Patents by Inventor Takashi Higo

Takashi Higo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8064212
    Abstract: In a hybrid integrated circuit device that uses a metal substrate, a sound noise is prevented, which would otherwise be generated due to transmission, to the metal substrate, of vibration caused when a ceramic capacitor expands and contracts by switching ON and OFF a transistor. For improving a heat dissipation effect, a switching transistor driven by a driving pulse and a ceramic capacitor connected to the switching transistor are incorporated on a conductive path on an insulated metal substrate. Both ends of the ceramic capacitor are fixed to the conductive path by solders which are covered with a hard resin to be protected from a solder crack by thermal expansion of the metal substrate. The ceramic capacitor and the hard resin are wholly covered with a soft resin which absorbs noise due to expansion caused when the ceramic capacitor is switched, so that the metal substrate is prevented from resonating.
    Type: Grant
    Filed: September 19, 2008
    Date of Patent: November 22, 2011
    Inventors: Masami Motegi, Masashi Terauchi, Takashi Higo
  • Publication number: 20090086457
    Abstract: In a hybrid integrated circuit device that uses a metal substrate, a sound noise is prevented, which would otherwise be generated due to transmission, to the metal substrate, of vibration caused when a ceramic capacitor expands and contracts by switching ON and OFF a transistor. For improving a heat dissipation effect, a switching transistor driven by a driving pulse and a ceramic capacitor connected to the switching transistor are incorporated on a conductive path on an insulated metal substrate. Both ends of the ceramic capacitor are fixed to the conductive path by solders which are covered with a hard resin to be protected from a solder crack by thermal expansion of the metal substrate. The ceramic capacitor and the hard resin are wholly covered with a soft resin which absorbs noise due to expansion caused when the ceramic capacitor is switched, so that the metal substrate is prevented from resonating.
    Type: Application
    Filed: September 19, 2008
    Publication date: April 2, 2009
    Applicants: Sanyo Electric Co., Ltd., Sanyo Semiconductor Co., Ltd.
    Inventors: Masami Motegi, Masashi Terauchi, Takashi Higo
  • Patent number: 5589491
    Abstract: An injection solution comprising a 2-[(2-pyridyl)methylsulfinyl]-benzimidazole compound or a salt thereof having antiulcer activity and an aqueous solvent added with no nonaqueous solvent is disclosed wherein the pH is not less than 9.5 and not more than 11.5.
    Type: Grant
    Filed: January 18, 1995
    Date of Patent: December 31, 1996
    Assignee: Astra Aktiebolag
    Inventors: Shigeo Nakanishi, Tetsuo Tominaga, Iwao Yamanaka, Takashi Higo, Toshiyuki Shibata