Patents by Inventor Takashi Endou

Takashi Endou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240096533
    Abstract: The coil component includes a coil, a first core having a first magnetic permeability, and a second core having a second magnetic permeability lower than the first magnetic permeability. The first core and the second core form a magnetic path. The coil forms two or more winding windows. The first core contacts with an entirety of one side line extending in a second direction of each of the winding windows, and protrudes from both ends of one side line of at least one of the winding windows. The second core contacts with three side lines other than the one side line of each of the winding windows. A surface resistance of the first core between two points that are 20 mm away from each other is not less than 5 ? after a high-temperature storage test. A drive frequency of the coil component is not less than 20 kHz.
    Type: Application
    Filed: February 17, 2021
    Publication date: March 21, 2024
    Applicant: Mitsubishi Electric Corporation
    Inventors: Mao KAWAMURA, Hayato TANABE, Naohisa UEHARA, Takashi SOBASHIMA, Keisuke AKAKI, Takuya ENDOU, Yuki ABE, Masahiro KONDO, Norimitsu HOSHI
  • Publication number: 20100091372
    Abstract: To provide a miniaturized Fabry-Perot type tunable filter that can be applied to e.g. a light of wide wavelength range from infrared rays to ultraviolet rays and actuated at a low voltage. A movable portion moving in a direction parallel to the surface of the SOI substrate (hereafter called ‘plane direction’), a suspension supporting member supporting the movable portion elastically and movably, and a fixed portion secured to the SOI substrate are provided. By the comb-teeth electrode of the comb-teeth type electrostatic actuator that moves the movable portion, the first mirror structure body formed bonding to the surface of the movable portion is controlled and moved in the plane direction.
    Type: Application
    Filed: April 1, 2008
    Publication date: April 15, 2010
    Applicants: YAMAICHI ELECTRONICS CO., LTD., KOSHIN KOGAKU CO., LTD.
    Inventors: Toshio Yamanoi, Takashi Endou
  • Patent number: 5273950
    Abstract: The reversible heat-sensitive recording medium having a heat-sensitive recording layer capable of reversibly changing the transparency thereof with organic low molecular substances dispersed in an organic macromolecular resin provided on a support is characterized by using at least one long chain alkyl-containing compound having a melting point of 50.degree.-100.degree. C. and at least one saturated aliphatic bisamide having a melting point of not less than 110.degree. C. as the organic low molecular substance in a ratio of 98:2 to 80:20. A plasticizer may be contained in the organic macromolecular resin in a ratio of 1 to 10% by weight, based on the total solid of the heat-sensitive recording layer.
    Type: Grant
    Filed: April 14, 1993
    Date of Patent: December 28, 1993
    Assignee: Tomoegawa Paper Co., Ltd.
    Inventors: Kazuhiko Fukaya, Takashi Endou, Kensaku Higashi, Chikara Murata
  • Patent number: 4947095
    Abstract: Expert knowledge regarding investigation of the causes of various failures, and knowledge for extracting DI/DO information (IOD), which is exchanged by an NC unit (11) and a machine tool (13), as well as information (ITD) internally of the NC unit, is stored in a knowledge base (IB). When the contents of a failure are entered from an alarm detector (11g) upon occurrence of the failure, a reasoning mechanism (ADPR) uses the expert knowledge conforming to the failure to automatically extract the DI/DO information and information internally of the NC unit (IOD, ITB), ascertains actually occurring phenomena based on this information, recognizes the cause of the failure from these pheonomena, and displays the cause of the failure and a method of dealing with it.
    Type: Grant
    Filed: May 17, 1989
    Date of Patent: August 7, 1990
    Assignee: Fanuc Ltd
    Inventors: Hideaki Kawamura, Takao Sasaki, Takashi Endou