on one of the opposite surfaces of the dielectric sheet. The main circuit conductor is formed by stamping with a punch press so that the conductor has a cross sectional area large enough to allow the passage of current of a main circuit, and has substantially the same shape as the spiral coil pattern.

Abstract: A method of manufacturing a printing head which can prevent ink, diluent, and a mixed solution thereof from adhering to and spreading about a portion of the print head around the nozzle is disclosed. The method comprises forming a hydrophobic film on a surface of a nozzle member, forming a first nozzle into which a discharge medium is introduced, and a second nozzle into which a metering medium is introduced, in the nozzle member. The first nozzle has a first orifice on the surface, and the second nozzle has a second orifice also on the surface. The first and second orifices are located so as to ooze the metering medium from the second orifice to the first orifice through the surface. An additional step of removing the hydrophobic film from a portion of the surface between the first and second orifices to define a groove is included.

Abstract: A printing apparatus having a printing head that prevents ink, diluent, and a mixed solution thereof from adhering to and spreading about a portion of the printing head around a nozzle. The printing apparatus has an enhanced ability to reproduce a gradation of concentration, thereby making it possible to form a recorded image of high resolution. The printing head has a first nozzle, which discharges a discharge medium, and a second nozzle, which discharges a metering medium. The orifices of the first and second nozzles are adjacent to each other in a nozzle outlet face of the printing head. A groove, a hydrophilic portion, or an insular projection is formed between the first and second nozzles to control the spread of ink, diluent, and a mixed solution thereof around the nozzles. The hydrophilic portion may be made by a non-processed portion of the outlet face of the printing head, and a portion other than the nonprocessed portion may be made a hydrophobic portion.

Abstract: A printer apparatus having a print head which has a first pressure chamber into which a discharge medium is introduced, a second pressure chamber into which a feed medium is introduced, and at least one set of nozzles comprised of a first nozzle communicated with the first pressure chamber and a second nozzle communicated with the second pressure chamber arranged adjacent to each other and which mixes and discharges the discharge medium and the feed medium from the nozzles, wherein a liquid repellent treatment is applied to at least one of the portion between the mutually adjoining first nozzle and second nozzle and a portion between the sets of nozzles adjoining each other on a nozzle opening face of the print head; wherein a projecting portion is formed on at least one of the portion between the mutually adjoining first nozzle and second nozzle and the portion between the sets of nozzles adjoining each other on the nozzle opening face of the print head; or wherein a recessed portion is formed between the mu

Abstract: A noise-cut filter having distributed inductances and distributed capacitances is provided wherein conductive spiral coil patterns are formed on the opposite surfaces of a dielectric sheet, such that the spiral coil patterns are aligned with each other in a direction perpendicular to the plane of the dielectric sheet, and a main circuit pattern is constructed by bonding a main circuit conductor to the spiral coil pattern formed on one of the opposite surfaces of the dielectric sheet. The main circuit conductor is formed by stamping with a punch press so that the conductor has a cross sectional area large enough to allow the passage of current of a main circuit, and has substantially the same shape as the spiral coil pattern.

Abstract: In a driving method including a print head, it is possible to form surely dot of accurate concentration and to execute certain mixing and discharge actuation.

Abstract: An output voltage control apparatus for performing feedback control on an output voltage of an inverter which drives an AC machine. The output voltage control apparatus converts a command value for the output voltage of the inverter into a pulse density using a converter (PDM), and converts a detection value of the output voltage of the inverter into a pulse density using a .DELTA.-.SIGMA. modulation converter. The proportional control ability and integral control ability for the output voltage are realized by digital hardware including an up-counter, a down-counter and a shift circuit.

Abstract: When an induction motor is variable-speed-controlled via an electric power converting circuit, the magnetic flux of the induction motor is modulated by adding an alternating current signal to, for example, a magnetizing current command. For example, the component depending on the slip frequency of the induction motor is extracted by an extracting means from at least one of the amounts of changes of the voltage, the electric current, and the magnetic flux, which are caused by the modulation of the magnetic flux. The amount of the voltage or the electric current supplied to the motor, etc. is controlled based on the extracted component via an adjusting unit and a control means, thereby implementing superior control of the induction motor.

Abstract: A noise-cut filter device for a power converter, including at least one noise-cut filter, for filtering switching noise occurring upon a switching operation of a semiconductor switching device of the power converter is disclosed. In this filter device, the noise-cut filter includes first and second planar conductors, and a dielectric sheet having upper and lower surfaces on which the first and second conductors are disposed to face each other through the dielectric sheet. The first and second planar conductors cooperate with the dielectric sheet to form a circuit having both functions of an inductor and a condenser. The current of a main circuit of the power converter flows through the opposite ends of the first planar conductor, while the current based on the switching noise, which flows from the first conductor to the second conductor, is led to ground by the second conductor.

Abstract: An AC-DC converter includes an adjusting unit 13 which operates to zero the difference between a DC output voltage instruction value and a DC output voltage detection value; and a modulator 16 which compares a carrier wave based on an output signal of the adjusting unit 13 with a modulating wave to output drive pulses, a switching element 3 is turned on and off with the drive pulses to provide a DC output voltage which is higher than a full-wave rectification voltage of an AC input voltage. In order to obtain the carrier wave, the AC-DC comprises further includes an AC input voltage polarity detector 7, a PLL circuit 11, and a multiplier 14 for multiplying the sine wave by an output signal of the adjusting unit 13.

Abstract: Disclosed is an epoxy resin composition for sealing semiconductors which comprises as essential components: (A) an epoxy resin containing a biphenyl type epoxy resin represented by the following formula (1) in an amount of 30-100% by weight on the basis of the total amount of the epoxy resin, ##STR1## wherein R.sub.1 -R.sub.8 are the same or different atoms or groups selected from hydrogen, halogens and alkyl groups, (B) a hardener containing a phenolic resin hardener represented by the following formula (2a) or a naphthol resin hardener represented by the following formula (2b) in an amount of 30-100% by weight on the basis of the total amount of the hardener, ##STR2## wherein R.sub.1 -R.sub.8 are the same or different atoms or groups selected from hydrogen, halogens and alkyl groups, R.sub.

Abstract: Disclosed is a porous sepiolite having an improved water-resistance and thermal shock resistance obtained by grinding, moisture-conditioning and molding sepiolite, and then calcining said molded sepiolite at a temperature in the range of about 650.degree. C. to about 800.degree. C. Also disclosed is a porous sepiolite having a large specific surface area, wherein the pores having a pore diameter of 50 angstroms or less have a specific surface area in the range of from 40 to 200 m.sup.2 /g and in which no less than 20% of the total surface of the sepiolite is occupied with the pores having a pore diameter of 50 angstroms or less and wherein the pore distribution curve of the sepiolite has a main peak at a pore diameter of no more than 50 angstroms. This sepiolite is obtained by grinding, moisture-conditioning and molding sepiolite, calcining the same at a temperature in the range of about 650.degree. to about 800.degree. C., and then subjecting said calcined sepiolite to an acid treatment.

Abstract: Disclosed is a porous sepiolite having an improved water-resistance and thermal shock resistance obtained by grinding, moisture-conditioning and molding sepiolite, and then calcining said molded sepiolite at a temperature in the range of about 650.degree. C. to about 800.degree. C. Also disclosed is a porous sepiolite having a large specific surface area, wherein the pores having a pore diameter of 50 angstroms or less have a specific surface area in the range of from 40 to 200 m.sup.2 /g and in which no less than 20% of the total surface of the sepiolite is occupied with the pores having a pore diameter of 50 angstroms or less and wherein the pore distribution curve of the sepiolite has a main peak at a pore diameter of no more than 50 angstroms. This sepiolite is obtained by grinding, moisture-conditioning and molding sepiolite, calcining the same at a temperature in the range of about 650.degree. to about 800.degree. C., and then subjecting said calcined sepiolite to an acid treatment.

Abstract: Disclosed is a porous sepiolite having an improved water-resistance and thermal shock resistance obtained by grinding, moisture-conditioning and molding sepiolite, and then calcining said molded sepiolite at a temperature in the range of about 650.degree. C. to about 800.degree. C. Also disclosed is a porous sepiolite having a large specific surface area, wherein the pores having a pore diameter of 50 angstroms or less have a specific surface area in the range of from 40 to 200 m.sup.2 /g and in which no less than 20% of the total surface of the sepiolite is occupied with the pores having a pore diameter of 50 angstroms or less and wherein the pore distribution curve of the sepiolite has a main peak at a pore diameter of no more than 50 angstroms. This sepiolite is obtained by grinding, moisture-conditioning and molding sepiolite, calcining the same at a temperature in the range of about 650.degree. to about 800.degree. C., and then subjecting said calcined sepiolite to an acid treatment.