Abstract: A tire includes a tread portion including four circumferential grooves between outboard and inboard tread edges, and five land portions divided by the circumferential grooves. The circumferential grooves include an inboard shoulder circumferential groove located nearest to the inboard tread edge in the circumferential grooves. The land portions include an inboard shoulder land portion disposed axially outward of the inboard shoulder circumferential groove and having a ground contact surface with the smallest axial width in the land portions. The inboard shoulder land portion is provided with inboard shoulder lateral grooves and inboard shoulder sipes. The inboard shoulder lateral grooves include inner ends away from the inboard shoulder circumferential groove. The inboard shoulder lateral grooves extend axially outward from the inner ends to a location beyond the inboard tread edge. The inboard shoulder sipes extends from the inboard shoulder circumferential groove to a location beyond the inboard tread edge.

Abstract: A tire includes a tread portion. The tread portion has a main groove extending continuously in a tire circumferential direction, and a land portion adjacent to the main groove. The land portion has lateral grooves extending from the main groove in a tire axial direction. Each of the lateral grooves has a first portion communicating with the main groove, and a second portion connected to the first portion. The first portion has a larger groove width than the second portion and has a smaller groove depth than the second portion.

Abstract: A tire includes a tread portion including four circumferential grooves between outboard and inboard tread edges, and five land portions divided by the circumferential grooves. The circumferential grooves include an inboard shoulder circumferential groove located nearest to the inboard tread edge in the circumferential grooves. The land portions include an inboard shoulder land portion disposed axially outward of the inboard shoulder circumferential groove and having a ground contact surface with the smallest axial width in the land portions. The inboard shoulder land portion is provided with inboard shoulder lateral grooves and inboard shoulder sipes. The inboard shoulder lateral grooves include inner ends away from the inboard shoulder circumferential groove. The inboard shoulder lateral grooves extend axially outward from the inner ends to a location beyond the inboard tread edge. The inboard shoulder sipes extends from the inboard shoulder circumferential groove to a location beyond the inboard tread edge.

Abstract: A tire for which a mounting direction to a vehicle is specified, has a tread portion axially divided into five land portions each provided with sipes. The five land portions are a first shoulder land portion, a first middle land portion, a crown land portion, a second middle land portion, and a second shoulder land portion having ground contacting surface widths W1s, W1m, Wc, W2m and W2s, respectively, which satisfy the following condition: W1s>W1m>Wc>W2m=>W2s under a 50% load state of the tire.

Abstract: A tire includes a tread portion. The tread portion has a main groove extending continuously in a tire circumferential direction, and a land portion adjacent to the main groove. The land portion has lateral grooves extending from the main groove in a tire axial direction. Each of the lateral grooves has a first portion communicating with the main groove, and a second portion connected to the first portion. The first portion has a larger groove width than the second portion and has a smaller groove depth than the second portion.

Abstract: A semiconductor module and a producing method thereof are disclosed. The semiconductor module has a cooling chamber storing a heat-conductive material which is contracted by solidification, semiconductor chips mounted on the lower surface of a substrate and dipped in the heat-conductive material, and a substrate frame, mounted on the cooling chamber, for holding the substrate. A small gap having a width h.sub.1 is formed between the semiconductor chips and the solidified heat-conductive material surface due to contraction of the heat-conductive material by cooling and solidification and, thereafter, the semiconductor module is assembled to have a spacer having a thickness t interposed between the cooling chamber and the substrate frame, thereby forming a gap having a size of h.sub.1 +t between the semiconductor chips and the heat-conductive material.The gap h can be reduced, thus reducing a heat resistance.

Abstract: Cooling equipment for use in electronic systems of type having a substrate with a plurality of heat-generating electronic components mounted thereon is disclosed. A hat assembly is provided having a plurality of cavities in which pistons can be slidably mounted. The hat assembly is placed adjacent to the substrate such that the pistons are next to the components. The pistons are then adjusted and fixed in the hat assembly so that a desired gap is maintained between the pistons and the components. A cooling plate is attached to the assembly.

Abstract: Cooling equipment for use in electronic systems of type having a substrate with a plurality of heat-generating electronic components mounted thereon is disclosed. A hat assembly is provided having a plurality of cavities in which pistons can be slidably mounted. The hat assembly is placed adjacent to the substrate such that the pistons are next to the components. The pistons are then adjusted and fixed in the hat assembly so that a desired gap is maintained between the pistons and the components. A cooling plate is attached to the assembly.