Patents by Inventor Takashi Butsuda

Takashi Butsuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5928754
    Abstract: A floor material which generates no harmful gas such as hydrogen chloride at the time of a fire, is suitable for dry maintenance with a high speed buffing machine and has excellent resistances against flaws, stains, abrasion and the like, which is also a floor material having markedly excellent adhesiveness to the floor ground. This invention is characterized in that a wax is contained in an amount of from 1 to 10% by weight in at least the surface layer of the floor material in which an olefinic resin is used as the base material and an inorganic filler is blended therein. Preferably, a back side layer of an ethylene-vinyl acetate copolymer or a mixed resin of said copolymer and other olefinic resin is used as its base material having an inorganic filler is blended therein is laminated on the under side of the surface layer, and 1 to 10% by weight of rosin is included in said back side layer.
    Type: Grant
    Filed: July 22, 1996
    Date of Patent: July 27, 1999
    Assignee: Takiron Co., Ltd.
    Inventors: Michio Kondo, Takashi Butsuda, Xue Fang Song
  • Patent number: 4257834
    Abstract: A process for manufacturing a sheet having a chip-like design composed of a plurality of chips densely aligned in a plane without overlapping and a solidified binder uniformly filling the interstices among the chips and firmly and integrally bonding the chips to one another in sheet form. The sheet is useful as a floor material, wall material, and the like.
    Type: Grant
    Filed: April 5, 1979
    Date of Patent: March 24, 1981
    Assignee: Takiron Co., Ltd.
    Inventors: Kosuke Iida, Tadayuki Morikawa, Mitsuo Aoki, Isamu Ueda, Takashi Butsuda, Osami Tsuda