Patents by Inventor Takashi Daimon

Takashi Daimon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11984869
    Abstract: An acoustic wave device includes a piezoelectric body including first and second main surfaces facing each other, an IDT electrode provided on the first main surface of the piezoelectric body and including electrode fingers, a high acoustic velocity member on the second main surface side of the piezoelectric body, in which an acoustic velocity of a propagating bulk wave is higher than an acoustic velocity of an acoustic wave propagating through the piezoelectric body, and a first dielectric film provided on an upper surface of the electrode fingers, in which a portion where a dielectric is not present is provided between the electrode fingers of the IDT electrode.
    Type: Grant
    Filed: April 6, 2021
    Date of Patent: May 14, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Hideki Iwamoto, Takashi Yamane, Yasumasa Taniguchi, Katsuya Daimon
  • Patent number: 10564228
    Abstract: The magnetoresistive effect element unit includes an anisotropic magnetoresistive effect element and a conductive reset line that, as viewed in a direction orthogonal to both a magnetic sensing direction x? and an easy magnetization direction y? of the anisotropic magnetoresistive effect element, passes through a center of the anisotropic magnetoresistive effect element, extends in a direction inclined from the easy magnetization direction y? so as to form an angle of 45° or less with the easy magnetization direction y?, and is parallel to a plane including the magnetic sensing direction x? and the easy magnetization direction y?. As viewed in the direction orthogonal to both the magnetic sensing direction x? and the easy magnetization direction y?, the reset line has a width that covers an entirety of the anisotropic magnetoresistive effect element.
    Type: Grant
    Filed: January 15, 2018
    Date of Patent: February 18, 2020
    Assignee: Mitsubishi Electric Corporation
    Inventors: Tomokazu Ogomi, Kenji Shimohata, Jin Inoue, Tetsuji Imamura, Yoshinori Yamaguchi, Takashi Daimon
  • Publication number: 20190204396
    Abstract: The magnetoresistive effect element unit includes an anisotropic magnetoresistive effect element and a conductive reset line that, as viewed in a direction orthogonal to both a magnetic sensing direction x? and an easy magnetization direction y? of the anisotropic magnetoresistive effect element, passes through a center of the anisotropic magnetoresistive effect element, extends in a direction inclined from the easy magnetization direction y? so as to form an angle of 45° or less with the easy magnetization direction y?, and is parallel to a plane including the magnetic sensing direction x? and the easy magnetization direction y?. As viewed in the direction orthogonal to both the magnetic sensing direction x? and the easy magnetization direction y?, the reset line has a width that covers an entirety of the anisotropic magnetoresistive effect element.
    Type: Application
    Filed: January 15, 2018
    Publication date: July 4, 2019
    Applicant: Mitsubishi Electric Corporation
    Inventors: Tomokazu OGOMI, Kenji SHIMOHATA, Jin INOUE, Tetsuji IMAMURA, Yoshinori YAMAGUCHI, Takashi DAIMON
  • Patent number: 4983452
    Abstract: There is here provided an electroconductive thermoplastic sheet prepared by superposing, upon either surface or both the surface of a thermoplastic film, or sheet an electroconductive nonwoven fabric formed by irregularly twining an electroconductive fiber into a hot-melt adhesive fiber, further superposing, upon the outer side of the electroconductive nonwoven fabric, a nonwoven fabric made from the hot-melt adhesive fiber to obtain a laminate, and fusing the laminate integrally.The sheet of the present invention retains transparency and electroconductivity, and it is suitable for, for example, materials for packing of electronic parts and precision instruments where dust deposition and static electricity obstruction should be avoided.
    Type: Grant
    Filed: July 19, 1988
    Date of Patent: January 8, 1991
    Assignee: Chisso Corporation
    Inventors: Takashi Daimon, Hideshi Sakamoto
  • Patent number: 4939027
    Abstract: The present invention provides a thermoplastic resin sheet and its molded article for a packaging material which is heated in a microwave oven and for shielding electromagnetic waves. The above-mentioned resin sheet and molded article are characterized by generating heat when irradiated with microwaves.The present invention is directed to an electroconductive thermoplastic resin sheet which is prepared by first superposing an electroconductive nonwoven fabric mainly comprising electroconductive fibers and heat-meltable fibers upon one surface, both surfaces, or a part or all of the surface of a thermoplastic resin film as a base material layer, further superposing a thermoplastic resin film as a protective layer upon the nonwoven fabric so that they may come in contact with each other, heating and contact-bonding them at a temperature of the melting point or higher of the heat-meltable fibers.
    Type: Grant
    Filed: July 7, 1989
    Date of Patent: July 3, 1990
    Assignee: Chisso Corporation
    Inventors: Takashi Daimon, Hideshi Sakamoto, Osamu Akimoto
  • Patent number: 4929496
    Abstract: An electroconductive thermoplastic resin molded product having neither fluffing of electroconductive fibers therein nor jutting phenomenon of electroconductive fibers at the corner parts thereof is provided, which product comprises (a) an electroconductive thermoplastic resin sheet including a thermoplastic resin film; (b) a non-woven fabric or a knitted or woven fabric consisting of hot-melt-adhesive fibers and electroconductive fibers irregularly entangled with each other and applied and integrally melt-adhered to one or both surfaces of said film and then subjected to surface treatment; and (c) a coating having a curing composition composed mainly of an unsaturated resin and a reactive diluent applied to the treated surface and crosslinked and cured and having a coating thickness of 1 to 15 .mu.m; the electroconductive thermoplastic resin sheet being fixed between a pair of male and female molds at least one surface of which has a heat-resistant rubber thereat and molded.
    Type: Grant
    Filed: December 30, 1988
    Date of Patent: May 29, 1990
    Assignee: Chisso Corporation
    Inventors: Takashi Daimon, Hideshi Sakamoto, Osamu Akimoto
  • Patent number: 4891264
    Abstract: An electroconductive thermoplastic resin sheet causing no fluffing of electroconductive fibers is provided, which sheet comprisesa thermoplastic resin film;a non-woven fabric or a knitted or woven fabric consisting of hot-melt-adhesive fibers and electroconductive fibers and applied and integrally melt-adhered onto one surface or both the surfaces of the film and then subjected to surface treatment; anda coating having a curing composition composed mainly of an unsaturated resin and a reactive diluent applied onto the treated surface and crosslinked and cured and having a coating thickness of 1 to 10 .mu.m.
    Type: Grant
    Filed: December 15, 1988
    Date of Patent: January 2, 1990
    Assignee: Chisso Corporation
    Inventors: Takashi Daimon, Hideshi Sakamoto, Osamu Akimoto
  • Patent number: 4857377
    Abstract: There is here provided a flocked product having a warm and soft appearance and a thick and tender feel which is obtained by flocking the surface of a nonwoven, woven or knitted fabric.
    Type: Grant
    Filed: February 22, 1988
    Date of Patent: August 15, 1989
    Assignee: Chisso Corporation
    Inventors: Takashi Daimon, Hideshi Sakamoto, Tatsuya Adachi
  • Patent number: 4752526
    Abstract: A metal-polypropylene laminate composite comprising a polypropylene sheet made of a blend of a modified polypropylene prepared by modifying a crystalline polypropylene with an unsaturated carboxylic acid or its derivatives or a crystalline polypropylene containing such a modified polypropylene, with 15 to 50 wt. % of waste paper, organic fibers or wood pulp and metal plates superposed on and bonded by hot forming to both the surfaces of said polypropylene sheet is provided.It is of light weight and useful in acoustically sound absorption, vibration damping and heat insulation purpose.
    Type: Grant
    Filed: March 12, 1987
    Date of Patent: June 21, 1988
    Assignee: Chisso Corporation
    Inventors: Takashi Daimon, Hideshi Sakamoto, Tatsuya Adachi