Abstract: In a method of reducing corrosion of a material constituting a nuclear reactor structure, an electrochemical corrosion potential is controlled by injecting a solution or a suspension containing a substance generating an excitation current by an action of at least one of radiation, light, and heat existing in a nuclear reactor, or a metal or a metallic compound forming the substance generating the excitation current under the condition in the nuclear reactor to allow the substance generating the excitation current to adhere to the surface of the nuclear reactor structural material, and by injecting hydrogen in cooling water of the nuclear reactor while controlling the hydrogen concentration in a feed water.

Abstract: Disclosed is a film for forming a semiconductor protection film, which protects a surface of a semiconductor element that is mounted on a structure such as a substrate and is located on the outermost side, the surface being on the reverse side of the surface at which the semiconductor element is mounted on the structure, and the resin composition constituting the film for forming a semiconductor protection film contains (A) a thermosetting component and (B) an inorganic filler.

Abstract: The present invention relates to an adhesive tape for electrically connecting semiconductor chips in a chip-on-chip type semiconductor device. The adhesive tape comprising: (A) 10 to 50 wt % of film forming resin; (B) 30 to 80 wt % of curable resin; and (C) 1 to 20 wt % of curing agent having flux activity.

Abstract: In a method of reducing corrosion of a material constituting a nuclear reactor structure, an electrochemical corrosion potential is controlled by injecting a solution or a suspension containing a substance generating an excitation current by an action of at least one of radiation, light, and heat existing in a nuclear reactor, or a metal or a metallic compound forming the substance generating the excitation current under the condition in the nuclear reactor to allow the substance generating the excitation current to adhere to the surface of the nuclear reactor structural material, and by injecting hydrogen in cooling water of the nuclear reactor while controlling the hydrogen concentration in a feed water.

Abstract: In a method of reducing corrosion of a material constituting a nuclear reactor structure, an electrochemical corrosion potential is controlled by injecting a solution or a suspension containing a substance generating an excitation current by an action of at least one of radiation, light, and heat existing in a nuclear reactor, or a metal or a metallic compound forming the substance generating the excitation current under the condition in the nuclear reactor to allow the substance generating the excitation current to adhere to the surface of the nuclear reactor structural material, and by injecting hydrogen in cooling water of the nuclear reactor while controlling the hydrogen concentration in a feed water.

Abstract: A DHCP server 8 dispenses an IP address in response to a request from a terminal equipment 1. An authentication server 3 receives an authentication frame transmitted from the terminal equipment 1 using the dispensed IP address as a sender address and authenticates the terminal equipment 1. Upon completion of authentication, the authentication server 3 informs a registration information database 22 of an authentication hub 2 of communication permission for the terminal equipment 1. In the authentication hub 2, a frame receiving circuit 21 receives a transmission frame transmitted from the terminal equipment 1. The authentication hub 2 refers to the registration information database 22 on the basis of sender information of the transmission frame, determines transmission, rewriting-and-transmission, or discarding for the frame, and sends the transmission frame to a transmission buffer 23 if transmission or rewriting-and-transmission is permitted for the frame.

Abstract: A steel tie rod end includes a shaft portion and first and second fitting portions. A minimum area portion having a small radially cross-sectional area is provided for the shaft portion, and 90% or above of a steel structure of the minimum area portion is formed of martensite or tempered martensite. The surface hardness of the minimum area portion and the average hardness of the radial cross section of the minimum area portion are 600 Hv or below, and the average hardness of the radial cross section of the first fitting portion and the average hardness of the radial cross section of the second fitting portion are 300 Hv or below. A method of manufacturing a steel tie rod end includes a quenching process of heating only a prospective shaft portion by high frequency to an austenitizing temperature and then rapidly cooling the prospective shaft portion by water or cooling medium.

Abstract: A film for semiconductor includes a support film, a second adhesive layer, a first adhesive layer and a bonding layer which are laminated together in this order. This film for semiconductor is configured so that it supports a semiconductor wafer laminated on the bonding layer thereof when the semiconductor wafer is diced and the bonding layer is selectively peeled off from the first adhesive layer when a chip is picked up. This film for semiconductor is characterized in that in the case where peel strength at 23° C. of the chip is defined as “F23 (cN/25 mm)” and peel strength at 60° C. of the chip is defined as “F60 (cN/25 mm)”, F23 is in the range of 10 to 80 and F60/F23 is in the range of 0.3 to 5.5. This makes it possible to improve a pickup property of the chip, to thereby prevent generation of defects in a semiconductor element.

Abstract: A sign recognition device includes a sign effective range data recording unit for prestoring effective range conditions shown by a sign and an auxiliary sign, a sign recognition unit for recognizing a sign and an auxiliary sign by using a captured image of a roadway in front of a vehicle, a vehicle information acquiring unit for acquiring vehicle information, a map information acquiring unit for acquiring map information about a map of an area surrounding the vehicle, and a sign effective range determining unit for determining whether or not the vehicle is staying in the effective range specified with the sign and the auxiliary sign which have been recognized by the sign recognition unit by using the effective range conditions stored in the sign effective range data recording unit, the vehicle information, and the map information.

Abstract: A film for semiconductor includes a support film, a second adhesive layer, a first adhesive layer and a bonding layer which are laminated together in this order. This film for semiconductor is configured so that it supports a semiconductor wafer laminated on the bonding layer thereof when the semiconductor wafer is diced and the bonding layer is selectively peeled off from the first adhesive layer when the semiconductor elements obtained by the dicing are picked up. This film for semiconductor is characterized in that an average thickness of the second adhesive layer is in the range of 20 to 100 ?m. This makes it possible to control cutting lines formed during the dicing so as to locate distal ends thereof within the first adhesive layer easily and reliably and to prevent defects which would be generated when the cutting lines come down to the support film.

Abstract: A display device and a method for manufacturing the display device are provided. The display device includes an organic layer on an auxiliary wiring is removed with high precision by one operation and, thereby, the yield and the productivity are improved. A lower electrode is formed by patterning in each pixel on a substrate. An auxiliary wiring including a light absorption layer is formed between individual pixels. An organic layer is formed on the substrate while covering the lower electrodes. Laser irradiation is conducted from the organic layer side, the laser light is converted to heat in the light absorption layer exposed at a portion under the organic layer, and the organic layer portion above the light absorption layer is removed selectively. An upper electrode is formed on the organic layer and is connected to the light absorption layer portion of the auxiliary wiring.

Abstract: A positive photosensitive resin composition includes (A) a polybenzoxazole precursor resin, (B) a photosensitive diazoquinone compound, (C) a hindered phenol antioxidant shown by the following general formula (1), and (D) a phenol compound shown by the following general formula (2). Formula (1) is: wherein R1 represents a hydrogen atom or an organic group having 1 to 4 carbon atoms, a is an integer from 1 to 3, and b is an integer from 1 to 3. Formula (2) is: wherein R2 represents a methylene group or a single bond, c is an integer from 1 to 3, and d is an integer from 1 to 3. A protective film, an interlayer insulating film, and a semiconductor device and a display element using the same are also disclosed.

Abstract: A film for semiconductor includes a support film, a second adhesive layer, a first adhesive layer and a bonding layer which are laminated together in this order. This film for semiconductor is configured so that it supports a semiconductor wafer laminated on the bonding layer thereof when the semiconductor wafer is diced and the bonding layer is selectively peeled off from the first adhesive layer when the diced semiconductor wafer (semiconductor element) is picked up. This film for semiconductor is characterized in that when the semiconductor wafer is laminated thereon and diced, and then adhesive strength of the obtained semiconductor element is measured, a ratio of “a (N/cm)” which is adhesive strength of an edge portion of the semiconductor element to “b (N/cm)” which is adhesive strength of a portion of the semiconductor element other than the edge portion thereof (that is, a/b) is in the range of 1 to 4.

Abstract: The present invention relates to a method for predicting the postoperative prognosis of a lung adenocarcinoma patient with high sensitivity and/or specificity by identifying a protein with an expression level that specifically varies in a lung adenocarcinoma patient, comprising: step (a) of determining expression levels of myosin IIA and/or vimentin in a biological sample collected from a lung adenocarcinoma patient; and step (b) of predicting or determining a prognosis based on the expression levels of myosin IIA and/or vimentin obtained as a result of determination.

Abstract: A film for use in manufacturing semiconductor devices of the present invention includes a bonding layer having a first surface and a second surface, a first adhesive layer bonding to the second surface of the bonding layer and a second adhesive layer bonding to the first adhesive layer at a side opposite to the bonding layer wherein the second adhesive layer has an outer peripheral portion extending beyond an outer peripheral edge of the first adhesive layer. Further, the film is used in dicing a semiconductor wafer in a state that the semiconductor wafer is bonded to the first surface of the bonding layer while a wafer ring is bonded to the outer peripheral portion of the second adhesive layer wherein the bonding force A1 (cN/25 mm) of the first adhesive layer to the bonding layer is smaller than the bonding force A2 (cN/25 mm) of the second adhesive layer to the wafer ring.

Abstract: A display device and a method for manufacturing the display device are provided. The display device includes an organic layer on an auxiliary wiring is removed with high precision by one operation and, thereby, the yield and the productivity are improved. A lower electrode is formed by patterning in each pixel on a substrate. An auxiliary wiring including a light absorption layer is formed between individual pixels. An organic layer is formed on the substrate while covering the lower electrodes. Laser irradiation is conducted from the organic layer side, the laser light is converted to heat in the light absorption layer exposed at a portion under the organic layer, and the organic layer portion above the light absorption layer is removed selectively. An upper electrode is formed on the organic layer and is connected to the light absorption layer portion of the auxiliary wiring.

Abstract: A copolymer composition including a copolymer having repeat units of structural formula I: where X is selected from —CH2—, —CH2—CH2— and O; m is an integer from 0 to 5; and each occurrence of R1-R4 are independently selected from H; C1 to C25 linear, branched, and cyclic alkyl, aryl, aralkyl, alkaryl, alkenyl and alkynyl that can include one or more hetero atoms selected from O, N, and Si; a group that contains an epoxy functionality; —(CH2)nC(O)OR5; —(CH2)nC(O)OR6; —(CH2)nOR6; —(CH2)nOC(O)R6; —(CH2)nC(O)R6; —(CH2)nOC(O)OR6; and any combination of two of R1, R2, R3, and R4 linked together by a linking group. A portion of the repeat units having structural formula I contain at least one epoxy functional pendant group. The copolymer composition can be included with a material that photonically forms a catalyst in a photodefinable dielectric composition, which can be used to form a photodefinable layer on a substrate.

Abstract: According to one embodiment, a pattern inspection apparatus includes a first inspection data creation section, a first delay section, a first recognition section, a first extraction section, a first and a second level difference calculation section, a first and a second determination section, and a first logic OR calculation section. The first extraction section extracts data of a sub-resolution pattern from the first inspection data and the first delay data. The first and second level difference calculation section calculate differences between an average output level of a surrounding region for a target pixel of the extracted data from the first inspection data or the first delay data and an output level of the extracted data. The first and second determination sections determine presence or absence of a defect. The first logic OR calculation section calculates logic OR of determination results of the first and second determination sections.

Abstract: The present invention includes a dicing sheet-attached film for forming a semiconductor protection film (14), which protects a semiconductor element (18) mounted on a base material and positioned on the outermost side. The dicing sheet-attached film for forming a semiconductor protection film (14) comprises a protection film-forming layer (12) which is composed of a resin composition and protects a surface of the semiconductor element (18) opposite to the surface of the semiconductor element (18) mounted on the base material, and a dicing sheet (13) laminated on the protection film-forming layer.

Abstract: The present invention provides a radio communication apparatus that does not need installation of multiple radio devices in a communication node and requires only a single radio device to construct a data link of any of line-of-sight communication, over-the-horizon communication and aerial-vehicle communication.