Abstract: A cap comprising a cap body including a top plate portion which is disk-shaped, and a skirt portion which is cylindrical and provided at a peripheral edge portion of the top plate portion, the top plate portion including a substrate and a resin coating film provided on a cap inner surface side of the substrate, the resin coating film including a polyester-based resin and a lubricant, and a sealing member provided in the cap body separately from the cap body so as to face the top plate portion, and having an outer diameter smaller than an inner diameter of the skirt portion.

Abstract: A carrier tape has a plurality of rows.times.a plurality of columns of IC device holes and two pairs of sprocket holes. A plurality of finger leads extending into each IC device hole and a conductive lead for connecting all of the finger leads are formed on the carrier tape. While the carrier tape is conveyed with feed teeth of a sprocket being meshed with one pair of sprocket holes, the finger leads and the conductive leads are formed, and solder is plating on both of the leads. Only in a bonding step, the carrier tape is conveyed with the feed teeth of the sprocket being meshed with the other pair of sprocket holes. Since the sprocket holes used in the bonding step are not deformed, highly precise positioning of IC devices required in bonding can be efficiently achieved.

Abstract: A carrier tape has a plurality of rows.times.a plurality of columns of IC device holes and two pairs of sprocket holes. A plurality of finger leads extending into each IC device hole and a conductive lead for connecting all of the finger leads are formed on the carrier tape. While the carrier tape is conveyed with feed teeth of a sprocket being meshed with one pair of sprocket holes, the finger leads and the conductive leads are formed, and solder is plating on both of the leads. Only in a bonding step, the carrier tape is conveyed with the feed teeth of the sprocket being meshed with the other pair of sprocket holes. Since the sprocket holes used in the bonding step are not deformed, highly precise positioning of IC devices required in bonding can be efficiently achieved.

Abstract: A liquid detergent composition comprising 0.5 to 30% by weight of at least one alkanolamine represented by the following general formula (1):(C.sub.n H.sub.2n OH).sub.m NH.sub.3-m (1)wherein n is an integer of from 1 to 3 and m is an integer of from 1 to 3,0.5 to 30% by weight of a polyoxyalkylene mono- or di-lower alkyl ether represented by the following general formula (2):RO(C.sub.2 H.sub.4 O).sub.x (C.sub.3 H.sub.6 O).sub.y R' (2)wherein R and R' stand for a hydrogen atom, a methyl group or an ethyl group, with the proviso that the case where both of R and R' are hydrogen atoms is excluded, the mean value of (x+y) is from 3.0 to 10.0 and the relation of 0.0.ltoreq..times..ltoreq.0.25y is established,and 0.1 to 20% by weight of at least one surface active agent.

Abstract: A soap for a scouring pad comprising a partially neutralized alkali metal salt of a fatty acid, said fatty acid having an average carbon atom number of 16 to 20 and an iodine value of 30 to 45, the degree of neutralization of the fatty acid with the alkali metal being from 85 to 98% by weight.

Abstract: A scouring pad comprising a fine metal wire pad and a detergent adhered thereto, wherein the detergent comprises a salt of an ester of phosphoric acid having the formula (I):[R(OCH.sub.2 CH.sub.2).sub.m ].sub.x PO.sub.4 H.sub.3-x-y M.sub.y (I)wherein R is alkyl or alkenyl having 10 to 22 carbon atoms or alkylphenyl having 6 to 18 carbon atoms in the alkyl group, wherein said alkyl or alkenyl can be linear or branched, m is from 0 to 10, x is from 1.0 to 2.0, and y is from 0.5 to 2.0, with the proviso that the sum of x and y does not exceed 3, and M is an alkali metal, ammonium, alkanolamine, alkaline earth metal, zinc or aluminum cation, and a fatty acid soap having 10 to 22 carbon atoms.